Methane

Methane

SCHEMBL345547

C.C.C.C[PH](=O)[O-].C[PH](=O)[O-].C[PH](=O)[O-].C[PH](=O)[O-].C[PH](=O)[O-].C[PH](=O)[O-].[Al+3].[Al+3]

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27040314 0.95
Methane SCHEMBL190073 0.90
Methane SCHEMBL19895694 0.90
Methane SCHEMBL191074 0.90
Methane SCHEMBL190559 0.90
Methane SCHEMBL190615 0.90
Potassium Ion SCHEMBL8020727 0.84
SCHEMBL331580 0.84
SCHEMBL31331590 0.84
SCHEMBL31331559 0.84

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 82 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220356328-A1 Polyamide Composition and the Article Thereof BASF SE (DE) 2022-11-10 US claimed
US-20260139106-A1 INSULATION FILM BASF SE (DE) 2026-05-21 US disclosed
US-12441065-B2 Formed article, welding method, and method of manufacturing formed article ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-10-14 US disclosed
EP-4512856-A1 MOLDED ARTICLE, WELDING METHOD, AND METHOD FOR PRODUCING MOLDED ARTICLE Asahi Kasei Kabushiki Kaisha (JP) 2025-02-26 EP disclosed
US-20250042095-A1 FORMED ARTICLE, WELDING METHOD, AND METHOD OF MANUFACTURING FORMED ARTICLE ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-02-06 US disclosed
US-12037492-B2 Halogen free, flameproof, compatibilized polyamide and polyphenylene ether blend TEKNOR APEX COMPANY (US) 2024-07-16 US disclosed
US-20240158633-A1 POLYAMIDE RESIN COMPOSITION AND POLYAMIDE MOLDED BODY MITSUI CHEMICALS, INC. (JP) 2024-05-16 US disclosed
US-20240141165-A1 POLYAMIDE RESIN COMPOSITION AND POLYAMIDE MOLDED ARTICLE MITSUI CHEMICALS, INC. (JP) 2024-05-02 US disclosed
EP-4355828-A1 HALOGEN FREE, FLAMEPROOF, COMPATIBILIZED POLYAMIDE AND POLYPHENYLENE ETHER BLEND Teknor Apex Company (US) 2024-04-24 EP disclosed
EP-4317253-A1 POLYAMIDE RESIN COMPOSITION AND POLYAMIDE MOLDED BODY Mitsui Chemicals, Inc. (JP) 2024-02-07 EP disclosed
US-20090312468-A1 FLAME RETARDANT POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2009-12-17 US disclosed
US-20090305016-A1 Heat-Resistant Resin Composition ASAHI KASEI CHEMICALS CORPORATION (JP) 2009-12-10 US disclosed
US-20090275682-A1 Resin Composition Excellent in Flame Retardance ASAHI KASEI CHEMICALS CORPORATION (JP) 2009-11-05 US disclosed
US-20090081462-A1 LONG FIBER FILLER REINFORCED RESIN PELLET ASAHI KASEI CHEMICALS CORPORATION (JP) 2009-03-26 US disclosed
US-20090029138-A1 Resin Composition Having Excellent Heat Resistance ASAHI KASEI CHEMICALS CORPORATION (JP) 2009-01-29 US disclosed
EP-1995280-A1 FLAME RETARDANT POLYAMIDE RESIN COMPOSITION AND MOLDING Mitsubishi Engineering-Plastics Corporation (JP) 2008-11-26 EP disclosed
EP-1956048-A1 RESIN COMPOSITION EXCELLENT IN FLAME RETARDANCE Asahi Kasei Chemicals Corporation (JP) 2008-08-13 EP disclosed
EP-1950248-A1 HEAT-RESISTANT RESIN COMPOSITION Asahi Kasei Chemicals Corporation (JP) 2008-07-30 EP disclosed
EP-1950249-A1 RESIN COMPOSITION HAVING EXCELLENT HEAT RESISTANCE Asahi Kasei Chemicals Corporation (JP) 2008-07-30 EP disclosed
US-20070235893-A1 Method for producing resin strand ASAHI KASEI CHEMICALS CORPORATION (JP) 2007-10-11 US disclosed