Methane

Methane

SCHEMBL190073

C.C[PH](=O)[O-].C[PH](=O)[O-].[Ca+2]

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

GABBR1GABBR2GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQGRIN1GRIN2AGRIN2BGRIN2CGRIN2DGRIN3AGRIN3BHMGCRMMP1MMP13MMP7MMP8PTGS1PTGS2ileSpolrplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO

The experimentally established mechanism targets of Methane. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21753858 0.95
Methane SCHEMBL345547 0.90
Methane SCHEMBL191074 0.90
Methane SCHEMBL190559 0.90
Methane SCHEMBL19895694 0.90
Methane SCHEMBL190615 0.90
SCHEMBL331580 0.84
SCHEMBL31331630 0.84
Potassium Ion SCHEMBL8020727 0.84
SCHEMBL31331590 0.84

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 159 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114502656-B Polyamide composition and articles thereof 巴斯夫欧洲公司 2024-08-20 CN claimed
CN-116875046-A Red phosphorus flame-retardant non-reinforced nylon/polyphenyl ether alloy material and preparation method thereof 北京市化学工业研究院有限责任公司 2023-10-13 CN claimed
US-20220356328-A1 Polyamide Composition and the Article Thereof BASF SE (DE) 2022-11-10 US claimed
EP-4041801-A1 POLYAMIDE COMPOSITION AND THE ARTICLE THEREOF BASF SE (DE) 2022-08-17 EP claimed
US-20260139106-A1 INSULATION FILM BASF SE (DE) 2026-05-21 US disclosed
EP-4169977-B1 RESIN COMPOSITION, MOLDED BODY AND ELECTROMAGNETIC WAVE ABSORBER MITSUBISHI CHEM CORP (JP) 2026-03-18 EP disclosed
US-12559623-B2 Resin composition and electromagnetic wave absorber MITSUBISHI CHEMICAL CORPORATION (JP) 2026-02-24 US disclosed
US-12534597-B2 Polyamide resin composition and molded object thereof KURARAY CO., LTD. (JP) 2026-01-27 US disclosed
EP-4663703-A1 POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE Mitsui Chemicals, Inc. (JP) 2025-12-17 EP disclosed
US-12441065-B2 Formed article, welding method, and method of manufacturing formed article ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-10-14 US disclosed
EP-4591331-A1 INSULATION FILM BASF SE (DE) 2025-07-30 EP disclosed
CN-116285337-B Polyamide composition, method for producing same, and molded article 旭化成株式会社 2025-05-30 CN disclosed
US-20090275682-A1 Resin Composition Excellent in Flame Retardance ASAHI KASEI CHEMICALS CORPORATION (JP) 2009-11-05 US disclosed
US-20090081462-A1 LONG FIBER FILLER REINFORCED RESIN PELLET ASAHI KASEI CHEMICALS CORPORATION (JP) 2009-03-26 US disclosed
US-20090029138-A1 Resin Composition Having Excellent Heat Resistance ASAHI KASEI CHEMICALS CORPORATION (JP) 2009-01-29 US disclosed
EP-1995280-A1 FLAME RETARDANT POLYAMIDE RESIN COMPOSITION AND MOLDING Mitsubishi Engineering-Plastics Corporation (JP) 2008-11-26 EP disclosed
EP-1956048-A1 RESIN COMPOSITION EXCELLENT IN FLAME RETARDANCE Asahi Kasei Chemicals Corporation (JP) 2008-08-13 EP disclosed
EP-1950249-A1 RESIN COMPOSITION HAVING EXCELLENT HEAT RESISTANCE Asahi Kasei Chemicals Corporation (JP) 2008-07-30 EP disclosed
EP-1950248-A1 HEAT-RESISTANT RESIN COMPOSITION Asahi Kasei Chemicals Corporation (JP) 2008-07-30 EP disclosed
US-20070235893-A1 Method for producing resin strand ASAHI KASEI CHEMICALS CORPORATION (JP) 2007-10-11 US disclosed