SCHEMBL345857

SCHEMBL345857

Cc1ccccc1[PH](=O)O.[MgH2]

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.41
ACHE P22303 2/20 0.41
CA1 P00915 1/20 0.39
CA2 P00918 1/20 0.39
CA7 P43166 1/20 0.39
CA9 Q16790 1/20 0.39
RAB9A P51151 2/20 0.35
NPC1 O15118 1/20 0.35
ALDH1A1 P00352 4/20 0.35
HPGD P15428 4/20 0.34
ERCC5 P28715 1/20 0.34
FEN1 P39748 1/20 0.34
TDP1 Q9NUW8 2/20 0.33
KDM4E B2RXH2 1/20 0.33
GAA P10253 1/20 0.33
HSD17B10 Q99714 1/20 0.32
CYP3A4 P08684 1/20 0.32
PBRM1 Q86U86 1/20 0.32
TNKS2 Q9H2K2 1/20 0.32
MYC P01106 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL230855 0.98 TSHR (0.43) TSHRACHECA1CA2CA7
SCHEMBL345497 0.95 TSHR (0.41) TSHRACHECA1CA2CA7
SCHEMBL344031 0.95 TSHR (0.41) TSHRACHECA1CA2CA7
SCHEMBL344224 0.95 TSHR (0.41) TSHRACHECA1CA2CA7
SCHEMBL28468344 0.95 TSHR (0.41) TSHRACHECA1CA2CA7
Hydrochloric Acid SCHEMBL11774243 0.95 TSHR (0.41) TSHRACHECA1CA2CA7
Ammonia Solution, Strong SCHEMBL17670038 0.95 TSHR (0.41) TSHRACHECA1CA2CA7
SCHEMBL19895699 0.95 TSHR (0.41) TSHRACHECA1CA2CA7
Potassium SCHEMBL6755124 0.95 TSHR (0.41) TSHRACHECA1CA2CA7
SCHEMBL10489282 0.89 TSHR (0.36) TSHRACHECA1CA2CA7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 249 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4169977-B1 RESIN COMPOSITION, MOLDED BODY AND ELECTROMAGNETIC WAVE ABSORBER MITSUBISHI CHEM CORP (JP) 2026-03-18 EP disclosed
EP-4700081-A1 THERMOPLASTIC RESIN COMPOSITION, METHOD FOR PREPARING SAME, AND MOLDED ARTICLE COMPRISING SAME LG Chem, Ltd. (KR) 2026-02-25 EP disclosed
US-12559623-B2 Resin composition and electromagnetic wave absorber MITSUBISHI CHEMICAL CORPORATION (JP) 2026-02-24 US disclosed
EP-4685188-A1 THERMOPLASTIC RESIN COMPOSITION, PREPARATION METHOD THEREFOR AND MOLDED ARTICLE COMPRISING SAME LG Chem, Ltd. (KR) 2026-01-28 EP disclosed
US-12534597-B2 Polyamide resin composition and molded object thereof KURARAY CO., LTD. (JP) 2026-01-27 US disclosed
EP-4663703-A1 POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE Mitsui Chemicals, Inc. (JP) 2025-12-17 EP disclosed
US-12441065-B2 Formed article, welding method, and method of manufacturing formed article ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-10-14 US disclosed
US-12365169-B2 Decorative sheet and decorative plate DAI NIPPON PRINTING CO., LTD. (JP) 2025-07-22 US disclosed
WO-2025084296-A1 POLYAMIDE RESIN COMPOSITION AND MOLDED OBJECT 三井化学株式会社 2025-04-24 WO disclosed
EP-3722354-B1 VEHICLE-MOUNTED LITHIUM ION BATTERY MEMBER ASAHI CHEMICAL IND (JP) 2025-04-23 EP disclosed
US-20090312468-A1 FLAME RETARDANT POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2009-12-17 US disclosed
US-20090305016-A1 Heat-Resistant Resin Composition ASAHI KASEI CHEMICALS CORPORATION (JP) 2009-12-10 US disclosed
US-20090275682-A1 Resin Composition Excellent in Flame Retardance ASAHI KASEI CHEMICALS CORPORATION (JP) 2009-11-05 US disclosed
US-20090081462-A1 LONG FIBER FILLER REINFORCED RESIN PELLET ASAHI KASEI CHEMICALS CORPORATION (JP) 2009-03-26 US disclosed
US-20090029138-A1 Resin Composition Having Excellent Heat Resistance ASAHI KASEI CHEMICALS CORPORATION (JP) 2009-01-29 US disclosed
EP-1995280-A1 FLAME RETARDANT POLYAMIDE RESIN COMPOSITION AND MOLDING Mitsubishi Engineering-Plastics Corporation (JP) 2008-11-26 EP disclosed
EP-1956048-A1 RESIN COMPOSITION EXCELLENT IN FLAME RETARDANCE Asahi Kasei Chemicals Corporation (JP) 2008-08-13 EP disclosed
EP-1950249-A1 RESIN COMPOSITION HAVING EXCELLENT HEAT RESISTANCE Asahi Kasei Chemicals Corporation (JP) 2008-07-30 EP disclosed
EP-1950248-A1 HEAT-RESISTANT RESIN COMPOSITION Asahi Kasei Chemicals Corporation (JP) 2008-07-30 EP disclosed
US-20070235893-A1 Method for producing resin strand ASAHI KASEI CHEMICALS CORPORATION (JP) 2007-10-11 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12534597-B2 Polyamide resin composition and molded object thereof SMC2, DAP3, RPTOR TSHR 3608/4885ACHE 4756/4885CA1 113/4885
US-12559623-B2 Resin composition and electromagnetic wave absorber TERB1, LBR, TEX10 TSHR 1437/4885ACHE 3508/4885CA1 1393/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.