SCHEMBL3458753

SCHEMBL3458753

OF.[Si]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29213513 1.00
SCHEMBL27746297 1.00
SCHEMBL6408104 0.89
SCHEMBL27777048 0.87
SCHEMBL29961095 0.87
SCHEMBL82518 0.87
SCHEMBL43134 0.87
SCHEMBL8630625 0.82
Tetrafluoroethylene SCHEMBL31243314 0.82
Tetrafluoroethylene SCHEMBL27526798 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113471096-B Method and system for detecting process chamber conditions and computer readable medium 台湾积体电路制造股份有限公司 2025-02-14 CN claimed
CN-104241319-B Organic light emitting diode display 三星显示有限公司 2019-05-28 CN claimed
US-9064786-B2 Dual three-dimensional (3D) resistor and methods of forming INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2015-06-23 US claimed
US-20140264752-A1 DUAL THREE-DIMENSIONAL (3D) RESISTOR AND METHODS OF FORMING INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2014-09-18 US claimed
US-6811936-B2 Structure and process for a pellicle membrane for 157 nanometer lithography FREESCALE SEMICONDUCTOR INC. 2004-11-02 US claimed
US-20040126671-A1 Structure and process for a pellicle membrane for 157 nanometer lithography NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC. (NL) 2004-07-01 US claimed
JP-9134914-A None JP disclosed
WO-2024222123-A1 CHIP, MANUFACTURING METHOD THEREFOR AND ELECTRONIC DEVICE 华为技术有限公司 2024-10-31 WO disclosed
CN-110391174-A Manufacture the method with the semiconductor devices of the structure plan containing multiple grooves 三星电子株式会社 2019-10-29 CN disclosed
US-10345701-B2 Photoresist polymers, photoresist compositions, methods of forming patterns and methods of manufacturing semiconductor devices SAMSUNG ELECTRONICS CO., LTD. (KR) 2019-07-09 US disclosed
CN-104241319-B Organic light emitting diode display 三星显示有限公司 2019-05-28 CN disclosed
US-9991281-B2 Semiconductor devices and methods of manufacturing the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2018-06-05 US disclosed
US-20180069020-A1 PHOTORESIST POLYMERS, PHOTORESIST COMPOSITIONS, METHODS OF FORMING PATTERNS AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES PARK JIN (KR) 2018-03-08 US disclosed
US-20150060979-A1 VERTICAL MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2015-03-05 US disclosed
US-20140264752-A1 DUAL THREE-DIMENSIONAL (3D) RESISTOR AND METHODS OF FORMING INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2014-09-18 US disclosed
US-8592229-B2 Method for forming dual damascene structure UNITED MICROELECTRONICS CORP. (TW) 2013-11-26 US disclosed
US-20100087018-A1 METHOD FOR FORMING DUAL DAMASCENE STRUCTURE UNITED MICROELECTRONICS CORP. (TW) 2010-04-08 US disclosed
US-6811936-B2 Structure and process for a pellicle membrane for 157 nanometer lithography FREESCALE SEMICONDUCTOR INC. 2004-11-02 US disclosed
US-20040126671-A1 Structure and process for a pellicle membrane for 157 nanometer lithography NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC. (NL) 2004-07-01 US disclosed
JP-H09134914-A FORMATION OF ELEMENT ISOLATION REGION OKI ELECTRIC IND CO LTD 1997-05-20 JP disclosed