Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | RXRB | P28702 | 3/20 | 0.46 |
| ▸ | RXRA | P19793 | 2/20 | 0.46 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.45 |
| ▸ | HPGD | P15428 | 2/20 | 0.45 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.45 |
| ▸ | ACMSD | Q8TDX5 | 3/20 | 0.43 |
| ▸ | HNF4A | P41235 | 2/20 | 0.43 |
| ▸ | MCL1 | Q07820 | 2/20 | 0.43 |
| ▸ | DHFR | P00374 | 1/20 | 0.43 |
| ▸ | ACLY | P53396 | 3/20 | 0.43 |
| ▸ | GFER | P55789 | 1/20 | 0.43 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.43 |
| ▸ | RXFP1 | Q9HBX9 | 1/20 | 0.43 |
| ▸ | KDM1A | O60341 | 3/20 | 0.43 |
| ▸ | ESR1 | P03372 | 1/20 | 0.42 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.42 |
| ▸ | RXRG | P48443 | 1/20 | 0.41 |
| ▸ | AKR1C2 | P52895 | 1/20 | 0.41 |
| ▸ | AKR1C1 | Q04828 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29459104 | 1.00 | RXRB (0.46) | RXRBRXRAKDM4EALDH1A1HPGD | |
| SCHEMBL29401067 | 0.85 | HSD17B10 (0.50) | RXRBRXRAKDM4EALDH1A1HPGD | |
| SCHEMBL1770132 | 0.85 | HSD17B10 (0.50) | RXRBRXRAKDM4EALDH1A1HPGD | |
| SCHEMBL9492931 | 0.85 | HSD17B10 (0.50) | RXRBRXRAKDM4EALDH1A1HPGD | |
| SCHEMBL109108 | 0.85 | HSD17B10 (0.50) | RXRBRXRAKDM4EALDH1A1HPGD | |
| SCHEMBL29441324 | 0.85 | HSD17B10 (0.50) | RXRBRXRAKDM4EALDH1A1HPGD | |
| SCHEMBL8999910 | 0.85 | RXRB (0.47) | RXRBRXRAACMSDHNF4AMCL1 | |
| SCHEMBL5549572 | 0.84 | HSD17B10 (0.49) | RXRBRXRAKDM4EALDH1A1HPGD | |
| Hydrochloric Acid SCHEMBL8507928 | 0.84 | HSD17B10 (0.49) | RXRBRXRAKDM4EALDH1A1HPGD | |
| Water SCHEMBL4580188 | 0.84 | HSD17B10 (0.49) | RXRBRXRAKDM4EALDH1A1HPGD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 97 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-106700965-B | Anisotropic conductive adhesive, method for producing same, circuit connection structure, and application | 日立化成株式会社 | 2020-03-06 | — | — | CN | claimed |
| CN-102838947-B | Modifier for adhesive, method for producing same, adhesive, and circuit connection structure | 日立化成株式会社 | 2019-01-01 | — | — | CN | claimed |
| CN-102127375-B | The manufacture method of the attachment structure of circuit connection material, the attachment structure of circuit block and circuit block | 日立化成株式会社 | 2016-09-28 | — | — | CN | claimed |
| US-20240381529-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND APPLICATION FOR PREPREG | RESONAC CORPORATION (JP) | 2024-11-14 | — | — | US | disclosed |
| US-11901211-B2 | Semiconductor-processing tape | FURUKAWA ELECTRIC CO., LTD. (JP) | 2024-02-13 | — | — | US | disclosed |
| CN-114364761-B | Adhesive tape for semiconductor processing | 古河电气工业株式会社 | 2024-02-02 | — | — | CN | disclosed |
| US-20230331946-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE | RESONAC CORPORATION (JP) | 2023-10-19 | — | — | US | disclosed |
| CN-110036459-B | Semiconductor processing tape | 古河电气工业株式会社 | 2023-07-14 | — | — | CN | disclosed |
| CN-112351859-B | Adhesive tape for glass processing | 古河电气工业株式会社 | 2023-04-11 | — | — | CN | disclosed |
| WO-2023042305-A1 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND APPLICATION FOR PREPREG | 株式会社レゾナック | 2023-03-23 | — | — | WO | disclosed |
| CN-112368107-B | Adhesive tape for glass processing | 古河电气工业株式会社 | 2022-10-25 | — | — | CN | disclosed |
| US-20100178501-A1 | ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE MADE WITH THE SAME | HITACHI CHEMICAL CO., LTD. (JP) | 2010-07-15 | — | — | US | disclosed |
| US-20100143673-A1 | PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2010-06-10 | — | — | US | disclosed |
| EP-2151715-A1 | PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, METHOD FOR FORMING ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2010-02-10 | — | — | EP | disclosed |
| EP-2135910-A1 | PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | Hitachi Chemical Company, Ltd. (JP) | 2009-12-23 | — | — | EP | disclosed |
| EP-2055757-A1 | CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE OF CIRCUIT MEMBER | Hitachi Chemical Company, Ltd. (JP) | 2009-05-06 | — | — | EP | disclosed |
| US-20080176167-A1 | Photopolymerization; polyimides; photomasks; wafers; sheets; films | RESONAC CORPORATION (JP) | 2008-07-24 | — | — | US | disclosed |
| EP-1901123-A1 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2008-03-19 | — | — | EP | disclosed |
| US-20070098995-A1 | Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device | HITACHI CHEMICAL CO., LTD. (JP) | 2007-05-03 | — | — | US | disclosed |
| US-5578697-A | DIELECTRIC POLYMERS FOR ELECTRONICS | KABUSHIKI KAISHA TOSHIBA (JP) | 1996-11-26 | — | — | US | disclosed |