SCHEMBL346676

SCHEMBL346676

COC(C)CC(C)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13020895 1.00
SCHEMBL13020896 1.00
SCHEMBL10580480 0.79
SCHEMBL14996728 0.79
SCHEMBL15463167 0.79
SCHEMBL9011742 0.78 MAPK1 (0.40)
SCHEMBL7052848 0.75
SCHEMBL7880866 0.75
SCHEMBL2153306 0.75
SCHEMBL5428568 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 164 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119859931-A Method for decoloring polyester cloth 财团法人纺织产业综合研究所 2025-04-22 CN claimed
EP-2414471-B1 PLASTIC ADHESIVE COMPOSITION HENKEL AG & CO KGAA (DE) 2013-03-20 EP claimed
EP-2414471-A1 PLASTIC ADHESIVE COMPOSITION Henkel AG & Co. KGaA (DE) 2012-02-08 EP claimed
WO-2010112551-A1 PLASTIC ADHESIVE COMPOSITION HENKEL AG & CO. KGAA (DE) 2010-10-07 WO claimed
US-7704602-B2 Iodine/iodide-containing hot melt coatable adhesive, methods and uses therefor 3M INNOVATIVE PROPERTIES COMPANY (US) 2010-04-27 US claimed
JP-8176053-A None JP disclosed
US-20260079400-A1 CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-03-19 US disclosed
US-12545790-B2 Antifoggant composition and anti-fog article having antifogging film formed from said composition NOF CORPORATION (JP) 2026-02-10 US disclosed
EP-4675351-A1 CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS Shin-Etsu Chemical Co., Ltd. (JP) 2026-01-07 EP disclosed
US-20250370337-A1 ONIUM SALT, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-12-04 US disclosed
CN-119859931-A Method for decoloring polyester cloth 财团法人纺织产业综合研究所 2025-04-22 CN disclosed
US-20250123566-A1 ONIUM SALT TYPE MONOMER, POLYMER, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-04-17 US disclosed
EP-1026002-A1 Additive for inkjet printing SHOWA DENKO KABUSHIKI KAISHA (JP) 2000-08-09 EP disclosed
US-6071674-A ANODIZED METAL PLATE COATED WITH PHOTOSENSITIVE LAYER CONTAINING PHOTOACID GENERATOR, ACID DECOMPOSABLE COMPOUND AND CYANINE DYE INFRARED ABSORBER KONICA CORPORATION (JP) 2000-06-06 US disclosed
US-6051361-A PHOTOSENSITIVE MIXTURE COMPRISING A COMPOUND CAPABLE OF GENERATING AN ACID ON EXPOSURE OF ACTINIC LIGHT, A COMPOUND CAN BE CROSSLINKING BY AN ACID, AN INFRARED ABSORBER AND AN ADDITIONAL POLYMER KONICA CORPORATION (JP) 2000-04-18 US disclosed
EP-0903225-A2 Light sensitive composition and image forming material KONICA CORPORATION (JP) 1999-03-24 EP disclosed
EP-0884647-A1 Image forming material and image forming method KONICA CORPORATION (JP) 1998-12-16 EP disclosed
JP-H08176053-A PRODUCTION OF 3-SUBSTITUTED-3-METHYLBUTANAL KURARAY CO LTD 1996-07-09 JP disclosed
EP-0410609-A2 Germicidal composition SOMAR CORPORATION (JP) 1991-01-30 EP disclosed
EP-0275899-A2 Process for preparing particles having monodisperse particle size Nippon Paint Co., Ltd. (JP) 1988-07-27 EP disclosed