Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.34 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.32 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
| ▸ | TSHR | P16473 | 2/20 | 0.31 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16470051 | 1.00 | SMN1; SMN2 (0.34) | SMN1; SMN2ALDH1A1TDP1TSHRMAPK1 | |
| SCHEMBL22471876 | 0.91 | SMN1; SMN2 (0.32) | SMN1; SMN2ALDH1A1TDP1 | |
| SCHEMBL4839987 | 0.90 | SMN1; SMN2 (0.33) | SMN1; SMN2ALDH1A1TDP1 | |
| SCHEMBL6680249 | 0.87 | ALDH1A1 (0.48) | SMN1; SMN2ALDH1A1TDP1TSHR | |
| SCHEMBL1398352 | 0.86 | ALDH1A1 (0.52) | SMN1; SMN2ALDH1A1TDP1TSHR | |
| SCHEMBL1957206 | 0.86 | TSHR (0.38) | TSHRMAPK1 | |
| SCHEMBL16930793 | 0.85 | SMN1; SMN2 (0.31) | SMN1; SMN2 | |
| SCHEMBL4836572 | 0.84 | SPHK2 (0.31) | SMN1; SMN2 | |
| SCHEMBL6110907 | 0.82 | ALDH1A1 (0.53) | ALDH1A1 | |
| SCHEMBL9358634 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118325529-A | Adhesive for insulating film with high shear strength and high temperature resistance, insulating film and preparation method | 斯迪克新型材料（江苏）有限公司 | 2024-07-12 | — | — | CN | claimed |
| CN-116376489-A | Dual-curing fluorine-containing epoxy adhesive | 上海本诺电子材料有限公司 | 2023-07-04 | — | — | CN | claimed |
| WO-2010077606-A1 | REDOX-INITIATED CATIONIC POLYMERIZATION USING VAPOR-STATE REDUCING AGENTS | RENSSELAER POLYTECHNIC INSTITUTE (US) | 2010-07-08 | — | — | WO | claimed |
| WO-2007022071-A1 | CATIONIC INK FORMULATIONS | MARKEM CORPORATION (US) | 2007-02-22 | — | — | WO | claimed |
| US-6322892-B1 | A) AN EPOXY GROUP-CONTAINING COMPOUND AND OPTIONALLY AN OXETANE COMPOUND; B) A MODIFIED DIMETHYLSILICONE OIL; C) A CATION-POLYMERIZATION INITIATOR WHICH FORMS A CATION BY IRRADIATION OR BY HEATING. | KANSAI PAINT CO., LTD. (JP) | 2001-11-27 | — | — | US | claimed |
| CN-120040723-A | Curable composition, cured film, organic EL element, and method for producing same | JSR株式会社 | 2025-05-27 | — | — | CN | disclosed |
| CN-119708917-A | Inkjet ink, method for forming cured product, and cured product | 柯尼卡美能达株式会社 | 2025-03-28 | — | — | CN | disclosed |
| CN-119546720-A | Acid generator, curable composition containing same, and cured product thereof | 三亚普罗股份有限公司 | 2025-02-28 | — | — | CN | disclosed |
| CN-118901044-A | Hybrid photocurable compositions | 阿科玛法国公司 | 2024-11-05 | — | — | CN | disclosed |
| CN-118511673-A | Sealing material for organic EL display element, organic EL display device, and method for manufacturing organic EL display device | 三井化学株式会社 | 2024-08-16 | — | — | CN | disclosed |
| CN-118451124-A | Polymerizable composition, sealing material, image display device, and method for manufacturing image display device | 三井化学株式会社 | 2024-08-06 | — | — | CN | disclosed |
| CN-118325529-A | Adhesive for insulating film with high shear strength and high temperature resistance, insulating film and preparation method | 斯迪克新型材料（江苏）有限公司 | 2024-07-12 | — | — | CN | disclosed |
| WO-2007022071-A1 | CATIONIC INK FORMULATIONS | MARKEM CORPORATION (US) | 2007-02-22 | — | — | WO | disclosed |
| US-20060141393-A1 | Alkali-soluble resin; a quinone diazide; and a mixture of surfactants including a 3-(perfluoroalkyl)-1,2-epoxypropane, reaction product between methylhydrobis(trimethylsiloxy)silane and polyalkylene glycol monoallyl ether preferably having a molecular weight from 200 to 500 and a 2nd ether silicone | SAMSUNG ELECTRONICS CO., LTD. | 2006-06-29 | — | — | US | disclosed |
| US-20060131267-A1 | Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel | SAMSUNG DISPLAY CO., LTD. (KR) | 2006-06-22 | — | — | US | disclosed |
| CN-1760756-A | Radioactivity sensitive resin composition | SUMITOMO CHEMICAL CO (JP) | 2006-04-19 | — | — | CN | disclosed |
| CN-1760757-A | Radioactivity sensitive resin composition | SUMITOMO CHEMICAL CO (JP) | 2006-04-19 | — | — | CN | disclosed |
| CN-1760758-A | Radioactivity sensitive resin composition | SUMITOMO CHEMICAL CO (JP) | 2006-04-19 | — | — | CN | disclosed |
| US-6322892-B1 | A) AN EPOXY GROUP-CONTAINING COMPOUND AND OPTIONALLY AN OXETANE COMPOUND; B) A MODIFIED DIMETHYLSILICONE OIL; C) A CATION-POLYMERIZATION INITIATOR WHICH FORMS A CATION BY IRRADIATION OR BY HEATING. | KANSAI PAINT CO., LTD. (JP) | 2001-11-27 | — | — | US | disclosed |
| US-6166100-A | Cationically polymerizable pigmented composition | KANSAI PAINT CO., LTD. (JP) | 2000-12-26 | — | — | US | disclosed |