Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | WDR5 | P61964 | 1/20 | 0.43 |
| ▸ | LDHA | P00338 | 1/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.41 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.41 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.41 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.41 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.41 |
| ▸ | MEN1 | O00255 | 2/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.41 |
| ▸ | HPGD | P15428 | 2/20 | 0.41 |
| ▸ | NR4A1 | P22736 | 1/20 | 0.41 |
| ▸ | NR4A2 | P43354 | 1/20 | 0.41 |
| ▸ | NR4A3 | Q92570 | 1/20 | 0.41 |
| ▸ | GLA | P06280 | 1/20 | 0.41 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.41 |
| ▸ | CDC25B | P30305 | 3/20 | 0.41 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.40 |
| ▸ | RXFP1 | Q9HBX9 | 1/20 | 0.39 |
| ▸ | PARP1 | P09874 | 1/20 | 0.39 |
| ▸ | GPR35 | Q9HC97 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20873404 | 0.91 | WDR5 (0.44) | WDR5LDHAALDH1A1CYP1A2ALOX15 | |
| SCHEMBL19177352 | 0.90 | WDR5 (0.47) | WDR5LDHAALDH1A1CYP1A2ALOX15 | |
| SCHEMBL17907061 | 0.89 | WDR5 (0.43) | WDR5LDHAALDH1A1CYP1A2ALOX15 | |
| SCHEMBL471822 | 0.84 | CYP1A2 (0.48) | WDR5LDHAALDH1A1CYP1A2ALOX15 | |
| SCHEMBL9505995 | 0.80 | CYP1A2 (0.61) | WDR5LDHAALDH1A1CYP1A2ALOX15 | |
| SCHEMBL202564 | 0.80 | CYP1A2 (0.50) | WDR5LDHAALDH1A1CYP1A2ALOX15 | |
| SCHEMBL27990719 | 0.78 | PARP1 (0.35) | WDR5LDHAALDH1A1CYP1A2ALOX15 | |
| SCHEMBL183135 | 0.78 | WDR5 (0.61) | WDR5LDHAALDH1A1CYP1A2KDM4E | |
| SCHEMBL31613859 | 0.78 | WDR5 (0.61) | WDR5LDHAALDH1A1CYP1A2KDM4E | |
| SCHEMBL11928243 | 0.78 | WDR5 (0.61) | WDR5LDHAALDH1A1CYP1A2KDM4E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 243 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2021118671-A1 | DISPENSABLE POLYIMIDE AEROGEL PREPOLYMER, METHOD OF MAKING THE SAME, METHOD OF USING THE SAME, AND SUBSTRATE COMPRISING PATTERNED POLYIMIDE AEROGEL | RAYTHEON COMPANY (US) | 2021-06-17 | — | — | WO | claimed |
| US-20210179800-A1 | DISPENSABLE POLYIMIDE AEROGEL PREPOLYMER, METHOD OF MAKING THE SAME, METHOD OF USING THE SAME, AND SUBSTRATE COMPRISING PATTERNED POLYIMIDE AEROGEL | RAYTHEON COMPANY | 2021-06-17 | — | — | US | claimed |
| CN-118063769-A | Polyimide resin | 住友化学株式会社 | 2024-05-24 | — | — | CN | disclosed |
| WO-2024071066-A1 | METAL-CLAD LAMINATED PLATE | 日鉄ケミカル＆マテリアル株式会社 | 2024-04-04 | — | — | WO | disclosed |
| CN-117794048-A | Metal-clad laminate, circuit board, electronic device, and electronic apparatus | 日铁化学材料株式会社 | 2024-03-29 | — | — | CN | disclosed |
| CN-113402882-B | Composition for forming release layer | 日产化学工业株式会社 | 2024-02-06 | — | — | CN | disclosed |
| CN-111746080-B | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2024-01-16 | — | — | CN | disclosed |
| CN-115971017-B | Method for producing polyimide film, method for producing metal-clad laminate, and method for producing circuit board | 日铁化学材料株式会社 | 2024-01-16 | — | — | CN | disclosed |
| CN-117279198-A | Metal-clad laminate, circuit board, electronic device, and electronic apparatus | 日铁化学材料株式会社 | 2023-12-22 | — | — | CN | disclosed |
| CN-117210002-A | Resin film, coverlay film, circuit board, resin-coated copper foil, metal-clad laminate, and multilayer circuit board | 日铁化学材料株式会社 | 2023-12-12 | — | — | CN | disclosed |
| CN-117067718-A | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2023-11-17 | — | — | CN | disclosed |
| EP-0571899-B1 | Radiation-curable mixture and its' use for producing high temperature-resistant relief structures | BASF LACKE & FARBEN (DE) | 1994-11-02 | — | — | EP | disclosed |
| US-5350663-A | Construction of electrical circuits and protective or insulating layers for electronic components | BASF LACKE+ FARBEN AKTIENGESELLSCHAFT (DE) | 1994-09-27 | — | — | US | disclosed |
| EP-0573866-A1 | Method for forming patterned layers of heat-resistant polycondensates | BASF Lacke + Farben Aktiengesellschaft (DE) | 1993-12-15 | — | — | EP | disclosed |
| EP-0571899-A1 | Radiation-curable mixture and its' use for producing high temperature-resistant relief structures | BASF Lacke + Farben Aktiengesellschaft (DE) | 1993-12-01 | — | — | EP | disclosed |
| US-5238784-A | PHOTOSENSITIVE RESIN COMPOSITION WITH POLYAMIC ACID POLYMER | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1993-08-24 | — | — | US | disclosed |
| US-5206337-A | Heat resistance, moldability, workability | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1993-04-27 | — | — | US | disclosed |
| EP-0456512-A2 | Polyimidesiloxane oligomer | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1991-11-13 | — | — | EP | disclosed |
| EP-0430220-A2 | Photosensitive resin composition and semiconductor apparatus using it | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1991-06-05 | — | — | EP | disclosed |
| EP-0430221-A2 | Photosensitive resin composition | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1991-06-05 | — | — | EP | disclosed |