Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 3/20 | 0.61 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.61 |
| ▸ | MAOA | P21397 | 4/20 | 0.48 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.42 |
| ▸ | CASP1 | P29466 | 1/20 | 0.42 |
| ▸ | RECQL | P46063 | 1/20 | 0.42 |
| ▸ | MAOB | P27338 | 4/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.39 |
| ▸ | MAPT | P10636 | 2/20 | 0.39 |
| ▸ | CYP19A1 | P11511 | 1/20 | 0.39 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.39 |
| ▸ | MEN1 | O00255 | 1/20 | 0.39 |
| ▸ | LMNA | P02545 | 1/20 | 0.39 |
| ▸ | GAA | P10253 | 1/20 | 0.39 |
| ▸ | GFER | P55789 | 1/20 | 0.39 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.39 |
| ▸ | PBRM1 | Q86U86 | 1/20 | 0.37 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.37 |
| ▸ | PTPN5 | P54829 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10398895 | 0.94 | TSHR (0.55) | TSHRMAPK1MAOACYP3A4CASP1 | |
| SCHEMBL1140694 | 0.81 | KIF11 (0.46) | TSHRMAPK1MAOACYP3A4MAOB | |
| SCHEMBL8582903 | 0.80 | TSHR (0.61) | TSHRMAPK1MAOACYP3A4CASP1 | |
| SCHEMBL160204 | 0.80 | TSHR (0.58) | TSHRMAPK1ALDH1A1PTPN1PTPN5 | |
| SCHEMBL16395922 | 0.79 | TSHR (0.65) | TSHRMAPK1MAOACYP3A4CASP1 | |
| SCHEMBL28372148 | 0.77 | TSHR (0.68) | TSHRMAPK1MAOACYP3A4CASP1 | |
| SCHEMBL3867382 | 0.77 | TSHR (0.68) | TSHRMAPK1MAOACYP3A4CASP1 | |
| SCHEMBL31000868 | 0.77 | TSHR (0.68) | TSHRMAPK1MAOACYP3A4CASP1 | |
| SCHEMBL29799449 | 0.77 | TSHR (0.68) | TSHRMAPK1MAOACYP3A4CASP1 | |
| SCHEMBL29373758 | 0.77 | TSHR (0.68) | TSHRMAPK1MAOACYP3A4CASP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2092807-B1 | COMPOSITE ORGANIC ENCAPSULANTS | CDA PROC LTD LIABILITY COMPANY (US) | 2013-04-17 | — | — | EP | claimed |
| US-7745516-B2 | Composition of polyimide and sterically-hindered hydrophobic epoxy | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2010-06-29 | — | — | US | claimed |
| US-20090111948-A1 | Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating thereto | CDA PROCESSING LIMITED LIABILITY COMPANY | 2009-04-30 | — | — | US | claimed |
| EP-2027184-A2 | HYDROPHOBIC COMPOSITIONS FOR ELECTRONIC APPLICATIONS | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2009-02-25 | — | — | EP | claimed |
| EP-1943311-A1 | COMPOSITIONS COMPRISING POLYIMIDE AND HYDROPHOBIC EPOXY, AND METHODS RELATING THERETO | E.I.Du pont de nemours and company (US) | 2008-07-16 | — | — | EP | claimed |
| WO-2007146382-A2 | HYDROPHOBIC COMPOSITIONS FOR ELECTRONIC APPLICATIONS | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2007-12-21 | — | — | WO | claimed |
| US-20070290379-A1 | Hydrophobic compositions for electronic applications | E. I. DU PONT DE NEMOURS AND COMPANY | 2007-12-20 | — | — | US | claimed |
| WO-2007047384-A1 | COMPOSITIONS COMPRISING POLYIMIDE AND HYDROPHOBIC EPOXY, AND METHODS RELATING THERETO | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2007-04-26 | — | — | WO | claimed |
| US-20070083016-A1 | Photosensitive polyimide compositions | E. I. DUPONT DE NEMOURS AND COMPANY | 2007-04-12 | — | — | US | claimed |
| US-20070083017-A1 | Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto | CDA PROCESSING LIMITED LIABILITY COMPANY | 2007-04-12 | — | — | US | claimed |
| WO-2024053564-A1 | PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE | 住友ベークライト株式会社 | 2024-03-14 | — | — | WO | disclosed |
| WO-2023190309-A1 | SURFACE-MODIFIER RESIN COMPOSITION | 住友ベークライト株式会社 | 2023-10-05 | — | — | WO | disclosed |
| WO-2023054381-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING ELECTRONIC DEVICE, ELECTRONIC DEVICE AND LIGHT DEVICE | 住友ベークライト株式会社 | 2023-04-06 | — | — | WO | disclosed |
| EP-2092807-B1 | COMPOSITE ORGANIC ENCAPSULANTS | CDA PROC LTD LIABILITY COMPANY (US) | 2013-04-17 | — | — | EP | disclosed |
| US-8233261-B2 | Composite organic encapsulants | CDA PROCESSING LIMITED LIABILITY COMPANY (US) | 2012-07-31 | — | — | US | disclosed |
| WO-2007047384-A1 | COMPOSITIONS COMPRISING POLYIMIDE AND HYDROPHOBIC EPOXY, AND METHODS RELATING THERETO | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2007-04-26 | — | — | WO | disclosed |
| US-20070083016-A1 | Photosensitive polyimide compositions | E. I. DUPONT DE NEMOURS AND COMPANY | 2007-04-12 | — | — | US | disclosed |
| US-20070083017-A1 | Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto | CDA PROCESSING LIMITED LIABILITY COMPANY | 2007-04-12 | — | — | US | disclosed |
| US-4978573-A | Ultrathin polyimide polymer films and their preparation | HOECHST CELANESE CORP. (US) | 1990-12-18 | — | — | US | disclosed |
| US-4929405-A | Ultrathin polyimide polymer flims and their preparation | HOECHST CELANESE CORP. (US) | 1990-05-29 | — | — | US | disclosed |