Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DPP4 | P27487 | 1/20 | 0.40 |
| ▸ | HTT | P42858 | 1/20 | 0.39 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.34 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.34 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.34 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.34 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.34 |
| ▸ | TSHR | P16473 | 2/20 | 0.33 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.33 |
| ▸ | CA12 | O43570 | 1/20 | 0.33 |
| ▸ | CA1 | P00915 | 1/20 | 0.33 |
| ▸ | CA2 | P00918 | 1/20 | 0.33 |
| ▸ | CA7 | P43166 | 1/20 | 0.33 |
| ▸ | CA9 | Q16790 | 1/20 | 0.33 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.33 |
| ▸ | TPMT | P51580 | 1/20 | 0.33 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.31 |
| ▸ | HCAR2 | Q8TDS4 | 1/20 | 0.31 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11506307 | 0.88 | DPP4 (0.37) | DPP4HTTCYP1A2ALDH1A1MAPK1 | |
| SCHEMBL27954229 | 0.88 | HTT (0.41) | DPP4HTTCYP1A2ALDH1A1MAPK1 | |
| SCHEMBL3339612 | 0.86 | DPP4 (0.43) | DPP4HTTCYP1A2ALDH1A1MAPK1 | |
| SCHEMBL7882999 | 0.84 | HTT (0.32) | DPP4HTTALDH1A1KDM4EHSD17B10 | |
| SCHEMBL8125151 | 0.83 | DPP4 (0.42) | DPP4HTTCYP1A2ALDH1A1MAPK1 | |
| SCHEMBL27772 | 0.83 | HTT (0.50) | DPP4HTTCYP1A2ALDH1A1MAPK1 | |
| SCHEMBL29431520 | 0.83 | HTT (0.50) | DPP4HTTCYP1A2ALDH1A1MAPK1 | |
| SCHEMBL3630379 | 0.80 | HTT (0.48) | DPP4HTTCYP1A2ALDH1A1MAPK1 | |
| Hydrochloric Acid SCHEMBL10668016 | 0.80 | HTT (0.48) | DPP4HTTCYP1A2ALDH1A1MAPK1 | |
| Hydrochloric Acid SCHEMBL10715453 | 0.80 | HTT (0.48) | DPP4HTTCYP1A2ALDH1A1MAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 118 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20210179800-A1 | DISPENSABLE POLYIMIDE AEROGEL PREPOLYMER, METHOD OF MAKING THE SAME, METHOD OF USING THE SAME, AND SUBSTRATE COMPRISING PATTERNED POLYIMIDE AEROGEL | RAYTHEON COMPANY | 2021-06-17 | — | — | US | claimed |
| CN-118063769-A | Polyimide resin | 住友化学株式会社 | 2024-05-24 | — | — | CN | disclosed |
| WO-2024071066-A1 | METAL-CLAD LAMINATED PLATE | 日鉄ケミカル＆マテリアル株式会社 | 2024-04-04 | — | — | WO | disclosed |
| CN-111746080-B | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2024-01-16 | — | — | CN | disclosed |
| CN-109679094-B | Polyimide precursor, polyimide, laminate, and flexible device | 日铁化学材料株式会社 | 2023-10-24 | — | — | CN | disclosed |
| CN-116891570-A | Polyamic acid, polyimide, metal-clad laminate, and circuit board | 日铁化学材料株式会社 | 2023-10-17 | — | — | CN | disclosed |
| WO-2023189319-A1 | AMINO COMPOUND, POLYAMIDE ACID AND POLYIMIDE USING SAID AMINO COMPOUND, AND METHOD FOR PRODUCING SAME | 日鉄ケミカル＆マテリアル株式会社 | 2023-10-05 | — | — | WO | disclosed |
| CN-113874420-B | Resin film and metal-clad laminate | 日铁化学材料株式会社 | 2023-09-26 | — | — | CN | disclosed |
| US-11753517-B2 | Dispensable polyimide aerogel prepolymer, method of making the same, method of using the same, and substrate comprising patterned polyimide aerogel | RAYTHEON COMPANY (US) | 2023-09-12 | — | — | US | disclosed |
| WO-2023149581-A1 | SURFACE TREATMENT SOLUTION, AND METHOD FOR MANUFACTURING SURFACE-TREATED RESIN AND RESIN FILM LAMINATE | 豊光社テクノロジーズ株式会社 | 2023-08-10 | — | — | WO | disclosed |
| EP-0648796-A1 | Solutions of polyimide-forming substances and their use | BASF Lacke + Farben AG (DE) | 1995-04-19 | — | — | EP | disclosed |
| EP-0637776-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR FORMING RELIEF PATTERN THEREFROM | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1995-02-08 | — | — | EP | disclosed |
| US-5385808-A | Photosensitive resin composition and semiconductor apparatus using it | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1995-01-31 | — | — | US | disclosed |
| EP-0571899-B1 | Radiation-curable mixture and its' use for producing high temperature-resistant relief structures | BASF LACKE & FARBEN (DE) | 1994-11-02 | — | — | EP | disclosed |
| EP-0571899-A1 | Radiation-curable mixture and its' use for producing high temperature-resistant relief structures | BASF Lacke + Farben Aktiengesellschaft (DE) | 1993-12-01 | — | — | EP | disclosed |
| US-5238784-A | PHOTOSENSITIVE RESIN COMPOSITION WITH POLYAMIC ACID POLYMER | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1993-08-24 | — | — | US | disclosed |
| US-5206337-A | Heat resistance, moldability, workability | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1993-04-27 | — | — | US | disclosed |
| EP-0456512-A2 | Polyimidesiloxane oligomer | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1991-11-13 | — | — | EP | disclosed |
| EP-0430220-A2 | Photosensitive resin composition and semiconductor apparatus using it | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1991-06-05 | — | — | EP | disclosed |
| EP-0430221-A2 | Photosensitive resin composition | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 1991-06-05 | — | — | EP | disclosed |