SCHEMBL3474683

SCHEMBL3474683

COC1(OC)CCC[Si](C)(C)O1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11218936 0.78
SCHEMBL5682511 0.77
SCHEMBL4363799 0.76
SCHEMBL1092187 0.76
SCHEMBL19085006 0.72
SCHEMBL4827741 0.72
SCHEMBL5898553 0.70
SCHEMBL1905806 0.69
SCHEMBL1639014 0.68
SCHEMBL16343898 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120005529-A Preparation method of optical adhesive film 湖北有臻电子科技有限公司 2025-05-16 CN claimed
EP-0832913-B1 RANDOM SILOXANE COPOLYMER, PROCESS FOR PRODUCTION THEREOF, AND RESIN COMPOSITION CONTAINING THE COPOLYMER KANEGAFUCHI CHEMICAL IND (JP) 2003-09-24 EP claimed
US-20030104708-A1 CVD plasma assisted lower dielectric constant sicoh film APPLIED MATERIALS, INC. 2003-06-05 US claimed
US-20030003768-A1 CVD PLASMA ASSISTED LOWER DIELECTRIC CONSTANT SICOH FILM APPLIED MATERIALS, INC. 2003-01-02 US claimed
US-6486082-B1 CVD plasma assisted lower dielectric constant sicoh film APPLIED MATERIALS, INC. 2002-11-26 US claimed
US-6103837-A REACTING AT LEAST ONE POLYCARBONATE AND/OR DICARBONATE OF A DIOL AND, IF NEEDED, AT LEAST ONE DIESTER OF A DICARBOXYLIC ACID WITH AT LEAST ONE SPECIFIED SILICON COMPOUND IN THE PRESENCE OF AN ESTERIFYING OR ESTER EXCHANGE CATALYST KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2000-08-15 US claimed
EP-0832913-A1 RANDOM SILOXANE COPOLYMER, PROCESS FOR PRODUCTION THEREOF, AND RESIN COMPOSITION CONTAINING THE COPOLYMER KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1998-04-01 EP claimed
CN-122011804-A Organosilicon modified oil-soluble dye and preparation method and application thereof 上海杰立化妆品科技有限公司 2026-05-12 CN disclosed
US-12031032-B2 Thermoplastic resin including a flame retardant and organopolysiloxane MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2024-07-09 US disclosed
CN-112399993-B Thermoplastic resin composition and molded article 三菱工程塑料株式会社 2024-03-12 CN disclosed
CN-116769346-A Light diffusion agent and application method thereof 刘业 2023-09-19 CN disclosed
EP-3822320-B1 THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE MITSUBISHI ENG PLASTICS CORP (JP) 2023-09-06 EP disclosed
CN-116315071-A Wide-temperature solid electrolyte 上海交通大学绍兴新能源与分子工程研究院 2023-06-23 CN disclosed
JP-2003300851-A FRAGRANCE COMPOSITION POLA CHEM IND INC 2003-10-21 JP disclosed
EP-0698632-B1 Process for preparing organosiloxane terminated with silanol group SHINETSU CHEMICAL CO (JP) 2001-11-21 EP disclosed
US-6201064-B1 GRAFT COPOLYMERIZATION WITH VINYL MONOMER AND CROSSLINKED RUBBER PARTICLES, ISOBUTYLENE POLYMER AND ORGANOSILOXANES KANEKA CORPORATION (JP) 2001-03-13 US disclosed
JP-2000007551-A COSMETIC FOR HIDING WRINKLE POLA CHEM IND INC 2000-01-11 JP disclosed
EP-0698632-A1 Process for preparing organosiloxane terminated with silanol group SHIN-ETSU CHEMICAL CO., LTD. (JP) 1996-02-28 EP disclosed
US-4727127-A Curable organopolysiloxane compositions TORAY SILICONE CO., LTD. (JP) 1988-02-23 US disclosed
EP-0246651-A2 Curable organopolysiloxane compositions Toray Silicone Company, Ltd. (JP) 1987-11-25 EP disclosed