⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1639944 | 0.78 | — | — | |
| SCHEMBL1639257 | 0.78 | — | — | |
| SCHEMBL4182122 | 0.77 | — | — | |
| SCHEMBL5024992 | 0.77 | — | — | |
| SCHEMBL11315874 | 0.76 | — | — | |
| SCHEMBL5460542 | 0.68 | — | — | |
| SCHEMBL3474683 | 0.68 | — | — | |
| SCHEMBL18631787 | 0.67 | — | — | |
| SCHEMBL1059754 | 0.67 | — | — | |
| SCHEMBL412623 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 74 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12610790-B2 | Structure including a photoresist underlayer and method of forming same | ASM IP HOLDING B.V. (NL) | 2026-04-21 | — | — | US | claimed |
| CN-110648961-B | Semiconductor structure and forming method thereof | 台湾积体电路制造股份有限公司 | 2023-05-23 | — | — | CN | claimed |
| US-20210013037-A1 | STRUCTURE INCLUDING A PHOTORESIST UNDERLAYER AND METHOD OF FORMING SAME | ASM IP HOLDING B.V. (NL) | 2021-01-14 | — | — | US | claimed |
| CN-110648961-A | Semiconductor structure and forming method thereof | 台湾积体电路制造股份有限公司 | 2020-01-03 | — | — | CN | claimed |
| US-9896326-B2 | FCVD line bending resolution by deposition modulation | APPLIED MATERIALS, INC. (US) | 2018-02-20 | — | — | US | claimed |
| US-20160181089-A1 | FCVD LINE BENDING RESOLUTION BY DEPOSITION MODULATION | APPLIED MATERIALS, INC. (US) | 2016-06-23 | — | — | US | claimed |
| US-20160017487-A1 | INTEGRATED PRE-CLEAN AND DEPOSITION OF LOW-DAMAGE LAYERS | APPLIED MATERIALS, INC. | 2016-01-21 | — | — | US | claimed |
| US-20150167160-A1 | ENABLING RADICAL-BASED DEPOSITION OF DIELECTRIC FILMS | APPLIED MATERIALS, INC. | 2015-06-18 | — | — | US | claimed |
| US-20050221622-A1 | Deposition method and semiconductor device | SEMICONDUCTOR PROCESS LABORATORY CO., LTD. (JP) | 2005-10-06 | — | — | US | claimed |
| US-12610790-B2 | Structure including a photoresist underlayer and method of forming same | ASM IP HOLDING B.V. (NL) | 2026-04-21 | — | — | US | disclosed |
| US-20260018411-A1 | REMOTE ICP RADICAL DEPOSITION OF TUNABLE LOW-K DIELECTRIC FILMS | APPLIED MATERIALS INC (US) | 2026-01-15 | — | — | US | disclosed |
| US-12322648-B2 | Interlayer dielectric layer | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2025-06-03 | — | — | US | disclosed |
| US-20250174493-A1 | INTERLAYER DIELECTRIC LAYER | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2025-05-29 | — | — | US | disclosed |
| CN-112640065-B | Method for etching structures for semiconductor applications | 应用材料公司 | 2024-10-01 | — | — | CN | disclosed |
| CN-1823406-A | Low dielectric constant film, method for producing the same, and electronic device using the same | RORZE CORP (JP) | 2006-08-23 | — | — | CN | disclosed |
| US-20050221622-A1 | Deposition method and semiconductor device | SEMICONDUCTOR PROCESS LABORATORY CO., LTD. (JP) | 2005-10-06 | — | — | US | disclosed |
| US-20050048797-A1 | Method of forming thin film | ASM JAPAN K.K/ (JP) | 2005-03-03 | — | — | US | disclosed |
| WO-2005008762-A1 | LOW-PERMITTIVITY FILM, AND PRODUCTION METHOD THEREFOR, AND ELECTRONIC COMPONENT USING IT | RORZE CORPORATION (JP) | 2005-01-27 | — | — | WO | disclosed |
| US-20040202956-A1 | a photocurable mixture of a hydrolyzable metal (silyl) compound and a reaction, polymerization or crosslinking promoter; curing; adhesives, seals, semiconductors, dielectrics, microlenses, optical fibers, color filters, gas permeable films | SEKISUI CHEMICAL CO., LTD. (JP) | 2004-10-14 | — | — | US | disclosed |
| EP-1391476-A1 | PHOTOREACTIVE COMPOSITION | SEKISUI CHEMICAL CO., LTD. (JP) | 2004-02-25 | — | — | EP | disclosed |