SCHEMBL3476574

SCHEMBL3476574

CC(CN(C)C)O[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13339784 0.76
SCHEMBL18502238 0.75 PIK3CD (0.35)
SCHEMBL2459380 0.75 MAPK1 (0.40)
SCHEMBL16668732 0.74 MEN1 (0.32)
SCHEMBL17475525 0.74 PIK3CD (0.31)
SCHEMBL13362157 0.73
SCHEMBL7534859 0.73 PIK3CD (0.33)
SCHEMBL3436832 0.73
SCHEMBL12210637 0.73
SCHEMBL10407571 0.72 SCN1A (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107400877-B Ground state hydrogen radical source for chemical vapor deposition of silicon-containing carbon films 朗姆研究公司 2020-06-30 CN disclosed
US-20160276140-A1 GROUND STATE HYDROGEN RADICAL SOURCES FOR CHEMICAL VAPOR DEPOSITION OF SILICON-CARBON-CONTAINING FILMS LAM RES CORP (US) 2016-09-22 US disclosed
US-9371579-B2 Ground state hydrogen radical sources for chemical vapor deposition of silicon-carbon-containing films LAM RESEARCH CORPORATION (US) 2016-06-21 US disclosed
US-20150322294-A1 POLISHING COMPOSITION FUJIMI INCORPORATED (JP) 2015-11-12 US disclosed
EP-2788448-B1 SELF-CROSSLINKING SILICONE PRESSURE SENSITIVE ADHESIVE COMPOSITIONS, PROCESS FOR MAKING AND ARTICLES MADE THEREOF MOMENTIVE PERFORMANCE MAT INC (US) 2015-09-16 EP disclosed
US-20150118394-A1 GROUND STATE HYDROGEN RADICAL SOURCES FOR CHEMICAL VAPOR DEPOSITION OF SILICON-CARBON-CONTAINING FILMS LAM RESEARCH CORPORATION 2015-04-30 US disclosed
US-8933187-B2 Self-crosslinking silicone pressure sensitive adhesive compositions, process for making and articles made thereof MOMENTIVE PERFORMANCE MATERIAL INC. (US) 2015-01-13 US disclosed
EP-2788448-A1 SELF-CROSSLINKING SILICONE PRESSURE SENSITIVE ADHESIVE COMPOSITIONS, PROCESS FOR MAKING AND ARTICLES MADE THEREOF Momentive Performance Materials Inc. (US) 2014-10-15 EP disclosed
US-20140178503-A1 CYCLOHEXYL UREA MODULATORS OF D2 RECEPTORS AND/OR D3 RECEPTORS AUSPEX PHARMACEUTICALS, INC. (US) 2014-06-26 US disclosed
US-8580907-B2 Insulating film material, multilayer wiring board and production method thereof, and semiconductor device and production method thereof FUJITSU LIMITED (JP) 2013-11-12 US disclosed
CN-101933103-A Powder for magnetic core, powder magnetic core, and their production methods TOYOTA MOTOR CO LTD 2010-12-29 CN disclosed
US-20100266861-A1 POWDER FOR MAGNETIC CORE, POWDER MAGNETIC CORE AND THEIR PRODUCTION METHODS TOYOTA JIDOSHA KABUSHIKI KAISHA (JP) 2010-10-21 US disclosed
EP-2221836-A1 POWDER FOR MAGNETIC CORE, POWDER MAGNETIC CORE, AND THEIR PRODUCTION METHODS Toyota Jidosha Kabushiki Kaisha (JP) 2010-08-25 EP disclosed
US-20100140807-A1 INSULATING FILM MATERIAL, MULTILAYER WIRING BOARD AND PRODUCTION METHOD THEREOF, AND SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF FUJITSU LIMITED (JP) 2010-06-10 US disclosed
US-7714155-B2 Alkoxide compound, material for thin film formation, and process for thin film formation ADEKA CORPORATION (JP) 2010-05-11 US disclosed
EP-1927622-B1 Nanocomposite particle and molecular wrapping method TOYOTA CHUO KENKYUSHO KK (JP) 2009-09-02 EP disclosed
US-20090035464-A1 Alkoxide compound, material for thin film formation, and process for thin film formation ADEKA CORPORATION (JP) 2009-02-05 US disclosed
EP-1927622-A1 Nanocomposite particle and molecular wrapping method Kabushiki Kaisha Toyota Chuo Kenkyusho (JP) 2008-06-04 EP disclosed
WO-2005054394-A2 CURABLE SILICONE PRESSURE ADHESIVE COATING COMPOSITIONS GENERAL ELECTRIC COMPANY (US) 2005-06-16 WO disclosed
US-20050113513-A1 Curable silicone pressure adhesive coating compositions GENERAL ELECTRIC COMPANY 2005-05-26 US disclosed