⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7611798 | 0.83 | — | — | |
| SCHEMBL7268675 | 0.81 | — | — | |
| SCHEMBL140172 | 0.76 | — | — | |
| SCHEMBL396769 | 0.75 | — | — | |
| SCHEMBL27186007 | 0.72 | TRPA1 (0.32) | — | |
| SCHEMBL9320222 | 0.71 | — | — | |
| SCHEMBL465459 | 0.69 | — | — | |
| SCHEMBL1195620 | 0.69 | — | — | |
| SCHEMBL5694010 | 0.69 | TRPA1 (0.32) | — | |
| SCHEMBL28614782 | 0.68 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1937697-B1 | METHOD FOR PRODUCTION OF ISOCYANATOSILANES | MOMENTIVE PERFORMANCE MAT INC (US) | 2013-10-16 | — | — | EP | claimed |
| US-7825243-B2 | Process for the production of isocyanatosilane and silylisocyanurate | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2010-11-02 | — | — | US | claimed |
| EP-1937697-A2 | METHOD FOR PRODUCTION OF ISOCYANATOSILANES | Momentive Performance Materials Inc. (US) | 2008-07-02 | — | — | EP | claimed |
| WO-2007037817-A2 | METHOD FOR PRODUCTION OF ISOCYANATOSILANES | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2007-04-05 | — | — | WO | claimed |
| US-20060276644-A1 | Process for the production of isocyanatosilane and silylisocyanurate | GENERAL ELECTRIC COMPANY | 2006-12-07 | — | — | US | claimed |
| US-7060849-B1 | Method for production of isocyanatosilanes | GENERAL ELECTRIC COMPANY (US) | 2006-06-13 | — | — | US | claimed |
| WO-2023218851-A1 | POLY(ARYLENE SULFIDE) RESIN COMPOSITION, MOLDED ARTICLE, AND PRODUCTION METHODS THEREFOR | DIC株式会社 | 2023-11-16 | — | — | WO | disclosed |
| WO-2023145439-A1 | COPPER-CLAD LAMINATE PLATE AND CIRCUIT BOARD USING SAME | DIC株式会社 | 2023-08-03 | — | — | WO | disclosed |
| CN-115989202-A | Polyarylene sulfide resin composition, molded article, and method for producing same | DIC株式会社 | 2023-04-18 | — | — | CN | disclosed |
| CN-115989201-A | Polyarylene sulfide resin composition, molded article, and method for producing same | DIC株式会社 | 2023-04-18 | — | — | CN | disclosed |
| CN-111386301-B | Tubular integrally molded article and method for manufacturing tubular integrally molded article | 东丽株式会社 | 2023-04-04 | — | — | CN | disclosed |
| CN-112020428-B | Polyarylene sulfide resin composition, molded article, composite molded article, and processes for producing these | DIC株式会社 | 2023-04-04 | — | — | CN | disclosed |
| CN-115637046-A | Polyarylene sulfide resin composition, and biaxially stretched film, laminate, and circuit board using same | DIC株式会社 | 2023-01-24 | — | — | CN | disclosed |
| CN-114514117-A | Biaxially stretched laminate film, laminate, and method for producing same | DIC株式会社 | 2022-05-17 | — | — | CN | disclosed |
| CN-114196375-A | Heat-curable silicone composition | 杜邦东丽特殊材料株式会社 | 2022-03-18 | — | — | CN | disclosed |
| CN-109790372-B | Aqueous resin composition, coating agent, and article | DIC株式会社 | 2022-03-11 | — | — | CN | disclosed |
| EP-1937697-B1 | METHOD FOR PRODUCTION OF ISOCYANATOSILANES | MOMENTIVE PERFORMANCE MAT INC (US) | 2013-10-16 | — | — | EP | disclosed |
| EP-1937697-A2 | METHOD FOR PRODUCTION OF ISOCYANATOSILANES | Momentive Performance Materials Inc. (US) | 2008-07-02 | — | — | EP | disclosed |
| WO-2007037817-A2 | METHOD FOR PRODUCTION OF ISOCYANATOSILANES | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2007-04-05 | — | — | WO | disclosed |
| US-7060849-B1 | Method for production of isocyanatosilanes | GENERAL ELECTRIC COMPANY (US) | 2006-06-13 | — | — | US | disclosed |