⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5027488 | 0.84 | — | — | |
| SCHEMBL5009468 | 0.79 | — | — | |
| SCHEMBL5011394 | 0.74 | — | — | |
| SCHEMBL5013019 | 0.74 | — | — | |
| SCHEMBL3482086 | 0.72 | — | — | |
| SCHEMBL1524255 | 0.72 | — | — | |
| SCHEMBL3482709 | 0.72 | MAPT (0.31) | — | |
| SCHEMBL5011624 | 0.69 | — | — | |
| SCHEMBL9012259 | 0.62 | USP2 (0.35) | — | |
| SCHEMBL71655 | 0.61 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| CN-101641767-B | Silicon dielectric treating agent for use after etching, process for producing semiconductor device, and semiconductor device | FUJITSU LTD | 2013-10-30 | — | — | CN | disclosed |
| EP-1764118-B1 | Polymer coating for medical devices | GILEAD PALO ALTO INC (US) | 2010-08-25 | — | — | EP | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |
| EP-1937328-B1 | POLYMER COATING FOR MEDICAL DEVICES | CV THERAPEUTICS INC (US) | 2009-08-26 | — | — | EP | disclosed |
| US-7419709-B2 | Polymer coating for medical devices | CV THERAPEUTICS, INC. (US) | 2008-09-02 | — | — | US | disclosed |
| US-20080160166-A1 | POLYMER COATING FOR MEDICAL DEVICES | RYPACEK FRANTISEK | 2008-07-03 | — | — | US | disclosed |
| US-7364768-B2 | Polymer coating for medical devices | CV THERAPEUTICS, INC. (US) | 2008-04-29 | — | — | US | disclosed |
| US-20070071879-A1 | Polymer coating for medical devices | RYPACEK FRANTISEK | 2007-03-29 | — | — | US | disclosed |
| US-20070071926-A1 | Polymer coating for medical devices | RYPACEK FRANTISEK | 2007-03-29 | — | — | US | disclosed |
| EP-1764118-A2 | Polymer coating for medical devices | CV THERAPEUTICS, INC. (US) | 2007-03-21 | — | — | EP | disclosed |
| US-7160592-B2 | Polymer coating for medical devices | CV THERAPEUTICS, INC. (US) | 2007-01-09 | — | — | US | disclosed |
| EP-1492581-B1 | POLYMER COATING FOR MEDICAL DEVICES | CV THERAPEUTICS INC (US) | 2006-12-20 | — | — | EP | disclosed |
| US-20060093771-A1 | Polymer coating for medical devices | CV THERAPEUTICS, INC. | 2006-05-04 | — | — | US | disclosed |
| EP-1492581-A1 | POLYMER COATING FOR MEDICAL DEVICES | CV THERAPEUTICS, INC. (US) | 2005-01-05 | — | — | EP | disclosed |
| US-20040143081-A1 | Novel silicon compounds and process for preparation thereof | JNC CORPORATION (JP) | 2004-07-22 | — | — | US | disclosed |
| US-20030219562-A1 | Polymer coating for medical devices | CV THERAPEUTICS, INC. | 2003-11-27 | — | — | US | disclosed |
| WO-2003068289-A1 | POLYMER COATING FOR MEDICAL DEVICES | CV THERAPEUTICS, INC. (US) | 2003-08-21 | — | — | WO | disclosed |