SCHEMBL3482203

SCHEMBL3482203

NC1CC2CCC1C2N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14615976 0.81
SCHEMBL14616003 0.81
SCHEMBL14037839 0.81
SCHEMBL19292174 0.81
SCHEMBL12631472 0.77
SCHEMBL22149365 0.74
SCHEMBL23519809 0.72
SCHEMBL17359288 0.72
SCHEMBL23934866 0.72
SCHEMBL372857 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117279780-B Laminated substrate, laminated body manufacturing method, laminated body with member for electronic device, and electronic device manufacturing method AGC株式会社 2024-08-16 CN disclosed
CN-113136103-B Polyimide precursor resin composition 旭化成株式会社 2024-05-03 CN disclosed
CN-117279780-A Laminated substrate, laminated body manufacturing method, laminated body with member for electronic device, and electronic device manufacturing method AGC株式会社 2023-12-22 CN disclosed
WO-2022224933-A1 LAMINATED SUBSTRATE, LAMINATE, METHOD FOR PRODUCING LAMINATE, LAMINATE EQUIPPED WITH MEMBER FOR ELECTRONIC DEVICE, AND METHOD FOR PRODUCING ELECTRONIC DEVICE AGC株式会社 2022-10-27 WO disclosed
US-20220274314-A1 APPARATUS FOR MANUFACTURING LAMINATE AND METHOD FOR MANUFACTURING LAMINATE TOYOBO CO., LTD. (JP) 2022-09-01 US disclosed
EP-4039447-A1 APPARATUS FOR MANUFACTURING LAMINATE AND METHOD FOR MANUFACTURING LAMINATE TOYOBO CO., LTD. (JP) 2022-08-10 EP disclosed
CN-114423612-A Laminate manufacturing device and laminate manufacturing method 东洋纺株式会社 2022-04-29 CN disclosed
CN-113136103-A Polyimide precursor resin composition 旭化成株式会社 2021-07-20 CN disclosed
CN-107429057-B Polyimide precursor resin composition 旭化成株式会社 2021-03-30 CN disclosed
US-10711105-B2 Polyimide precursor resin composition ASAHI KASEI KABUSHIKI KAISHA (JP) 2020-07-14 US disclosed
US-7705105-B2 A cyclic polymer of silsesquioxane skeleton with side chains formed byhydrosilation of an unsaturated end group containing an active polymerfunctional group; polyimidesiloxane copolymers; polyestersiloxane copolymers; high molecular weight; thin films; strength; heat resistance;waterproofing; CHISSO PETROCHEMICAL CORPORATION (JP) 2010-04-27 US disclosed
US-7507450-B2 Varnish for forming liquid crystal alignment layer and liquid crystal display element using the same CHISSO CORPORATION (JP) 2009-03-24 US disclosed
US-7373060-B2 Optical waveguide using polymer composed of silsesquioxane derivative CHISSO CORPORATION (JP) 2008-05-13 US disclosed
US-20070190344-A1 Verification of translation JNC CORPORATION (JP) 2007-08-16 US disclosed
US-20060204192-A1 Optical waveguide using polymer composed of silsesquioxane derivative JNC CORPORATION (JP) 2006-09-14 US disclosed
US-20060204680-A1 Varnish for forming liquid crystal alignment layer and liquid crystal display element using the same JNC CORPORATION (JP) 2006-09-14 US disclosed
US-6949281-B1 Varnish composition and liquid-crystal display element CHISSO CORPORATION (JP) 2005-09-27 US disclosed
US-20050009982-A1 Compound having silsesquioxane skeleton and its polymer CHISSO CORPORATION (JP) 2005-01-13 US disclosed
US-6746730-B1 VARNISH COMPOSITION WHICH COMPRISES POLYMER COMPONENT CONTAINING TWO DIFFERENT POLYAMIC ACIDS, SOLUBLE POLYIMIDE, AND SOLVENT FOR DISSOLVING POLYMER COMPONENT CHISSO CORPORATION (JP) 2004-06-08 US disclosed
US-6685997-B1 SOLUTION CONTAINING POLYAMIC ACIDS, POLYAMIDES AND POLYIMIDES; ALIGNMENT FILM; WELL BALANCED ELECTRICAL CHARACTERISTICS; ELIMINATES IMAGE STICKING CHISSO CORPORATION (JP) 2004-02-03 US disclosed