SCHEMBL3482542

SCHEMBL3482542

CCO[SiH](CCCN1CCOCC1)OCC

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KEAP1 Q14145 1/20 0.46
SMN1; SMN2 Q16637 1/20 0.46
ALDH1A1 P00352 5/20 0.45
SIGMAR1 Q99720 3/20 0.45
MAPK1 P28482 2/20 0.45
CYP1A2 P05177 1/20 0.45
CHRM2 P08172 1/20 0.45
CHRM1 P11229 1/20 0.45
HTR2A P28223 1/20 0.45
SCN1A P35498 1/20 0.45
HTR2B P41595 1/20 0.45
KCNH2 Q12809 1/20 0.45
SCN2A Q99250 1/20 0.45
SCN3A Q9NY46 1/20 0.45
HRH3 Q9Y5N1 1/20 0.45
USP2 O75604 1/20 0.44
LMNA P02545 1/20 0.44
KDM4E B2RXH2 3/20 0.42
HTT P42858 1/20 0.42
HPGD P15428 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL612358 0.95 ALDH1A1 (0.44) KEAP1SMN1; SMN2ALDH1A1SIGMAR1MAPK1
SCHEMBL2762716 0.89 ALDH1A1 (0.40) KEAP1SMN1; SMN2ALDH1A1SIGMAR1MAPK1
SCHEMBL16714796 0.86 ALDH1A1 (0.50) KEAP1SMN1; SMN2ALDH1A1SIGMAR1MAPK1
SCHEMBL3482394 0.85 ALDH1A1 (0.56) KEAP1SMN1; SMN2ALDH1A1SIGMAR1MAPK1
SCHEMBL16612469 0.83 ALDH1A1 (0.43) KEAP1SMN1; SMN2ALDH1A1SIGMAR1MAPK1
SCHEMBL16714744 0.81 HRH3 (0.46) SMN1; SMN2ALDH1A1MAPK1CYP1A2HRH3
SCHEMBL4059392 0.79
SCHEMBL4065756 0.79 CXCR4 (0.43) SMN1; SMN2SIGMAR1CHRM2CHRM1HRH3
SCHEMBL1859824 0.77 TSHR (0.37) KEAP1SMN1; SMN2ALDH1A1SIGMAR1MAPK1
SCHEMBL21373219 0.76 PAOX (0.41) ALDH1A1SIGMAR1HRH3USP2HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10570259-B2 Composition and formed article JSR CORPORATION (JP) 2020-02-25 US disclosed
US-20180258239-A1 COMPOSITION AND FORMED ARTICLE JSR CORPORATION (JP) 2018-09-13 US disclosed
EP-3345969-A1 COMPOSITION AND MOLDED OBJECT JSR Corporation (JP) 2018-07-11 EP disclosed
US-9862812-B2 Composition containing nitrogen-containing organoxysilane compound and method for making the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-01-09 US disclosed
EP-2876111-B1 Composition containing nitrogen-containing organoxysilane compound and method for making the same SHINETSU CHEMICAL CO (JP) 2017-09-20 EP disclosed
EP-2876111-A1 Composition containing nitrogen-containing organoxysilane compound and method for making the same Shin-Etsu Chemical Co., Ltd. (JP) 2015-05-27 EP disclosed
US-20150135996-A1 COMPOSITION CONTAINING NITROGEN-CONTAINING ORGANOXYSILANE COMPOUND AND METHOD FOR MAKING THE SAME SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-05-21 US disclosed
EP-2128897-B1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LTD (JP) 2015-05-06 EP disclosed
US-8716209-B2 Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device FUJITSU LIMITED (JP) 2014-05-06 US disclosed
US-20100007031-A1 AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed