SCHEMBL3482559

SCHEMBL3482559

CCCO[Si](C)(C)CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4281440 0.82 ADRB2 (0.39)
SCHEMBL703982 0.81
SCHEMBL706740 0.81
SCHEMBL1582745 0.79
SCHEMBL25405865 0.77
SCHEMBL706737 0.77
SCHEMBL234381 0.77
SCHEMBL704380 0.77
SCHEMBL13089109 0.77
SCHEMBL11805648 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114616652-A Monoalkoxysilanes and dense organosilica films prepared therefrom 弗萨姆材料美国有限责任公司 2022-06-10 CN claimed
WO-2010082710-A1 METHOD FOR PREPARING A HIGHLY DURABLE REVERSE OSMOSIS MEMBRANE UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY (KR) 2010-07-22 WO claimed
CN-119874207-A Organically modified metal oxide or metalloid oxide polymer films 巴斯夫欧洲公司 2025-04-25 CN disclosed
US-12240989-B2 Organomodified metal oxide or metalloid oxide polymer film BASF SE (DE) 2025-03-04 US disclosed
US-12187914-B2 Easy to clean coating BASF SE (DE) 2025-01-07 US disclosed
EP-3755672-B1 ORGANOMODIFIED METAL OXIDE OR METALLOID OXIDE POLYMER FILM BASF SE (DE) 2024-08-07 EP disclosed
WO-2023198748-A1 PROCESS FOR PREPARING AN ABRASION RESISTANT COATING OPTITUNE OY (FI) 2023-10-19 WO disclosed
US-20220010170-A1 EASY TO CLEAN COATING BASF SE (DE) 2022-01-13 US disclosed
EP-3880371-A1 EASY TO CLEAN COATING BASF SE (DE) 2021-09-22 EP disclosed
CN-113015581-A Easy-to-clean coating 巴斯夫欧洲公司 2021-06-22 CN disclosed
CN-108350173-B Method for producing polyalkylene ether-modified polysiloxanes and use thereof 巴斯夫欧洲公司 2021-03-05 CN disclosed
EP-2128897-B1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LTD (JP) 2015-05-06 EP disclosed
US-20150093655-A1 IONIC COMPOUNDS HAVING A SILYLOXY GROUP HYDRO-QUEBEC (CA) 2015-04-02 US disclosed
US-8716209-B2 Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device FUJITSU LIMITED (JP) 2014-05-06 US disclosed
WO-2010082710-A1 METHOD FOR PREPARING A HIGHLY DURABLE REVERSE OSMOSIS MEMBRANE UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY (KR) 2010-07-22 WO disclosed
US-20100007031-A1 AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed
US-7604866-B2 Comprising silica particles and at least one binder compound; good mechanical strength and abrasion resistance ASAHI KASEI KABUSHIKI KAISHA (JP) 2009-10-20 US disclosed
US-20060269724-A1 Comprising silica particles and at least one binder compound; good mechanical strength and abrasion resistance ASAHI KASEI KABUSHIKI KAISHA (JP) 2006-11-30 US disclosed
US-20040077757-A1 Coating composition for use in producing an insulating thin film ASAHI KASEI KABUSHIKI KAISHA (JP) 2004-04-22 US disclosed