SCHEMBL3482776

SCHEMBL3482776

C=C[Si](CCC)(CCC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3482211 0.91 TSHR (0.32)
SCHEMBL3482173 0.90
SCHEMBL3482183 0.85 TSHR (0.35)
SCHEMBL28316536 0.81 TSHR (0.39)
SCHEMBL17239047 0.81 TSHR (0.30)
SCHEMBL339814 0.78
SCHEMBL29136453 0.77
SCHEMBL26102193 0.77
SCHEMBL3482123 0.77
SCHEMBL3482590 0.77 TSHR (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2018048297-A1 ORGANOSILOXANE HYBRID COMPOSITION FOR ENCAPSULATION OF LIGHT-EMITTING ELEMENTS PENCHEM TECHNOLOGIES SDN. BHD. (MY) 2018-03-15 WO claimed
CN-116234874-B Curable composition 株式会社钟化 2024-07-19 CN disclosed
CN-116234874-A Curable composition 株式会社钟化 2023-06-06 CN disclosed
CN-111534149-B High-adhesion ink and preparation method thereof 厦门欧化实业有限公司 2022-06-03 CN disclosed
WO-2022075386-A1 CURABLE COMPOSITION 株式会社カネカ 2022-04-14 WO disclosed
CN-111534149-A High-adhesion ink and preparation method thereof 厦门欧化实业有限公司 2020-08-14 CN disclosed
US-9969850-B2 Method for producing modified polymer, and rubber composition TOYO TIRE & RUBBER CO., LTD. (JP) 2018-05-15 US disclosed
WO-2018048297-A1 ORGANOSILOXANE HYBRID COMPOSITION FOR ENCAPSULATION OF LIGHT-EMITTING ELEMENTS PENCHEM TECHNOLOGIES SDN. BHD. (MY) 2018-03-15 WO disclosed
US-20160009875-A1 METHOD FOR PRODUCING MODIFIED POLYMER, AND RUBBER COMPOSITION TOYO TIRE & RUBBER CO., LTD. (JP) 2016-01-14 US disclosed
EP-2128897-B1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LTD (JP) 2015-05-06 EP disclosed
US-20130267653-A1 ADDITION-CURABLE METALLOSILOXANE COMPOUND DAICEL CORPORATION (JP) 2013-10-10 US disclosed
CN-103249762-A Addition-curable metallosiloxane compound DAICEL CORP 2013-08-14 CN disclosed
US-20100007031-A1 AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed
US-7604866-B2 Comprising silica particles and at least one binder compound; good mechanical strength and abrasion resistance ASAHI KASEI KABUSHIKI KAISHA (JP) 2009-10-20 US disclosed
US-20060269724-A1 Comprising silica particles and at least one binder compound; good mechanical strength and abrasion resistance ASAHI KASEI KABUSHIKI KAISHA (JP) 2006-11-30 US disclosed
CN-1809764-A Antireflective film ASAHI CHEMICAL IND (JP) 2006-07-26 CN disclosed
US-7015292-B2 Silicon-containing olefin copolymer, crosslinkable rubber composition thereof, and use thereof MITSUI CHEMICALS, INC. (JP) 2006-03-21 US disclosed
US-20050038214-A1 Silicon-containing olefin copolymer, crosslinkable rubber composition thereof, and use thereof MITSUI CHEMICALS, INC. (JP) 2005-02-17 US disclosed
US-20040077757-A1 Coating composition for use in producing an insulating thin film ASAHI KASEI KABUSHIKI KAISHA (JP) 2004-04-22 US disclosed