SCHEMBL339814

SCHEMBL339814

C=C[Si](CC)(CC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3482173 0.85
SCHEMBL3482590 0.81 TSHR (0.32)
SCHEMBL3481972 0.79 ALDH1A1 (0.30)
SCHEMBL3482776 0.78
SCHEMBL27606642 0.77
SCHEMBL29136452 0.74
SCHEMBL339028 0.74
SCHEMBL10005616 0.74
SCHEMBL15496409 0.74
SCHEMBL3482183 0.74 TSHR (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 160 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250188615-A1 Gapfill Methods and Processing Assemblies ASM IP HOLDING B.V. (NL) 2025-06-12 US claimed
US-20240117494-A1 Gapfill methods and processing assemblies ASM IP HOLDING B.V. (NL) 2024-04-11 US claimed
WO-2018048297-A1 ORGANOSILOXANE HYBRID COMPOSITION FOR ENCAPSULATION OF LIGHT-EMITTING ELEMENTS PENCHEM TECHNOLOGIES SDN. BHD. (MY) 2018-03-15 WO claimed
CN-103626914-A Pour point and viscosity reducing agent and preparation method thereof PETROCHINA CO LTD 2014-03-12 CN claimed
US-7172657-B2 Cleaning method of treatment equipment and treatment equipment TOKYO ELECTRON LIMITED (JP) 2007-02-06 US claimed
EP-0854507-B1 Precursor with (alkoxy) (alkyl) vinylsilane ligand to deposit copper and method for the same SHARP KK (JP) 2006-06-07 EP claimed
US-5844046-A Process for the preparation of olefin polymer MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1998-12-01 US claimed
EP-0854507-A2 Precursor with (alkyloxy) (alkyl) silylolefin ligand to deposit copper and method for the same SHARP KABUSHIKI KAISHA (JP) 1998-07-22 EP claimed
US-5767301-A COPPER HEXAFLUOROACETYLACETONATE WITH ETHOXYVINYLSILANE LIGAND; CHEMICAL VAPOR DEPOSITION SHARP MICROELECTRONICS TECHNOLOGY, INC. (US) 1998-06-16 US claimed
US-12534377-B2 Carbon-containing alumina powder, resin composition, heat dissipation component, and method for producing carbon-containing alumina powder DENKA COMPANY LIMITED (JP) 2026-01-27 US disclosed
US-20250389016-A1 GAS BARRIER FILM MATERIAL, SILICON OXIDE FILM, AND PRODUCTION METHOD OF SILICON OXIDE FILM TOSOH CORP (JP) 2025-12-25 US disclosed
US-20250188615-A1 Gapfill Methods and Processing Assemblies ASM IP HOLDING B.V. (NL) 2025-06-12 US disclosed
US-12252790-B2 Gapfill methods and processing assemblies ASM IP HOLDING B.V. (NL) 2025-03-18 US disclosed
CN-118843711-A Material for gas barrier film, silicon oxide film, and method for producing silicon oxide film 东曹株式会社 2024-10-25 CN disclosed
WO-1998031727-A1 POLYMERIC ORGANOSILICON COMPOUNDS, THEIR PRODUCTION AND USE WACKER-CHEMIE GMBH (DE) 1998-07-23 WO disclosed
EP-0854507-A2 Precursor with (alkyloxy) (alkyl) silylolefin ligand to deposit copper and method for the same SHARP KABUSHIKI KAISHA (JP) 1998-07-22 EP disclosed
WO-1998026028-A1 FUEL COMPOSITIONS EXHIBITING IMPROVED FUEL STABILITY ORR WILLIAM C (US) 1998-06-18 WO disclosed
US-5767301-A COPPER HEXAFLUOROACETYLACETONATE WITH ETHOXYVINYLSILANE LIGAND; CHEMICAL VAPOR DEPOSITION SHARP MICROELECTRONICS TECHNOLOGY, INC. (US) 1998-06-16 US disclosed
EP-0601496-B1 Process for the preparation of olefin polymer MITSUI PETROCHEMICAL IND (JP) 1997-04-16 EP disclosed
EP-0601496-A1 Process for the preparation of olefin polymer MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1994-06-15 EP disclosed