SCHEMBL3483604

SCHEMBL3483604

CCCCCCCC=C[Si](OCC)(OCC)OCC

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FAAH O00519 5/20 0.43
TRPV1 Q8NER1 1/20 0.43
LPAR3 Q9UBY5 1/20 0.39
TERT O14746 3/20 0.38
MAPT P10636 2/20 0.38
BLM P54132 2/20 0.38
HSD17B10 Q99714 2/20 0.38
FABP4 P15090 2/20 0.38
PTPN1 P18031 2/20 0.38
PPARG P37231 2/20 0.38
PPARD Q03181 2/20 0.38
PPARA Q07869 2/20 0.38
GMNN O75496 1/20 0.38
USP2 O75604 1/20 0.38
LMNA P02545 1/20 0.38
CYP1A2 P05177 1/20 0.38
POLB P06746 1/20 0.38
CYP2C9 P11712 1/20 0.38
ALOX15 P16050 1/20 0.38
APEX1 P27695 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31280495 1.00 FAAH (0.43) FAAHTRPV1LPAR3TERTMAPT
SCHEMBL19125743 1.00 FAAH (0.43) FAAHTRPV1LPAR3TERTMAPT
SCHEMBL2802639 1.00 FAAH (0.43) FAAHTRPV1LPAR3TERTMAPT
SCHEMBL16459842 1.00 FAAH (0.43) FAAHTRPV1LPAR3TERTMAPT
SCHEMBL2802636 1.00 FAAH (0.43) FAAHTRPV1LPAR3TERTMAPT
SCHEMBL18317965 1.00 FAAH (0.43) FAAHTRPV1LPAR3TERTMAPT
SCHEMBL16459844 1.00 FAAH (0.43) FAAHTRPV1LPAR3TERTMAPT
SCHEMBL1681041 1.00 FAAH (0.43) FAAHTRPV1LPAR3TERTMAPT
SCHEMBL388914 1.00 FAAH (0.43) FAAHTRPV1LPAR3TERTMAPT
SCHEMBL31280307 1.00 FAAH (0.43) FAAHTRPV1LPAR3TERTMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119119391-B High-performance water-swelling acrylic acid-based material and preparation method thereof 淄博宏达助剂有限公司 2025-01-24 CN claimed
CN-119119391-A High-performance water-swelling acrylic acid-based material and preparation method thereof 淄博宏达助剂有限公司 2024-12-13 CN claimed
CN-105916931-B Resin combination, reflector, lead frame and semiconductor light-emitting apparatus with reflector 大日本印刷株式会社 2019-07-12 CN claimed
EP-4501441-A1 ORGANIC-INORGANIC HYBRID MEMBRANE, ORGANIC-INORGANIC HYBRID MEMBRANE COMPOSITE, GAS SEPARATION AND CONCENTRATION METHOD, GAS SEPARATION MEMBRANE MODULE, METHOD FOR PRODUCING ORGANIC-INORGANIC HYBRID MEMBRANE, AND METHOD FOR PRODUCING ORGANIC-INORGANIC HYBRID MEMBRANE COMPOSITE Mitsubishi Chemical Corporation (JP) 2025-02-05 EP disclosed
CN-119119391-B High-performance water-swelling acrylic acid-based material and preparation method thereof 淄博宏达助剂有限公司 2025-01-24 CN disclosed
US-20250018349-A1 ORGANIC-INORGANIC HYBRID MEMBRANE, ORGANIC-INORGANIC HYBRID MEMBRANE COMPOSITE, GAS SEPARATION AND CONCENTRATION METHOD, GAS SEPARATION MEMBRANE MODULE, METHOD FOR PRODUCING ORGANIC-INORGANIC HYBRID MEMBRANE, AND METHOD FOR PRODUCING ORGANIC-INORGANIC HYBRID MEMBRANE COMPOSITE MITSUBISHI CHEMICAL CORPORATION (JP) 2025-01-16 US disclosed
CN-119119391-A High-performance water-swelling acrylic acid-based material and preparation method thereof 淄博宏达助剂有限公司 2024-12-13 CN disclosed
CN-113614033-B Block-shaped boron nitride particles, heat-conductive resin composition, and heat-dissipating member 电化株式会社 2024-04-30 CN disclosed
WO-2023182531-A1 ORGANIC-INORGANIC HYBRID MEMBRANE, ORGANIC-INORGANIC HYBRID MEMBRANE COMPOSITE, GAS SEPARATION AND CONCENTRATION METHOD, GAS SEPARATION MEMBRANE MODULE, METHOD FOR PRODUCING ORGANIC-INORGANIC HYBRID MEMBRANE, AND METHOD FOR PRODUCING ORGANIC-INORGANIC HYBRID MEMBRANE COMPOSITE 三菱ケミカル株式会社 2023-09-28 WO disclosed
US-20220153583-A1 BULK BORON NITRIDE PARTICLES, THERMALLY CONDUCTIVE RESIN COMPOSITION, AND HEAT DISSIPATING MEMBER DENKA COMPANY LIMITED (JP) 2022-05-19 US disclosed
CN-113614033-A Bulk boron nitride particles, heat conductive resin composition, and heat dissipating member 电化株式会社 2021-11-05 CN disclosed
WO-2020196644-A1 BULK BORON NITRIDE PARTICLES, THERMALLY CONDUCTIVE RESIN COMPOSITION, AND HEAT DISSIPATING MEMBER デンカ株式会社 2020-10-01 WO disclosed
US-10454008-B2 Resin composition, reflector, lead frame with reflector, and semiconductor light-emitting device DAI NIPPON PRINTING CO., LTD. (JP) 2019-10-22 US disclosed
US-10411174-B2 Semiconductor light-emitting device and optical-semiconductor-mounting substrate DAI NIPPON PRINTING CO., LTD. (JP) 2019-09-10 US disclosed
CN-106133929-B Semiconductor light emitting device and substrate for mounting optical semiconductor 大日本印刷株式会社 2018-10-26 CN disclosed
US-20170207376-A1 SEMICONDUCTOR LIGHT-EMITTING DEVICE AND OPTICAL-SEMICONDUCTOR-MOUNTING SUBSTRATE DAI NIPPON PRINTING CO., LTD. (JP) 2017-07-20 US disclosed
US-20160372645-A1 RESIN COMPOSITION, REFLECTOR, LEAD FRAME WITH REFLECTOR, AND SEMICONDUCTOR LIGHT-EMITTING DEVICE DAI NIPPON PRINTING CO., LTD. (JP) 2016-12-22 US disclosed
CN-106133929-A Semiconductor light emitting device and substrate for mounting optical semiconductor 大日本印刷株式会社 2016-11-16 CN disclosed
EP-2223973-A1 Metal oxide fine particles, silicone resin composition and use thereof Nitto Denko Corporation (JP) 2010-09-01 EP disclosed
US-20100213415-A1 METAL OXIDE FINE PARTICLES, SILICONE RESIN COMPOSITION AND USE THEREOF NITTO DENKO CORPORATION (JP) 2010-08-26 US disclosed