SCHEMBL350142

SCHEMBL350142

CCCCCCCCCCCCCCCCCCOB(OCCCCCCCCCCCCCCCCCC)OCCCCCCCCCCCCCCCCCC

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
THRB P10828 2/20 0.47
TSHR P16473 1/20 0.47
MEN1 O00255 1/20 0.42
HTT P42858 1/20 0.42
KMT2A Q03164 1/20 0.42
MAPT P10636 1/20 0.42
CA1 P00915 8/20 0.41
CA2 P00918 8/20 0.41
CA9 Q16790 7/20 0.41
LPAR3 Q9UBY5 6/20 0.41
LPAR2 Q9HBW0 5/20 0.41
CA12 O43570 3/20 0.41
CA7 P43166 3/20 0.41
CA14 Q9ULX7 3/20 0.41
LPAR1 Q92633 2/20 0.41
CA3 P07451 2/20 0.41
CA4 P22748 2/20 0.41
CA6 P23280 2/20 0.41
CA5A P35218 2/20 0.41
CA5B Q9Y2D0 2/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL187178 1.00 THRB (0.47) THRBTSHRMEN1HTTKMT2A
SCHEMBL2451237 1.00 THRB (0.47) THRBTSHRMEN1HTTKMT2A
SCHEMBL185731 1.00 THRB (0.47) THRBTSHRMEN1HTTKMT2A
SCHEMBL11630788 1.00 THRB (0.47) THRBTSHRMEN1HTTKMT2A
SCHEMBL205139 1.00 THRB (0.47) THRBTSHRMEN1HTTKMT2A
SCHEMBL187020 1.00 THRB (0.47) THRBTSHRMEN1HTTKMT2A
SCHEMBL187350 1.00 THRB (0.47) THRBTSHRMEN1HTTKMT2A
SCHEMBL10924921 1.00 THRB (0.47) THRBTSHRMEN1HTTKMT2A
SCHEMBL50779 1.00 THRB (0.47) THRBTSHRMEN1HTTKMT2A
SCHEMBL352047 1.00 THRB (0.47) THRBTSHRMEN1HTTKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 371 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12262626-B2 Thermosetting liquid composition for encapsulant in organic light-emitting device INNOX ADVANCED MATERIALS CO., LTD. (KR) 2025-03-25 US claimed
CN-119463770-A Moisture-heat resistant single-component mercaptan epoxy adhesive 苏州毫邦新材料有限公司 2025-02-18 CN claimed
EP-4284888-A1 SILICONE PRESSURE SENSITIVE ADHESIVE COMPOSITIONS AND ARTICLES COMPRISING THE SAME Momentive Performance Materials Inc. (US) 2023-12-06 EP claimed
WO-2023226568-A1 ULTRAVIOLET-CURING ADHESIVE HAVING CURING DELAYING FUNCTION, AND PREPARATION METHOD THEREFOR 烟台德邦科技股份有限公司 2023-11-30 WO claimed
CN-116783266-A Silicone pressure sensitive adhesive composition and articles comprising the same 迈图高新材料公司 2023-09-19 CN claimed
CN-115286744-A Resin capable of adsorbing aromatic aldehyde and synthesis method thereof 烟台德邦科技股份有限公司 2022-11-04 CN claimed
CN-114958209-A Ultraviolet curing adhesive with delayed curing function and preparation method thereof 烟台德邦科技股份有限公司 2022-08-30 CN claimed
WO-2022160238-A1 SILICONE PRESSURE SENSITIVE ADHESIVE COMPOSITIONS AND ARTICLES COMPRISING THE SAME MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2022-08-04 WO claimed
CN-109679045-B Novel green reinforcing resin for tire rubber and composition thereof 山东圣泉新材料股份有限公司 2022-04-12 CN claimed
US-10947626-B2 Fluoride corrosion inhibition of metal surfaces HALLIBURTON ENERGY SERVICES, INC. (US) 2021-03-16 US claimed
US-5954844-A BACKING SUPPORTING SURFACE-BOUND ABRASIVE PARTICLES AND ANTILOADING COMPOUND COMPRISING AN ALKYLATED OR FLUOROALKYLATED ORGANOBORON, ORGANONITROGEN, ORGANOPHOSPHORUS, ORGANOSULFUR, OR HYDROXYCARBOXYLIC ACID DERIVATIVE MINNESOTA MINING & MANUFACTURING COMPANY (US) 1999-09-21 US claimed
EP-0912295-A1 ABRASIVE ARTICLE COMPRISING AN ANTILOADING COMPONENT MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1999-05-06 EP claimed
US-5704952-A COATINGS, BONDING, NONWOVEN ABRASIVES AND BINDERS MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1998-01-06 US claimed
WO-1997042007-A1 ABRASIVE ARTICLE COMPRISING AN ANTILOADING COMPONENT MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1997-11-13 WO claimed
US-5292364-A Containing organometallic compound, organic polymer and below a specified moisture content; bonding substrates TOAGOSEI CHEMICA INDUSTRY CO., LTD. (JP) 1994-03-08 US claimed
US-5110392-A PRIMER COMPOSITION CONTAINING AN ORGANOMETALLIC COMPOUND FOR BINDING SUBSTRATES WITH A CYANOCRYLATE ADHESIVE TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) 1992-05-05 US claimed
EP-0420293-A1 Primer TOAGOSEI CO., LTD. (JP) 1991-04-03 EP claimed
US-4818325-A BLEND WITH ORGANOMETALLIC COMPOUND AND ORGANIC POLYMERS TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) 1989-04-04 US claimed
US-4725496-A BORIC ACID TRI- OR DIESTERS LAYER; WEAR RESISTANCE FUJI PHOTO FILM CO., LTD. (JP) 1988-02-16 US claimed
EP-0129069-A2 Process for bonding non-polar or highly crystalline resin substrats to each other or to another material TOAGOSEI CHEMICAL INDUSTRY CO., LTD. (JP) 1984-12-27 EP claimed