SCHEMBL350303

SCHEMBL350303

C=C(CC1CCC2OC2C1)C(=O)OC

nearest known ligand 0.36

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
PPM1B O75688 2/20 0.36
PTPN1 P18031 2/20 0.36
PPP1CC P36873 2/20 0.36
ALDH1A1 P00352 1/20 0.31
PTGS1 P23219 1/20 0.30
PTGS2 P35354 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7189831 0.85 PPM1B (0.41) PPM1BPTPN1PPP1CCALDH1A1
SCHEMBL8764950 0.83 ALDH1A1 (0.32) ALDH1A1
SCHEMBL308407 0.80 TFPI2 (0.36) PPM1BPTPN1PPP1CC
SCHEMBL8848966 0.79 KDM4E (0.31)
SCHEMBL26927395 0.78
SCHEMBL352578 0.76
SCHEMBL1499489 0.75 ALDH1A1 (0.35) ALDH1A1
SCHEMBL27928142 0.74 KMT2A (0.41) ALDH1A1
SCHEMBL28943741 0.74 DPP4 (0.31)
SCHEMBL4663418 0.74 TFPI2 (0.38) PPM1BPTPN1PPP1CC

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 378 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118344257-A Modified cyclohexyl epoxy auxiliary agent for photo-curing solder resist ink and preparation method thereof 广东炎墨方案科技有限公司 2024-07-16 CN claimed
CN-118240525-A Single-component organic silica gel adhesive and preparation method and application thereof 湖南松井新材料股份有限公司 2024-06-25 CN claimed
CN-118085736-A Acrylic ester adhesive, preparation method and application 湖南松井新材料股份有限公司 2024-05-28 CN claimed
CN-117777342-B Water-based PVDC photo-thermal synergistic curing emulsion, preparation method and curing process thereof 山东兴鲁化工股份有限公司 2024-05-10 CN claimed
CN-117777342-A Water-based PVDC photo-thermal synergistic curing emulsion, preparation method and curing process thereof 山东兴鲁化工股份有限公司 2024-03-29 CN claimed
CN-117659351-A Silicon-nitrogen modified epoxy resin, preparation method thereof, photosensitive resin prepared from silicon-nitrogen modified epoxy resin and preparation method of photosensitive resin 上海信斯帝克新材料有限公司 2024-03-08 CN claimed
CN-114380929-B Functionalized (co) polymers for adhesive systems 德莎欧洲股份公司 2024-02-06 CN claimed
US-11685841-B2 Adhesives and related methods AVERY DENNISON CORPORATION (US) 2023-06-27 US claimed
CN-116179096-A Identification adhesive tape and preparation method thereof 东莞澳中新材料科技股份有限公司 2023-05-30 CN claimed
CN-116102692-A Cycloolefin/epoxy resin mixture, prepreg, composite material and preparation method 上海中化科技有限公司 2023-05-12 CN claimed
WO-2015105708-A1 ARTICLES, COMPOSITIONS, SYSTEMS, AND METHODS USING SELECTIVELY DETACKIFIED ADHESIVES AVERY DENNISON CORPORATION (US) 2015-07-16 WO claimed
US-20150191633-A1 Article, Compositions, Systems, and Methods Using Selectively Detackified Adhesives AVERY DENNISON CORPORATION 2015-07-09 US claimed
CN-102529056-B Preparation method for high melt strength poly lactic acid, and extruder thereof UNIV BEIJING TECH & BUSINESS 2014-12-03 CN claimed
CN-1707359-A Photosensitive paste composition, PDP electrode prepared therefrom, and PDP comprising the PDP electrode SAMSUNG SDI CO LTD (KR) 2005-12-14 CN claimed
EP-1027190-B1 COATED ABRASIVE PRODUCTS UCB SA (BE) 2003-07-23 EP claimed
US-6261740-B1 Processless, laser imageable lithographic printing plate KODAK POLYCHROME GRAPHICS, LLC 2001-07-17 US claimed
EP-1027190-A1 COATED ABRASIVE PRODUCTS UCB, S.A. (BE) 2000-08-16 EP claimed
WO-1998032566-A1 COATED ABRASIVE PRODUCTS UCB, S.A. (BE) 1998-07-30 WO claimed
US-5374682-A Hard, acid resistant automobile topcoatings NIPPON PAINT CO., LTD. (JP) 1994-12-20 US claimed
US-5096936-A Acrylate-epoxy KANSAI PAINT COMPANY, LIMITED (JP) 1992-03-17 US claimed