⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL337889 | 0.91 | — | — | |
| SCHEMBL27545857 | 0.88 | DNM1 (0.50) | — | |
| SCHEMBL10976189 | 0.88 | DNM1 (0.50) | — | |
| SCHEMBL28285509 | 0.88 | DNM1 (0.50) | — | |
| SCHEMBL29212525 | 0.88 | DNM1 (0.50) | — | |
| SCHEMBL11311844 | 0.88 | DNM1 (0.50) | — | |
| SCHEMBL10756322 | 0.88 | DNM1 (0.50) | — | |
| SCHEMBL10755363 | 0.88 | DNM1 (0.50) | — | |
| SCHEMBL3519238 | 0.88 | DNM1 (0.50) | — | |
| SCHEMBL10757071 | 0.88 | DNM1 (0.50) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2026100491-A1 | EPOXY RESIN COMPOSITION, CURED OBJECT, UNDERFILL MATERIAL, ADHESIVE, AND SEMICONDUCTOR PACKAGE AND PRODUCTION METHOD THEREFOR | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| WO-2026100487-A1 | UNDERFILL MATERIAL, CURED PRODUCT, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SAME | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| CN-115803323-B | Amine imide compound, amine imide composition, curing agent, epoxy resin composition, process for producing amine imide compound, sealing material, and adhesive | 旭化成株式会社 | 2025-05-16 | — | — | CN | disclosed |
| WO-2025028611-A1 | CURING AGENT FOR EPOXY RESINS, EPOXY RESIN COMPOSITION, CURED OBJECT, SEALING MATERIAL, AND ADHESIVE | 旭化成株式会社 | 2025-02-06 | — | — | WO | disclosed |
| WO-2025028598-A1 | CURING AGENT FOR EPOXY RESINS, EPOXY RESIN COMPOSITION, CURED OBJECT, SEALING MATERIAL, AND ADHESIVE | 旭化成株式会社 | 2025-02-06 | — | — | WO | disclosed |
| WO-2025028605-A1 | CURING AGENT, EPOXY RESIN COMPOSITION, CURED OBJECT, SEALING MATERIAL, AND ADHESIVE | 旭化成株式会社 | 2025-02-06 | — | — | WO | disclosed |
| US-20250034319-A1 | EPOXY RESIN COMPOSITION, CURED PRODUCT, ENCAPSULANT AND ADHESIVE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-01-30 | — | — | US | disclosed |
| CN-118302470-A | Epoxy resin composition, cured product, sealing material, and adhesive | 旭化成株式会社 | 2024-07-05 | — | — | CN | disclosed |
| WO-2023127800-A1 | EPOXY RESIN COMPOSITION, CURED PRODUCT, SEALING MATERIAL, AND ADHESIVE | 旭化成株式会社 | 2023-07-06 | — | — | WO | disclosed |
| US-20230212132-A1 | AMINIMIDE COMPOUND, AMINIMIDE COMPOSITION, CURING AGENT, EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING AMINIMIDE COMPOUND, ENCAPSULANT, AND ADHESIVE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-07-06 | — | — | US | disclosed |
| CN-101027611-A | Lithographic printing plate precursor | EASTMAN KODAK CO (US) | 2007-08-29 | — | — | CN | disclosed |
| CN-1739190-A | Fluorine-free plasma curing method for porous Low-K material | AXCELIS TECH INC (US) | 2006-02-22 | — | — | CN | disclosed |
| EP-0236646-B1 | ORTHO-ANISAMIDES, PROCESS FOR THEIR PREPARATION AND THEIR PHARMACEUTICAL APPLICATIONS | Laboratoires DELAGRANGE, Société Anonyme (FR) | 1990-10-10 | — | — | EP | disclosed |
| US-4914117-A | ANTIDEPRESSANTS, CENTRAL NERVOUS SYSTEM ACTIVATORS; DOPAMINE ANTAGONISTS | SOCIETE D'ETUDES SCIENTIFIQUES ET INDUSTRIELLE DE L'ILE-D-FRANCE (FR) | 1990-04-03 | — | — | US | disclosed |
| US-4883598-A | AGAROSE MODIFIED BY AMINO GROUPS | Riethorst, Waander (NL) | 1989-11-28 | — | — | US | disclosed |
| US-4835172-A | Novel benzamides, intermediates and process for the preparation and therapeutic use thereof | SOCIETE D'ETUDES SCIENTIFIQUES ET INDUSTRIELLES DE L'ILE-DE-FRANCE (FR) | 1989-05-30 | — | — | US | disclosed |
| EP-0303329-A1 | A process for isolating coagulation factors, and adsorbent material suitable therefor | UNIVERSITEIT TWENTE (NL) | 1989-02-15 | — | — | EP | disclosed |
| EP-0236646-A1 | Ortho-anisamides, process for their preparation and their pharmaceutical applications | Laboratoires DELAGRANGE, Société Anonyme (FR) | 1987-09-16 | — | — | EP | disclosed |
| US-4397965-A | HYDRAZINE DERIVATIVE BLOWING AGENT | UNIROYAL, INC. (US) | 1983-08-09 | — | — | US | disclosed |
| EP-0083173-A1 | Expandable and curable polyester composition and method for making same | UNIROYAL, INC. (US) | 1983-07-06 | — | — | EP | disclosed |