SCHEMBL35271

SCHEMBL35271

C=C(C)C(=O)OCC(C)C(COC(=O)C(=C)C)(COC(=O)C(=C)C)COC(=O)C(=C)C

nearest known ligand 0.60

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.60
THRB P10828 1/20 0.39
ALDH1A1 P00352 2/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL35547 0.87 TSHR (0.52) TSHRTHRBALDH1A1
SCHEMBL2495497 0.82 TSHR (0.51) TSHRTHRBALDH1A1
SCHEMBL17222398 0.81 TSHR (0.64) TSHRTHRBALDH1A1
SCHEMBL23493794 0.81 TSHR (0.64) TSHRTHRBALDH1A1
SCHEMBL7168756 0.81 TSHR (0.46) TSHRTHRBALDH1A1
SCHEMBL49067 0.80 TSHR (0.48) TSHRTHRBALDH1A1
SCHEMBL21123180 0.79 TSHR (0.62) TSHRTHRBALDH1A1
SCHEMBL10779259 0.79 TSHR (0.52) TSHRTHRBALDH1A1
SCHEMBL8850794 0.78 TSHR (0.50) TSHRTHRBALDH1A1
SCHEMBL3929660 0.78 TSHR (0.60) TSHRTHRBALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 209 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20140340891-A1 LED COLOR CONVERSION FILTER, METHOD OF MANUFACTURING SAME, AND LED MODULE INCLUDING SAME SOL COMPONENT CO., LTD. (KR) 2014-11-20 US claimed
EP-2770252-A1 LED COLOR CONVERSION FILTER, METHOD OF MANUFACTURING SAME, AND LED MODULE INCLUDING SAME Cho, Shim Hyun (KR) 2014-08-27 EP claimed
US-4526920-A Contains poly(meth)acrylic ester of oxy or polyoxyalkane polyol, polymerization initiator, filler MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1985-07-02 US claimed
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-16 US disclosed
EP-4660704-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2025-12-10 EP disclosed
US-20250355350-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-20 US disclosed
EP-4650874-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-11-19 EP disclosed
EP-4636485-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2025-10-22 EP disclosed
EP-4636011-A1 POLYMER, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-10-22 EP disclosed
US-12393130-B2 Electrophotographic photosensitive member, process cartridge, and electrophotographic apparatus CANON KABUSHIKI KAISHA (JP) 2025-08-19 US disclosed
EP-3936576-B1 BLACK ALUMINUM PIGMENT AND METHOD OF PRODUCING SAME TOYO ALUMINIUM KK (JP) 2025-05-28 EP disclosed
EP-0785565-A1 Phosphor pattern, processes for preparing the same and photosensitive element to be used for the same Hitachi Chemical Co., Ltd. (JP) 1997-07-23 EP disclosed
EP-0770923-A1 Photosensitive resin composition and photosensitive resin laminated film containing the same TOKYO OHKA KOGYO CO., LTD. (JP) 1997-05-02 EP disclosed
EP-0768573-A1 Phosphor-containing photosensitive resin composition for use in manufacturing plasma display panel Hitachi Chemical Co., Ltd. (JP) 1997-04-16 EP disclosed
EP-0741332-A1 Photosensitive resin composition for sandblast resist MATSUSHITA ELECTRONICS CORPORATION (JP) 1996-11-06 EP disclosed
EP-0475086-A1 Photo-sensitive polymer composition HITACHI, LTD. (JP) 1992-03-18 EP disclosed
EP-0100688-B1 CURABLE COATING COMPOSITION MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1987-04-22 EP disclosed
US-4526920-A Contains poly(meth)acrylic ester of oxy or polyoxyalkane polyol, polymerization initiator, filler MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1985-07-02 US disclosed
EP-0100688-A2 Curable coating composition MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1984-02-15 EP disclosed
US-4426243-A Room-temperature-curable, quick-setting acrylic/epoxy adhesives and methods of bonding ILLINOIS TOOL WORKS INC. (US) 1984-01-17 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT ARCN1, PRDM9, LBR TSHR 3214/4885THRB 3424/4885ALDH1A1 3706/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.