SCHEMBL49067

SCHEMBL49067

C=C(C)C(=O)OCC(CO)(CO)C(C)CO

nearest known ligand 0.48

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.48
THRB P10828 1/20 0.38
ALDH1A1 P00352 2/20 0.36
POLB P06746 1/20 0.32
APEX1 P27695 1/20 0.32
HTT P42858 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
TGFBR1 P36897 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL35547 0.93 TSHR (0.52) TSHRTHRBALDH1A1POLBAPEX1
SCHEMBL16149527 0.89 TSHR (0.42) TSHRTHRBALDH1A1TDP1
SCHEMBL6753256 0.88 TSHR (0.44) TSHRTHRBALDH1A1POLBAPEX1
SCHEMBL3805422 0.85 TSHR (0.42) TSHRTHRBALDH1A1
SCHEMBL1887613 0.83 TSHR (0.47) TSHRTHRBALDH1A1
SCHEMBL9705820 0.83 TSHR (0.46) TSHRTHRBALDH1A1POLBAPEX1
SCHEMBL3376993 0.80 TSHR (0.43) TSHRTHRBALDH1A1
SCHEMBL7647367 0.80 TSHR (0.43) TSHRTHRBALDH1A1
SCHEMBL35271 0.80 TSHR (0.60) TSHRTHRBALDH1A1
SCHEMBL23012599 0.79 TSHR (0.46) TSHRTHRBALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 271 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240018399-A1 RADIATION CURABLE (METH) ACRYLIC ADHESIVE COMPOSITION HENKEL AG & CO. KGAA (DE) 2024-01-18 US claimed
US-9139748-B2 Photocurable ink composition for inkjet printing, and printed material SAKATA INX CORP. (JP) 2015-09-22 US claimed
US-8198003-B2 minimize the refractive indices difference by using a high refractive index organic component and a low refractive index inorganic component; nontoxic, inexpensive, thermal decomposition; high resolution, high compactness by exposure to light only once; butyl methacrylate-methy methacrylate copolymer SAMSUNG SDI CO., LTD. (KR) 2012-06-12 US claimed
US-8129023-B2 Polymer particles, conductive particles, and an anisotropic conductive packaging materials containing the same CHEIL INDUSTRIES INC. (KR) 2012-03-06 US claimed
US-7851063-B2 a polymer containing styrene based monomers, divinylbenzene and a crosslinkable monomer selected from allyl monomers, acrylated polyethers, acrylated polysiloxanes, acrylated polyurethanes divinylpolysiloxanes etc.; exhibit superior electrical reliability; compressive deformability and recoverability CHEIL INDUSTRIES INC. (KR) 2010-12-14 US claimed
EP-1967903-B1 Photosensitive paste composition, barrier rib prepared using the composition and plasma display panel comprising the barrier rib SAMSUNG SDI CO LTD (KR) 2009-09-23 EP claimed
US-20080220368-A1 PHOTOSENSITIVE PASTE COMPOSITION, BARRIER RIB PREPARED USING THE COMPOSITION AND PLASMA DISPLAY PANEL COMPRISING THE BARRIER RIB SAMSUNG SDI CO., LTD. (KR) 2008-09-11 US claimed
EP-1967903-A1 Photosensitive paste composition, barrier rib prepared using the composition and plasma display panel comprising the barrier rib Samsung SDI Co., Ltd. (KR) 2008-09-10 EP claimed
US-20080026320-A1 PHOTOSENSITIVE PASTE COMPOSITION, BARRIER RIB PREPARED USING THE COMPOSITION AND PLASMA DISPLAY PANEL COMPRISING THE BARRIER RIB SAMSUNG SDI CO., LTD. (KR) 2008-01-31 US claimed
US-20070295943-A1 a polymer containing styrene based monomers, divinylbenzene and a crosslinkable monomer selected from allyl monomers, acrylated polyethers, acrylated polysiloxanes, acrylated polyurethanes divinylpolysiloxanes etc.; exhibit superior electrical reliability; compressive deformability and recoverability CHEIL INDUSTRIES INC. (KR) 2007-12-27 US claimed
EP-1870771-A2 Photosensitive paste composition, barrier rib prepared using the composition and plasma display panel comprising the barrier rib Samsung SDI Co., Ltd. (KR) 2007-12-26 EP claimed
US-20070252112-A1 Polymer Particles, Conductive Particles, and an Anisotropic Conductive Packaging Materials Containing the Same CHEIL INDUSTRIES INC. (KR) 2007-11-01 US claimed
WO-2006090950-A1 POLYMER PARTICLES AND CONDUCTIVE PARTICLES HAVING ENHANCED CONDUCTING PROPERTIES AND AN ANISOTROPIC CONDUCTIVE PACKAGING MATERIALS CONTAINING THE SAME CHEIL INDUSTRIES INC. (KR) 2006-08-31 WO claimed
US-6043328-A MOLDINGS, CONTACT LENSES, CORNEAL IMPLANTS OR BIOMEDICAL ARTICLES, NOVARTIS AG (CH) 2000-03-28 US claimed
EP-0826158-B1 POLYSILOXANE-POLYOL MACROMERS, THEIR PREPARATION AND THEIR USE NOVARTIS AG (CH) 1999-09-15 EP claimed
EP-0826158-A1 POLYSILOXANE-POLYOL MACROMERS, THEIR PREPARATION AND THEIR USE Novartis AG (CH) 1998-03-04 EP claimed
WO-1996036890-A1 POLYSILOXANE-POLYOL MACROMERS, THEIR PREPARATION AND THEIR USE NOVARTIS AG (CH) 1996-11-21 WO claimed
EP-4400223-A1 DIGITAL EMBOSSING CREATION METHOD Sakata INX Corporation (JP) 2024-07-17 EP disclosed
US-4510181-A FORMING CORROSION PROTECTIVE LAYER ON SURFACE USING VINYL MONOMERS AND/OR VINLY GROUP CONTAINING OLIGOMER NITTO ELECTRIC INDUSTRIAL CO., LTD. (JP) 1985-04-09 US disclosed
EP-0115217-A1 Method of forming corrosion-protective coating layers NITTO ELECTRIC INDUSTRIAL CO., LTD. (JP) 1984-08-08 EP disclosed