SCHEMBL352927

SCHEMBL352927

C=C(C)C(=O)OCCC1CO1

nearest known ligand 0.68

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.68
THRB P10828 1/20 0.47
TSHR P16473 4/20 0.46
CYP3A4 P08684 2/20 0.37
TP53 P04637 1/20 0.37
POLB P06746 1/20 0.36
APEX1 P27695 1/20 0.36
HTT P42858 1/20 0.36
TDP1 Q9NUW8 1/20 0.36
CA1 P00915 1/20 0.34
CA2 P00918 1/20 0.34
EPHX1 P07099 1/20 0.32
CYP2D6 P10635 1/20 0.31
CYP2C19 P33261 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20505422 1.00 ALDH1A1 (0.68) ALDH1A1THRBTSHRCYP3A4TP53
SCHEMBL21059527 0.90 ALDH1A1 (0.60) ALDH1A1THRBTSHRCYP3A4TP53
SCHEMBL970598 0.89 ALDH1A1 (0.64) ALDH1A1THRBTSHRCYP3A4TP53
SCHEMBL28273779 0.89 ALDH1A1 (0.55) ALDH1A1THRBTSHRCYP3A4TP53
SCHEMBL1357079 0.88 ALDH1A1 (0.62) ALDH1A1THRBTSHRCYP3A4TP53
SCHEMBL9481747 0.86 ALDH1A1 (0.60) ALDH1A1THRBTSHRCYP3A4TP53
SCHEMBL491230 0.86 ALDH1A1 (0.60) ALDH1A1THRBTSHRCYP3A4TP53
SCHEMBL6663770 0.86 ALDH1A1 (0.60) ALDH1A1THRBTSHRCYP3A4TP53
SCHEMBL353873 0.86 ALDH1A1 (0.60) ALDH1A1THRBTSHRCYP3A4TP53
SCHEMBL247751 0.86 ALDH1A1 (0.54) ALDH1A1THRBTSHRCYP3A4TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1417 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025053650-A1 PREPARATION METHOD OF DICYCLOPENTADIENE-BASED EPOXY RESINS 한화솔루션 주식회사 2025-03-13 WO claimed
CN-112241107-B Positive photosensitive resin composition, photosensitive resin film and display device using the same 株式会社东进世美肯 2025-03-11 CN claimed
CN-110967927-B Photosensitive resin composition and display device including the same 三星显示有限公司 2025-01-28 CN claimed
CN-114381156-B Metal oxide dispersion composition, method for producing same, film composition containing same, optical film, and optical element 凯斯科技股份有限公司 2024-03-12 CN claimed
CN-117002108-A Composite aluminum foil aluminum plastic film and preparation method thereof 扬州纳力新材料科技有限公司 2023-11-07 CN claimed
CN-108572516-B Positive photosensitive resin composition, display device and pattern forming method thereof 株式会社东进世美肯 2023-10-17 CN claimed
CN-113121988-B Composite material and foam prepared from same 财团法人工业技术研究院 2023-05-30 CN claimed
CN-116068853-A Photosensitive resin composition and display device 三星显示有限公司 2023-05-05 CN claimed
CN-115710380-A Inorganic particle dispersion liquid with improved transparency and optical element for display 凯斯科技股份有限公司 2023-02-24 CN claimed
CN-115710438-A Metal oxide dispersion, thin film composition for display, and optical element for display 凯斯科技股份有限公司 2023-02-24 CN claimed
EP-1211556-B1 Thermally developable imaging materials containing surface barrier layer EASTMAN KODAK CO (US) 2005-11-02 EP claimed
CN-1568444-A Photosnesitive resin composition comprising quinonediazide sulfate ester compound DONGJIN SEMICHEM CO LTD (KR) 2005-01-19 CN claimed
CN-1543591-A Photosensitive resin composition for photoresist 东进瑟弥侃株式会社 2004-11-03 CN claimed
US-20040115558-A1 Photosensitive resin composition controlling solubility and pattern formation method of double-layer structure using the same DONGJIM SEMICHEM CO., LTD. (KR) 2004-06-17 US claimed
EP-1211556-A2 Thermally developable imaging materials containing surface barrier layer EASTMAN KODAK COMPANY (US) 2002-06-05 EP claimed
US-6350561-B1 Thermally developable imaging materials containing surface barrier layer EASTMAN KODAK COMPANY 2002-02-26 US claimed
US-5530036-A STORAGE STABLE THERMOSETTING RESIN COMPOSITIONS JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1996-06-25 US claimed
US-5399604-A Thermosetting resin composition comprising /A/ copolymer of unsaturated carboxylic acid or anhydride, unsaturated compound with epoxy group, unsaturated carboxylic acid ester or other vinyl compound, /B/ organic solvent, /C/ silane coupler JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1995-03-21 US claimed
US-4332694-A IMMOBILIZATION OF ENZYMES CESKOSLOVENSKA AKADEMIE VED (CS) 1982-06-01 US claimed
US-4049867-A ABRASION RESISTANT, TRANSPARENT JAPAN ATOMIC ENERGY RESEARCH INSTITUTE (JA) 1977-09-20 US claimed