SCHEMBL353354

SCHEMBL353354

CC(O)N(CCN(C(C)O)C(C)O)C(C)O

nearest known ligand 0.40

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.36
LMNA P02545 1/20 0.36
TSHR P16473 2/20 0.35
TDP1 Q9NUW8 1/20 0.35
MEN1 O00255 1/20 0.33
KMT2A Q03164 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2058244 0.87 CA12 (0.40) ALDH1A1TSHRTDP1
SCHEMBL2058196 0.85
SCHEMBL97471 0.83 TSHR (0.37) TSHRTDP1
SCHEMBL8764178 0.83 TSHR (0.35) ALDH1A1TSHRTDP1
SCHEMBL2058561 0.83 MAPT (0.40) TSHRTDP1
SCHEMBL2845420 0.83 TSHR (0.32) TSHR
SCHEMBL530288 0.81 TRPV1 (0.31)
SCHEMBL1641650 0.81
SCHEMBL346949 0.81 TDP1 (0.40) TDP1
SCHEMBL10889627 0.81 MEN1 (0.60) ALDH1A1LMNATSHRMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 252 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260008948-A1 POLISHING LIQUID, POLISHING LIQUID SET, POLISHING METHOD, COMPONENT PRODUCTION METHOD, AND SEMICONDUCTOR COMPONENT PRODUCTION METHOD RESONAC CORP (JP) 2026-01-08 US claimed
US-20260008949-A1 POLISHING LIQUID, POLISHING LIQUID SET, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD RESONAC CORP (JP) 2026-01-08 US claimed
US-20260002063-A1 CMP POLISHING LIQUID, CMP POLISHING LIQUID SET, AND POLISHING METHOD RESONAC CORP (JP) 2026-01-01 US claimed
EP-4657504-A1 POLISHING LIQUID, POLISHING LIQUID SET, POLISHING METHOD, COMPONENT PRODUCTION METHOD, AND SEMICONDUCTOR COMPONENT PRODUCTION METHOD Resonac Corporation (JP) 2025-12-03 EP claimed
EP-4657503-A1 POLISHING LIQUID, POLISHING LIQUID SET, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD Resonac Corporation (JP) 2025-12-03 EP claimed
EP-4175921-B1 FREE-FLOWING POWDER COMPRISING A POROUS SUBSTRATE FUNCTIONALIZED WITH AT LEAST ONE ACCELERATOR SIKA TECH AG (CH) 2025-09-10 EP claimed
US-20250115795-A1 POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP, AND POLISHING METHOD RESONAC CORPORATION (JP) 2025-04-10 US claimed
US-20240336810-A1 POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP AND POLISHING METHOD RESONAC CORPORATION (JP) 2024-10-10 US claimed
US-20240336809-A1 POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP, AND POLISHING METHOD RESONAC CORPORATION (JP) 2024-10-10 US claimed
EP-4379776-A1 POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP AND POLISHING METHOD Resonac Corporation (JP) 2024-06-05 EP claimed
US-20090292041-A1 AMINE CONTAINING STRENGTH IMPROVEMENT ADMIXTURE CONSTRUCTION RESEARCH & TECHNOLOGY GMBH (DE) 2009-11-26 US claimed
US-7556684-B2 Amine containing strength improvement admixture CONSTRUCTION RESEARCH & TECHNOLOGY GMBH (DE) 2009-07-07 US claimed
EP-1725604-B1 CARBOXYLIC ACID COMPOUNDS COMPRISING ESTER BONDS AND POLYAMIDES PRODUCED THEREFROM LANXESS DEUTSCHLAND GMBH (DE) 2009-04-29 EP claimed
US-20090084406-A1 Composition for stripping and stripping method SAMSUNG ELECTRONICS CO., LTD. 2009-04-02 US claimed
US-20050188896-A1 Amine containing strength improvement admixture CONSTRUCTION RESEARCH & TECHNOLOGY GMBH 2005-09-01 US claimed
US-20040198873-A1 Strength improvement admixture CONSTRUCTION RESEARCH AND TECHNOLOGY GMBH 2004-10-07 US claimed
EP-1059947-B1 WATER-ABSORBING, CROSS-LINKED POLYMERIZATES IN THE FORM OF A FOAM, A METHOD FOR THE PRODUCTION THEREOF, AND THEIR USE BASF AG (DE) 2004-09-29 EP claimed
US-6750262-B1 USE IN HYGIENE ARTICLES EMPLOYED TO ABSORB BODY FLUIDS AND IN DRESSING MATERIAL FOR COVERING WOUNDS BASF AKTIENGESELLSCHAFT (DE) 2004-06-15 US claimed
US-6455600-B1 FOAMING A POLYMERIZABLE AQUEOUS MIXTURE CONSISTS OF UNSATURATED ACIDIC MONOMER OPTIONALLY NEUTRALIZED, CROSSLINKERS, INITIATORS AND SURFACTANT, POLYMERIZING THE MONOMER(S) WHILE NEUTRALIZING ACIDIC GROUP WITH AMINES BASF AKTIENGESELLSCHAFT (DE) 2002-09-24 US claimed
US-4076618-A ALKANOLAMINES; ELECTROLESS METAL DEPOSITION BY-PRODUCTS PHOTOCIRCUITS DIVISION OF KOLLMORGEN CORPORATION (US) 1978-02-28 US claimed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260008949-A1 POLISHING LIQUID, POLISHING LIQUID SET, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD F12, EPM2A, SEM1 ALDH1A1 3865/4885LMNA 43/4885TSHR 4300/4885
US-20260002063-A1 CMP POLISHING LIQUID, CMP POLISHING LIQUID SET, AND POLISHING METHOD H1-0, H1-5, H1-2 ALDH1A1 3856/4885LMNA 50/4885TSHR 3918/4885
US-20260008948-A1 POLISHING LIQUID, POLISHING LIQUID SET, POLISHING METHOD, COMPONENT PRODUCTION METHOD, AND SEMICONDUCTOR COMPONENT PRODUCTION METHOD EPM2A, AGL, VCL ALDH1A1 4483/4885LMNA 258/4885TSHR 3957/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.