⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3545446 | 0.87 | — | — | |
| SCHEMBL3546170 | 0.87 | KDM4E (0.31) | — | |
| SCHEMBL3544745 | 0.81 | PTGS1 (0.32) | — | |
| SCHEMBL3541644 | 0.78 | — | — | |
| SCHEMBL18498 | 0.76 | TSHR (0.37) | — | |
| SCHEMBL9924687 | 0.76 | TFPI2 (0.32) | — | |
| SCHEMBL15722855 | 0.76 | — | — | |
| SCHEMBL9815710 | 0.76 | TSHR (0.37) | — | |
| SCHEMBL30928250 | 0.76 | TSHR (0.37) | — | |
| SCHEMBL16120 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7732627-B2 | High-purity cycloaliphatic diepoxy compound and preparation process thereof | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2010-06-08 | — | — | US | disclosed |
| US-20080045729-A1 | High-Purity Cycloaliphatic Diepoxy Compound and Preparation Process Thereof | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2008-02-21 | — | — | US | disclosed |
| EP-1834949-A1 | HIGH-PURITY ALICYCLIC DIEPOXY COMPOUND AND PROCESS FOR PRODUCING THE SAME | Daicel Chemical Industries, Ltd. (JP) | 2007-09-19 | — | — | EP | disclosed |
| US-20070179256-A1 | High-purity alicyclic epoxy compound, process for production of the same, curable epoxy resin composition, cured product thereof, and application thereof | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2007-08-02 | — | — | US | disclosed |
| EP-1726588-A1 | HIGH-PURITY ALICYCLIC EPOXY COMPOUND, PROCESS FOR PRODUCING THE SAME, CURABLE EPOXY RESIN COMPOSITION, CURED ARTICLE THEREOF, AND USE | Daicel Chemical Industries, Ltd. (JP) | 2006-11-29 | — | — | EP | disclosed |