⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28363167 | 0.92 | MAPT (0.31) | — | |
| SCHEMBL3554606 | 0.89 | — | — | |
| SCHEMBL6318600 | 0.81 | MAPT (0.36) | — | |
| SCHEMBL13571631 | 0.77 | MAPT (0.35) | — | |
| SCHEMBL7225302 | 0.75 | PRSS1 (0.32) | — | |
| SCHEMBL9420520 | 0.74 | MAPT (0.32) | — | |
| SCHEMBL7225298 | 0.73 | PRSS1 (0.33) | — | |
| SCHEMBL7933762 | 0.73 | MAPT (0.33) | — | |
| SCHEMBL13571378 | 0.73 | MAPT (0.33) | — | |
| SCHEMBL11241837 | 0.73 | MAPK1 (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2546275-B1 | Curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic parts, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulation. | DAICEL CORP (JP) | 2023-09-20 | — | — | EP | disclosed |
| EP-2546275-A2 | Curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic parts, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulation. | Daicel Chemical Industries, Ltd. (JP) | 2013-01-16 | — | — | EP | disclosed |
| US-7781543-B2 | Curable alicyclic diepoxy resin composition | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2010-08-24 | — | — | US | disclosed |
| US-20090131547-A1 | Process for preparation of alicyclic diepoxy compounds, curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic parts, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulation | MAESHIMA HISASHI | 2009-05-21 | — | — | US | disclosed |
| US-20060009547-A1 | Process for preparation of alicyclic diepoxy compound, curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic components, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulation | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2006-01-12 | — | — | US | disclosed |
| EP-1541567-A1 | PROCESS FOR PREPARATION OF ALICYCLIC DIEPOXY COMPOUNDS, CURABLE EPOXY RESIN COMPOSITIONS, EPOXY RESIN COMPOSITIONS FOR THE ENCAPSULATION OF ELECTRONIC COMPONENTS, STABILIZERS FOR ELECTRICAL INSULATING OILS, AND CASTING EPOXY RESIN COMPOSITIONS FOR ELECTRICAL INSULATION | DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) | 2005-06-15 | — | — | EP | disclosed |