SCHEMBL7225302

SCHEMBL7225302

O=C(O)OC(C1CC=CCC1)C1CC=CCC1

nearest known ligand 0.43

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
PRSS1 P07477 1/20 0.32
CTSG P08311 1/20 0.32
CTRB1 P17538 1/20 0.32
CMA1 P23946 1/20 0.32
KDM4E B2RXH2 1/20 0.31
ALDH1A1 P00352 1/20 0.31
TDP1 Q9NUW8 1/20 0.31
LMNA P02545 1/20 0.30
TP53 P04637 1/20 0.30
TSHR P16473 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7225298 0.86 PRSS1 (0.33) PRSS1CTSGCTRB1CMA1ALDH1A1
SCHEMBL11566611 0.81 PRSS1 (0.31) PRSS1CTSGCTRB1CMA1KDM4E
SCHEMBL11566614 0.80 LMNA (0.35) ALDH1A1LMNA
SCHEMBL3554606 0.75
SCHEMBL3554608 0.75
SCHEMBL28363167 0.74 MAPT (0.31)
SCHEMBL3087559 0.72
SCHEMBL7231832 0.72 PRSS1 (0.34) PRSS1CTSGCTRB1CMA1KDM4E
SCHEMBL8444186 0.72 TSHR (0.37) PRSS1CTSGCTRB1CMA1KDM4E
SCHEMBL17601890 0.71 ALDH1A1 (0.32) ALDH1A1LMNATP53TSHRSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6570029-B2 Encapsulation of electronics GEORGIA TECH RESEARCH CORP. 2003-05-27 US disclosed
US-6498260-B2 POLYEPOXIDES; ELECTRONIC PACKAGES GEORGIA TECH RESEARCH CORP. 2002-12-24 US disclosed
US-20020035201-A1 No-flow reworkable epoxy underfills for flip-chip applications GEORGIA TECH RESEARCH CORPORATION 2002-03-21 US disclosed
US-20020013420-A1 Thermally degradable epoxy underfills for flip-chip applications GEORGIA TECH RESEARCH CORP. 2002-01-31 US disclosed
WO-2001088959-A2 NO-FLOW REWORKABLE EPOXY UNDERFILLS FOR FLIP-CHIP APPLICATIONS GEORGIA TECH RESEARCH CORPORATION (US) 2001-11-22 WO disclosed
WO-2001072898-A1 THERMALLY DEGRADABLE EPOXY UNDERFILLS FOR FLIP-CHIP APPLICATIONS GEORGIA TECH RESEARCH CORPORATION (US) 2001-10-04 WO disclosed