SCHEMBL35685

SCHEMBL35685

NCC1CO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4205854 1.00
SCHEMBL7915921 1.00
Water SCHEMBL8589710 0.96 ALDH1A1 (0.42)
Ammonia Solution, Strong SCHEMBL6556391 0.96
Ammonia Solution, Strong SCHEMBL4903402 0.96
Bromide SCHEMBL10573415 0.96
Hydrochloric Acid SCHEMBL3392067 0.96
Benzene SCHEMBL175819 0.90 SLC6A2 (0.40)
Butane SCHEMBL23781829 0.87
SCHEMBL23828867 0.85 ALDH1A1 (0.72)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 27230 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260146163-A1 CHEMICAL- AND UV-RESISTANT SURFACING FILM MATERIAL AND PREPREGS HEXCEL CORPORATION (US) 2026-05-28 US claimed
US-20260148973-A1 ELECTRODE FOR RECHARGEABLE LITHIUM BATTERIES, MANUFACTURING METHOD THEREOF, AND RECHARGEABLE LITHIUM BATTERIES INCLUDING THE SAME SAMSUNG SDI CO., LTD. (KR) 2026-05-28 US claimed
EP-4748871-A1 EPOXY RESIN COMPOSITION, CURED PRODUCT, AND JOINED BODY Konica Minolta, Inc. (JP) 2026-05-27 EP claimed
CN-122080363-A Room-temperature-curable epoxy resin raw material composition, room-temperature-curable epoxy resin, and preparation method and application thereof 2026-05-26 CN claimed
CN-122078011-A Ultrathin back drill pad plate and preparation method thereof, circuit board and preparation method thereof 2026-05-26 CN claimed
CN-122080734-A Coating liquid for preparing high-temperature-resistant high-heat-conductivity epoxy-based conductive film, and preparation method and application thereof 2026-05-26 CN claimed
US-12637536-B2 Epoxy resin composition, prepreg, fiber-reinforced resin molded body, and integrated product TORAY INDUSTRIES, INC. (JP) 2026-05-26 US claimed
US-12637935-B2 Compositions and methods for use of proppant surface chemistry to improve proppant consolidation and flowback control CARBO CERAMICS INC. (US) 2026-05-26 US claimed
CN-120044753-B Photosensitive dry film, photosensitive resin composition, cured film and printed circuit board Hangzhou foster Electronic Materials Co.,Ltd. (CN) 2026-05-26 CN claimed
US-12637537-B2 Ambient temperature curable coating and uses therein WASHINGTON STATE UNIVERSITY (US) 2026-05-26 US claimed
US-4368299-A MOLDING MATERIALS, LAMINATION, PAINTS, ADHESIVES SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1983-01-11 US claimed
US-4360649-A EPOXY RESIN, EPOXIDE-DIALKYLAMINE ADDUCT, UREA COMPOUND, CURING AGENTS SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1982-11-23 US claimed
US-4323662-A Thermosetting resin compositions comprising bismaleimides and alkenylaniline derivatives MITSUI TOATSU CHEMICALS, INC. (JP) 1982-04-06 US claimed
EP-0009110-B1 USE OF POLYGLYCIDYLAMINES AS ADDITIVES IN AQUEOUS COATING COMPOSITIONS BASF Aktiengesellschaft (DE) 1982-03-24 EP claimed
EP-0039230-A2 Curable composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1981-11-04 EP claimed
US-4291144-A Epoxy-based curable compositions SHIN-ETSU CHEMICAL CO., LTD. (JP) 1981-09-22 US claimed
EP-0030332-A1 Use of 2-hydroxypropylimidazoles as oil-soluble corrosion inhibitors BASF Aktiengesellschaft (DE) 1981-06-17 EP claimed
US-4255310-A Aqueous paints which contain polyglycidylamines as additives BASF AKTIENGESELLSCHAFT (DE) 1981-03-10 US claimed
US-4174440-A Ionic pullulan gels and production thereof SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1979-11-13 US claimed
US-3957580-A Immobilized microbial cells PFIZER INC. (US) 1976-05-18 US claimed