SCHEMBL35860

SCHEMBL35860

CCC1(COCC2C3CCC(C3)C2COCC2(CC)COC2)COC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2572807 0.83
SCHEMBL2468977 0.83
SCHEMBL2575040 0.82
SCHEMBL13183233 0.81
SCHEMBL1780373 0.80 TSHR (0.31)
SCHEMBL26525830 0.80 TSHR (0.31)
SCHEMBL3777291 0.80
SCHEMBL9934961 0.79 TSHR (0.30)
SCHEMBL439901 0.77 TSHR (0.36)
SCHEMBL24571159 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 81 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3613789-B1 COMPOSITION FOR ENCAPSULATING ORGANIC ELECTRONIC ELEMENT LG CHEMICAL LTD (KR) 2024-07-24 EP disclosed
WO-2024135756-A1 CURABLE ADHESIVE COMPOSITION 東亞合成株式会社 2024-06-27 WO disclosed
WO-2024135755-A1 CURABLE ADHESIVE AGENT COMPOSITION 東亞合成株式会社 2024-06-27 WO disclosed
CN-110028465-B Novel compound, composition containing same, and cured product of composition 克美 2023-12-15 CN disclosed
WO-2023238836-A1 SILSESQUIOXANE DERIVATIVE AND METHOD FOR PRODUCING SAME, CURABLE COMPOSITION, HARD COAT AGENT, CURED PRODUCT, HARD COAT, AND BASE MATERIAL 東亞合成株式会社 2023-12-14 WO disclosed
EP-4289618-A1 UNDERCOAT AGENT COMPOSITION FOR INORGANIC SUBSTANCE LAYER LAMINATION, CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING SAME Toagosei Co., Ltd. (JP) 2023-12-13 EP disclosed
EP-3719091-B1 POLARIZING PLATE, IMAGE DISPLAY APPARATUS COMPRISING SAME, AND ADHESIVE COMPOSITION FOR POLARIZING PLATE SHANJIN OPTOELECTRONICS NANJING CO LTD (CN) 2023-11-22 EP disclosed
US-11787971-B2 Polarizing plate, image display device comprising same and photocurable composition for polarizing plate protection layer SHANJIN OPTOELECTRONICS (SUZHOU) CO., LTD. (CN) 2023-10-17 US disclosed
CN-116897195-A Primer composition for inorganic substance layer lamination, cured product thereof, and method for producing same 东亚合成株式会社 2023-10-17 CN disclosed
US-20230303761-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT, LENS, AND LENS WITH A SUBSTRATE AGC Inc. (JP) 2023-09-28 US disclosed
US-8304470-B2 Resin composition for optical components, optical component using the same and production method of optical lens NITTO DENKO CORPORATION (JP) 2012-11-06 US disclosed
US-20120010319-A1 PHOTOCURABLE RESIN COMPOSITION AND OPTICAL COMPONENT USING THE SAME NITTO DENKO CORPORATION (JP) 2012-01-12 US disclosed
US-20120010320-A1 PHOTOCURABLE RESIN COMPOSITION AND OPTICAL COMPONENT USING THE SAME NITTO DENKO CORPORATION (JP) 2012-01-12 US disclosed
US-20110280531-A1 RESIN COMPOSITION FOR PRODUCTION OF OPTICAL WAVEGUIDE, AND OPTICAL WAVEGUIDE PRODUCED BY USING THE RESIN COMPOSITION NITTO DENKO CORPORATION (JP) 2011-11-17 US disclosed
US-20110054063-A1 ORGANOSILICON COMPOUNDS WHICH HAVE OXETANYL GROUPS, AND A METHOD FOR THE PRODUCTION AND CURABLE COMPOSITIONS OF THE SAME TOAGOSEI CO., LTD. (JP) 2011-03-03 US disclosed
US-20100292358-A1 RESIN COMPOSITION FOR OPTICAL COMPONENTS AND OPTICAL COMPONENT USING THE SAME NITTO DENKO CORPORATION (JP) 2010-11-18 US disclosed
US-20100009149-A1 TRANSPARENT COMPOSITE SHEET SUMITOMO BAKELITE CO., LTD. (JP) 2010-01-14 US disclosed
US-20090295003-A1 RESIN COMPOSITION FOR OPTICAL COMPONENTS, OPTICAL COMPONENT USING THE SAME AND PRODUCTION METHOD OF OPTICAL LENS NITTO DENKO DENKO CORPORATION (JP) 2009-12-03 US disclosed
EP-2128183-A1 Resin composition for optical components, optical component using the same and production method of optical lens Nitto Denko Corporation (JP) 2009-12-02 EP disclosed
EP-2077288-A1 TRANSPARENT COMPOSITE SHEET Sumitomo Bakelite Co., Ltd. (JP) 2009-07-08 EP disclosed