SCHEMBL360607

SCHEMBL360607

[SiH3]OCCCl

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5694305 0.77
SCHEMBL267349 0.74
SCHEMBL4073193 0.72
SCHEMBL28761489 0.72
SCHEMBL7980217 0.72 ALDH1A1 (0.38)
SCHEMBL2169896 0.67
SCHEMBL58439 0.64
SCHEMBL6525198 0.64
SCHEMBL2909540 0.64
SCHEMBL467598 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 88 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-102174055-B Methyl tri(2-chloroethoxy) silane compound and preparation method thereof USTC UNIV SCIENCE TECH CN 2012-12-26 CN claimed
CN-102174055-A Methyl tri(2-chloroethoxy) silane compound and preparation method thereof USTC UNIV SCIENCE TECH CN 2011-09-07 CN claimed
US-5599387-A VAPOR FOR PYROLYTIC DEPOSITION OF SILICON DIOXIDE COMPRISING CARRIER GAS, SOURCE OF OXYGEN, SILICON COMPOUND HAVING SIICON-OXYGEN BOND PPG INDUSTRIES, INC. (US) 1997-02-04 US claimed
CN-118574952-A Composite copper component and power module comprising same 纳美仕有限公司 2024-08-30 CN disclosed
CN-109844030-B Heat conductive silicone composition 信越化学工业株式会社 2022-04-26 CN disclosed
CN-109312159-B Heat-conductive silicone composition and cured product thereof 信越化学工业株式会社 2021-07-02 CN disclosed
CN-108473770-B Silicone composition combining condensation curing reaction and organic peroxide curing reaction 信越化学工业株式会社 2021-05-11 CN disclosed
WO-2019155846-A1 THERMOCONDUCTIVE SILICONE COMPOSITION, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD 信越化学工業株式会社 2019-08-15 WO disclosed
CN-109844030-A Heat-conductive silicone composition 信越化学工业株式会社 2019-06-04 CN disclosed
CN-109312159-A Heat-conductive silicone composition and cured product thereof 信越化学工业株式会社 2019-02-05 CN disclosed
CN-105121555-B Curable composition, cured product, method for using curable composition, optical element sealing body, and method for producing optical element sealing body 琳得科株式会社 2018-09-18 CN disclosed
US-5776236-A INCRESED DEPOSITION RATE PPG INDUSTRIES, INC. (US) 1998-07-07 US disclosed
US-5599387-A VAPOR FOR PYROLYTIC DEPOSITION OF SILICON DIOXIDE COMPRISING CARRIER GAS, SOURCE OF OXYGEN, SILICON COMPOUND HAVING SIICON-OXYGEN BOND PPG INDUSTRIES, INC. (US) 1997-02-04 US disclosed
EP-0342521-B1 PROCESS FOR PURIFYING CRUDE GASEOUS HYDROGEN CHLORIDE WACKER-CHEMIE GMBH (DE) 1992-09-02 EP disclosed
US-4935220-A Process for purifying crude gaseous hydrogen chloride WACKER-CHEMIE GMBH (DE) 1990-06-19 US disclosed
EP-0342521-A1 Process for purifying crude gaseous hydrogen chloride WACKER-CHEMIE GMBH (DE) 1989-11-23 EP disclosed
EP-0206621-B1 PROCESS FOR DISPROPORTIONATING SILANES MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-11-15 EP disclosed
EP-0206621-A1 Process for disproportionating silanes MITSUI TOATSU CHEMICALS, Inc. (JP) 1986-12-30 EP disclosed
US-4244860-A Plastic molding composition DYNAMIT NOBEL AKTIENGESELLSCHAFT (DE) 1981-01-13 US disclosed
US-4072636-A ORGANO-SILICATE MITSUBISHI CHEMICAL INDUSTRIES LIMITED (JA) 1978-02-07 US disclosed