SCHEMBL3611735

SCHEMBL3611735

CC1CCCN1N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14747926 1.00
SCHEMBL8757826 1.00
Hydrochloric Acid SCHEMBL25437268 0.97
SCHEMBL3455746 0.92
SCHEMBL8258133 0.92
SCHEMBL20284520 0.92
Cyclopropane SCHEMBL11122692 0.89 ALDH1A1 (0.36)
Bromide SCHEMBL7065185 0.89
SCHEMBL20609355 0.89 ALDH1A1 (0.36)
SCHEMBL12808264 0.89

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2026100487-A1 UNDERFILL MATERIAL, CURED PRODUCT, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SAME 旭化成株式会社 2026-05-15 WO disclosed
WO-2026100491-A1 EPOXY RESIN COMPOSITION, CURED OBJECT, UNDERFILL MATERIAL, ADHESIVE, AND SEMICONDUCTOR PACKAGE AND PRODUCTION METHOD THEREFOR 旭化成株式会社 2026-05-15 WO disclosed
CN-115803323-B Amine imide compound, amine imide composition, curing agent, epoxy resin composition, process for producing amine imide compound, sealing material, and adhesive 旭化成株式会社 2025-05-16 CN disclosed
WO-2025028611-A1 CURING AGENT FOR EPOXY RESINS, EPOXY RESIN COMPOSITION, CURED OBJECT, SEALING MATERIAL, AND ADHESIVE 旭化成株式会社 2025-02-06 WO disclosed
WO-2025028598-A1 CURING AGENT FOR EPOXY RESINS, EPOXY RESIN COMPOSITION, CURED OBJECT, SEALING MATERIAL, AND ADHESIVE 旭化成株式会社 2025-02-06 WO disclosed
WO-2025028605-A1 CURING AGENT, EPOXY RESIN COMPOSITION, CURED OBJECT, SEALING MATERIAL, AND ADHESIVE 旭化成株式会社 2025-02-06 WO disclosed
US-20250034319-A1 EPOXY RESIN COMPOSITION, CURED PRODUCT, ENCAPSULANT AND ADHESIVE ASAHI KASEI KABUSHIKI KAISHA (JP) 2025-01-30 US disclosed
CN-118302470-A Epoxy resin composition, cured product, sealing material, and adhesive 旭化成株式会社 2024-07-05 CN disclosed
WO-2023127800-A1 EPOXY RESIN COMPOSITION, CURED PRODUCT, SEALING MATERIAL, AND ADHESIVE 旭化成株式会社 2023-07-06 WO disclosed
US-20230212132-A1 AMINIMIDE COMPOUND, AMINIMIDE COMPOSITION, CURING AGENT, EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING AMINIMIDE COMPOUND, ENCAPSULANT, AND ADHESIVE ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-07-06 US disclosed
US-20140080844-A1 INHIBITORS OF BRUTON'S TYROSINE KINASE PHARMACYCLICS, INC. (US) 2014-03-20 US disclosed
EP-2650294-A1 Inhibitors of Bruton's Tyrosine Kinase Pharmacyclics, Inc. (US) 2013-10-16 EP disclosed
US-20130225648-A1 Methods for Treating Cognitive/Attention Deficit Disorders Using Tetrahydroindolone Analogues and Derivatives SPECTRUM PHARMACEUTICALS, INC. (US) 2013-08-29 US disclosed
US-8466238-B2 Latent curing agents, epoxy resin compositions containing the same, sealing materials, and organic EL displays MITSUI CHEMICALS, INC. (JP) 2013-06-18 US disclosed
US-20100253213-A1 LATENT CURING AGENTS, EPOXY RESIN COMPOSITIONS CONTAINING THE SAME, SEALING MATERIALS, AND ORGANIC EL DISPLAYS MITSUI CHEMICALS, INC (JP) 2010-10-07 US disclosed
US-20100121055-A1 PROCESSES FOR PREPARING (R)-2-METHYLPYRROLIDINE AND (S)-2-METHYLPYRROLIDINE AND TARTRATE SALTS THEREOF CEPHALON, INC. (US) 2010-05-13 US disclosed
WO-2009123986-A1 APOPTOSIS SIGNAL-REGULATING KINASE 1 INHIBITORS TAKEDA PHARMACEUTICAL COMPANY LIMITED (JP) 2009-10-08 WO disclosed
CN-101007777-A (s)-(-)-5-tributyltin-N-[(1-allyl-2-pyrrolidinyl)methyl]-2,3-dimethoxybenzamide preparation method JIANGSU INST OF NUCLEAR MED (CN) 2007-08-01 CN disclosed
US-4202892-A FUNGICIDES, VIRICIDES, ANTIPROTOZOA AGENTS, PARKINSON'S DISEASE TEVA PHARMACEUTICAL INDUSTRIES, LTD. (IL) 1980-05-13 US disclosed
EP-0002065-A1 Methyladamantyl hydrazines, their pharmaceutically acceptable salts and pharmaceutical compositions containing them Teva Pharmaceutical Industries Limited (IL) 1979-05-30 EP disclosed