⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5425411 | 0.83 | — | — | |
| SCHEMBL5405149 | 0.80 | — | — | |
| SCHEMBL978794 | 0.76 | — | — | |
| SCHEMBL5421292 | 0.76 | — | — | |
| SCHEMBL3616781 | 0.74 | — | — | |
| SCHEMBL3621813 | 0.74 | — | — | |
| SCHEMBL3619997 | 0.72 | — | — | |
| SCHEMBL3625652 | 0.70 | — | — | |
| SCHEMBL310298 | 0.69 | — | — | |
| SCHEMBL331418 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12346026-B2 | Composition for forming underlayer film, resist pattern forming method, and manufacturing method of electronic device | FUJIFILM CORPORATION (JP) | 2025-07-01 | — | — | US | disclosed |
| US-20220252985-A1 | COMPOSITION FOR FORMING UNDERLAYER FILM, RESIST PATTERN FORMING METHOD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2022-08-11 | — | — | US | disclosed |
| WO-2021122431-A1 | POLYURETHANE FOAMS BASED ON POLYETHER CARBONATE POLYOLS | COVESTRO INTELLECTUAL PROPERTY GMBH & CO. KG (DE) | 2021-06-24 | — | — | WO | disclosed |
| EP-3838964-A1 | POLYURETHANE FOAMS BASED ON POLYETHER CARBONATE POLYOLS | Covestro Deutschland AG (DE) | 2021-06-23 | — | — | EP | disclosed |
| WO-2021106537-A1 | RESIST UNDERLAYER FILM-FORMING COMPOSITION, PATTERN FORMING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD | 富士フイルム株式会社 | 2021-06-03 | — | — | WO | disclosed |
| CN-106010382-B | Optical laminate and liquid crystal display device | 住友化学株式会社 | 2020-03-27 | — | — | CN | disclosed |
| US-10025188-B2 | Resist pattern-forming method | JSR CORPORATION (JP) | 2018-07-17 | — | — | US | disclosed |
| US-20170322492-A1 | RESIST PATTERN-FORMING METHOD | JSR CORPORATION (JP) | 2017-11-09 | — | — | US | disclosed |
| US-20160320705-A1 | RESIST PATTERN-FORMING METHOD | JSR CORPORATION (JP) | 2016-11-03 | — | — | US | disclosed |
| US-9434609-B2 | Method for forming pattern, and polysiloxane composition | JSR CORPORATION (JP) | 2016-09-06 | — | — | US | disclosed |
| US-20130233825-A1 | COMPOSITION FOR FORMING RESIST UNDERLAYER FILM AND PATTERN-FORMING METHOD | JSR CORPORATION (JP) | 2013-09-12 | — | — | US | disclosed |
| EP-2615497-A1 | RESIST PATTERN FORMING METHOD | JSR Corporation (JP) | 2013-07-17 | — | — | EP | disclosed |
| US-20130130179-A1 | POLYSILOXANE COMPOSITION AND PATTERN-FORMING METHOD | JSR CORPORATION (JP) | 2013-05-23 | — | — | US | disclosed |
| WO-2013061601-A1 | PATTERN-FORMING METHOD | JSR CORPORATION (JP) | 2013-05-02 | — | — | WO | disclosed |
| US-20130107235-A1 | PATTERN-FORMING METHOD | JSR CORPORATION (JP) | 2013-05-02 | — | — | US | disclosed |
| US-20130101942-A1 | METHOD FOR FORMING RESIST PATTERN, AND COMPOSITION FOR FORMING RESIST UNDERLAYER FILM | JSR CORPORATION (JP) | 2013-04-25 | — | — | US | disclosed |
| EP-2579304-A1 | INSULATION PATTERN FORMING METHOD AND INSULATION PATTERN FORMING MATERIAL FOR DAMASCENE PROCESS | JSR Corporation (JP) | 2013-04-10 | — | — | EP | disclosed |
| US-20130084394-A1 | INSULATION PATTERN-FORMING METHOD AND INSULATION PATTERN-FORMING MATERIAL | JSR CORPORATION (JP) | 2013-04-04 | — | — | US | disclosed |
| US-20120183908-A1 | RESIST PATTERN-FORMING METHOD | JSR CORPORATION (JP) | 2012-07-19 | — | — | US | disclosed |
| US-20100178620-A1 | INVERTED PATTERN FORMING METHOD AND RESIN COMPOSITION | JSR CORPORATION (JP) | 2010-07-15 | — | — | US | disclosed |