SCHEMBL364992

SCHEMBL364992

CCCCCCCCCCCCCCCCCCCO[SiH](Cl)Cl

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
THRB P10828 2/20 0.42
TSHR P16473 2/20 0.42
MEN1 O00255 1/20 0.39
HTT P42858 1/20 0.39
KMT2A Q03164 1/20 0.39
MAPT P10636 1/20 0.39
ALDH1A1 P00352 1/20 0.39
CA1 P00915 8/20 0.38
CA2 P00918 8/20 0.38
CA9 Q16790 7/20 0.38
LPAR3 Q9UBY5 6/20 0.38
LPAR2 Q9HBW0 5/20 0.38
CA12 O43570 3/20 0.38
CA7 P43166 3/20 0.38
CA14 Q9ULX7 3/20 0.38
LPAR1 Q92633 2/20 0.38
CA3 P07451 2/20 0.38
CA4 P22748 2/20 0.38
CA6 P23280 2/20 0.38
CA5A P35218 2/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27663821 1.00 THRB (0.42) THRBTSHRMEN1HTTKMT2A
SCHEMBL28862986 1.00 THRB (0.42) THRBTSHRMEN1HTTKMT2A
SCHEMBL28239118 1.00 THRB (0.42) THRBTSHRMEN1HTTKMT2A
SCHEMBL9633245 1.00 THRB (0.42) THRBTSHRMEN1HTTKMT2A
SCHEMBL17385732 0.97
SCHEMBL9388697 0.89
SCHEMBL2542804 0.78 THRB (0.47) THRBTSHRMEN1HTTKMT2A
SCHEMBL2966413 0.78 THRB (0.47) THRBTSHRMEN1HTTKMT2A
SCHEMBL2968016 0.78 THRB (0.47) THRBTSHRMEN1HTTKMT2A
SCHEMBL2315983 0.78 THRB (0.47) THRBTSHRMEN1HTTKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 74 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110660761-B Heat-conducting structure or semiconductor device 丰田自动车株式会社 2023-10-20 CN claimed
US-10867830-B2 Room temperature debondable and thermally curable compositions PROMERUS, LLC (US) 2020-12-15 US claimed
US-20190088525-A1 ROOM TEMPERATURE DEBONDABLE AND THERMALLY CURABLE COMPOSITIONS PROMERUS, LLC (US) 2019-03-21 US claimed
US-10141216-B2 Room temperature debondable and thermally curable compositions PROMERUS, LLC (US) 2018-11-27 US claimed
US-9944527-B2 Method for producing two-dimensionally patterned carbon nanotube and two-dimensionally patterned carbon nanotube THE UNIVERSITY OF TOKYO (JP) 2018-04-17 US claimed
US-20160118288-A1 ROOM TEMPERATURE DEBONDABLE AND THERMALLY CURABLE COMPOSITIONS SUMITOMO BAKELITE CO., LTD. (JP) 2016-04-28 US claimed
WO-2003035252-A1 CHEMICAL MODIFICATION OF PARTICLE SURFACES BY CROSS-LINKING MERCK PATENT GMBH (DE) 2003-05-01 WO claimed
US-12109812-B2 Ink jet printing method and ink jet printing apparatus SEIKO EPSON CORPORATION (JP) 2024-10-08 US disclosed
CN-110660761-B Heat-conducting structure or semiconductor device 丰田自动车株式会社 2023-10-20 CN disclosed
US-20220032618-A1 Ink Jet Printing Method And Ink Jet Printing Apparatus SEIKO EPSON CORPORATION (JP) 2022-02-03 US disclosed
US-11075140-B2 Heat conduction structure or semiconductor apparatus TOYOTA JIDOSHA KABUSHIKI KAISHA (JP) 2021-07-27 US disclosed
US-10867830-B2 Room temperature debondable and thermally curable compositions PROMERUS, LLC (US) 2020-12-15 US disclosed
US-20200132631-A1 RESONATOR SENSOR DEVICE SAMSUNG ELECTRONICS CO., LTD. (KR) 2020-04-30 US disclosed
WO-2005036563-A2 NANOCOMPOSITES WITH CONTROLLED ELECTRICAL PROPERTIES RENSSELAER POLYTECHNIC INSTITUTE (US) 2005-04-21 WO disclosed
US-6673752-B2 SOLUTIONS CONTAINING PHOSPHORUS AND SILICON COMPOUNDS SUCH AS TRIETHYLSILANE USED AS LUBRICANTS FOR MACHINING TOOLS CORNING INCORPORATED 2004-01-06 US disclosed
US-20030134130-A1 Modified silica compositions, transparent resin compositions and thermoplastic resin laminates and automotive parts formed therefrom, and production method thereof NISSAN MOTOR CO., LTD. 2003-07-17 US disclosed
EP-1305381-A1 HIGH PERFORMANCE CUTTING FLUIDS FOR GLASSY, CRYSTALLINE, OR AGGREGATE MATERIALS CORNING INCORPORATED (US) 2003-05-02 EP disclosed
WO-2003035252-A1 CHEMICAL MODIFICATION OF PARTICLE SURFACES BY CROSS-LINKING MERCK PATENT GMBH (DE) 2003-05-01 WO disclosed
WO-2002010321-A1 HIGH PERFORMANCE CUTTING FLUIDS FOR GLASSY, CRYSTALLINE, OR AGGREGATE MATERIALS CORNING INCORPORATED (US) 2002-02-07 WO disclosed
EP-1020403-A1 Haloalkyl silane containing zeolite powder Degussa-Hüls Aktiengesellschaft (DE) 2000-07-19 EP disclosed