SCHEMBL3674431

SCHEMBL3674431

C=CCCCC(=CCC)CCC(C)C=C

nearest known ligand 0.33

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.33
ALDH1A1 P00352 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11660038 0.95 TSHR (0.34) TSHRALDH1A1
SCHEMBL9008517 0.85
SCHEMBL4490508 0.85 TSHR (0.34) TSHRALDH1A1
SCHEMBL10482123 0.82 ALDH1A1 (0.32) TSHRALDH1A1
SCHEMBL11499534 0.80 TSHR (0.37) TSHRALDH1A1
SCHEMBL11304782 0.80 TSHR (0.44) TSHRALDH1A1
SCHEMBL5445516 0.79
SCHEMBL10620396 0.79 TSHR (0.34) TSHRALDH1A1
SCHEMBL29284328 0.78 TSHR (0.46) TSHRALDH1A1
SCHEMBL10729128 0.76 TSHR (0.50) TSHRALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0662381-B1 Shaped article of liquid crystalline polymer TORAY INDUSTRIES (JP) 2001-06-13 EP claimed
CN-114672154-B Semi-aromatic polyamide molding composition for LED 金发科技股份有限公司 2024-04-02 CN disclosed
CN-112708269-B Halogen-free flame-retardant reinforced semi-aromatic polyamide molding composition with specific glass fiber length and molded product 金发科技股份有限公司 2022-07-08 CN disclosed
CN-114672154-A Semi-aromatic polyamide molding composition for LED 金发科技股份有限公司 2022-06-28 CN disclosed
CN-112759923-A Glass fiber reinforced semi-aromatic polyamide molding composition with specific glass fiber length and molded product 金发科技股份有限公司 2021-05-07 CN disclosed
CN-112708269-A Halogen-free flame-retardant reinforced semi-aromatic polyamide molding composition with specific glass fiber length and molded product 金发科技股份有限公司 2021-04-27 CN disclosed
CN-112679948-A Flame-retardant reinforced semi-aromatic polyamide molding composition with specific glass fiber length and molded product 金发科技股份有限公司 2021-04-20 CN disclosed
EP-3150654-B1 TERMINAL-MODIFIED POLYAMIDE RESIN, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING MOLDED ARTICLES TORAY INDUSTRIES (JP) 2021-02-24 EP disclosed
WO-2020238440-A1 SEMI-AROMATIC POLYAMIDE, METHOD FOR SYNTHESIS THEREOF, AND POLYAMIDE MOLDING COMPOSITION CONSISTING THEREOF 金发科技股份有限公司 2020-12-03 WO disclosed
EP-2415801-B1 POLYAMIDE RESIN, POLYAMIDE RESIN COMPOSITION, AND MOLDED ARTICLE COMPRISING SAME TORAY INDUSTRIES (JP) 2018-06-06 EP disclosed
US-5006610-A Improved mechanical properties and solvent resistance TORAY INDUSTRIES, INC. (JP) 1991-04-09 US disclosed
US-5004561-A polypropylene, polystyrene, acrylonitrile-butadiene-styrene terpolymer, polybutylene terephthalate, or polyphenylene ethers with electroconductive glass fibers and carbon black MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1991-04-02 US disclosed
EP-0406568-A2 High toughness, stiffness and heatdistortion resistance thermoplastic polypropylene-polyamide moulding compounds, process for their manufacture and use BASF Aktiengesellschaft (DE) 1991-01-09 EP disclosed
US-4869967-A ANISOTROPIC MELT-FORMING POLYESTER, GOOD MODULUS DIRECTOR GENERAL OF THE AGENCY OF INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) 1989-09-26 US disclosed
EP-0330015-A2 Thermoplastic polypropylene polyamide compounds, process for their manufacture and their use BASF Aktiengesellschaft (DE) 1989-08-30 EP disclosed
EP-0276327-A1 RESIN COMPOSITION AND PROCESS FOR ITS PREPARATION TORAY INDUSTRIES, INC. (JP) 1988-08-03 EP disclosed
EP-0180648-A1 POLYESTER COMPOSITION AND MOLDINGS THEREOF TORAY INDUSTRIES, INC. (JP) 1986-05-14 EP disclosed
EP-0072455-B1 POLYESTER RESINOUS COMPOSITION AND PROCESS FOR PREPARING THEREOF TORAY INDUSTRIES, INC. (JP) 1985-07-03 EP disclosed
US-4461871-A Polyester resinous composition, molded articles and process for preparation thereof TORAY INDUSTRIES, INC. (JP) 1984-07-24 US disclosed
EP-0072455-A1 Polyester resinous composition and process for preparing thereof TORAY INDUSTRIES, INC. (JP) 1983-02-23 EP disclosed