SCHEMBL3674864

SCHEMBL3674864

CCCCCCCCCCCCCCC(=O)OCC(COC(=O)CCCCCCCCCCCCCC)(COC(=O)CCCCCCCCCCCCCC)COC(=O)CCCCCCCCCCCCCC

nearest known ligand 0.67

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
DGKA P23743 1/20 0.67
PAM P19021 2/20 0.60
MAPT P10636 2/20 0.56
TSHR P16473 1/20 0.56
LMNA P02545 4/20 0.55
DNM1 Q05193 1/20 0.55
ALDH1A1 P00352 1/20 0.55
KDM4E B2RXH2 1/20 0.53
DUSP3 P51452 1/20 0.53
MEN1 O00255 1/20 0.53
KMT2A Q03164 1/20 0.53
PRKCA P17252 1/20 0.50
PRKCE Q02156 1/20 0.50
PRKCQ Q04759 1/20 0.50
PRKCD Q05655 1/20 0.50
MAPK1 P28482 1/20 0.48
CES2 O00748 1/20 0.48
CES1 P23141 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8976080 1.00 DGKA (0.67) DGKAPAMMAPTTSHRLMNA
SCHEMBL8976471 1.00 DGKA (0.67) DGKAPAMMAPTTSHRLMNA
SCHEMBL3405848 1.00 DGKA (0.67) DGKAPAMMAPTTSHRLMNA
SCHEMBL3411813 1.00 DGKA (0.67) DGKAPAMMAPTTSHRLMNA
SCHEMBL5166564 1.00 DGKA (0.67) DGKAPAMMAPTTSHRLMNA
SCHEMBL158508 1.00 DGKA (0.67) DGKAPAMMAPTTSHRLMNA
SCHEMBL1096530 1.00 DGKA (0.67) DGKAPAMMAPTTSHRLMNA
SCHEMBL11979369 1.00 DGKA (0.67) DGKAPAMMAPTTSHRLMNA
SCHEMBL7611895 1.00 DGKA (0.67) DGKAPAMMAPTTSHRLMNA
SCHEMBL2317937 1.00 DGKA (0.67) DGKAPAMMAPTTSHRLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 89 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12583966-B2 Curable resin, cured product thereof, resin composition, and method for producing curable resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-03-24 US disclosed
US-20250188272-A1 THERMOPLASTIC RESIN COMPOSITION FOR FOAM MOLDING AND MOLDED FOAM ARTICLE THEREOF TECHNO-UMG CO., LTD. (JP) 2025-06-12 US disclosed
US-20250163213-A1 CURABLE RESIN, CURED PRODUCT THEREOF, AND RESIN COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-05-22 US disclosed
CN-116368190-B Thermoplastic resin composition for foam molding and foam molded article thereof 大科能宇菱通株式会社 2025-05-09 CN disclosed
US-20250136755-A1 CURABLE RESIN, CURED PRODUCT THEREOF, RESIN COMPOSITION, AND METHOD FOR PRODUCING CURABLE RESIN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-05-01 US disclosed
EP-4480985-A1 CURABLE RESIN, CURED PRODUCT THEREOF, RESIN COMPOSITION, AND PRODUCTION METHOD FOR CURABLE RESIN MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-12-25 EP disclosed
EP-4480986-A1 CURABLE RESIN, CURED PRODUCT OF SAME, AND RESIN COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-12-25 EP disclosed
EP-4450543-A1 THERMOPLASTIC RESIN COMPOSITION FOR FOAM MOLDING, AND FOAM MOLDED ARTICLE THEREOF Techno-UMG Co., Ltd. (JP) 2024-10-23 EP disclosed
CN-118541444-A Epoxy resin composition, decorative material for joint and method for using the same 三菱瓦斯化学株式会社 2024-08-23 CN disclosed
EP-4396256-A1 STABILIZER COMBINATION FOR PREVENTING DEGRADATION OF SYNTHETIC POLYMERS BASF SE (DE) 2024-07-10 EP disclosed
EP-0767175-B1 Phosphites and their production and use SUMITOMO CHEMICAL CO (JP) 2001-12-12 EP disclosed
US-20010011116-A1 Thermoplastic resin composition having excellent long-term heat-aging properties TECHNO POLYMER CO., LTD. 2001-08-02 US disclosed
US-6262173-B1 HAVING IMPACT RESISTANCE, HEAT RESISTANCE, CHEMICAL RESISTANCE AND WEATHER RESISTANCE TECHNO POLYMER CO., LTD. (JP) 2001-07-17 US disclosed
EP-0972804-A2 Thermoplastic resin composition having long-term-heat-aging properties Techno Polymer Co., Ltd. (JP) 2000-01-19 EP disclosed
EP-0637609-B1 Flame-retardant aromatic polycarbonate resin TEIJIN CHEMICALS LTD (JP) 1998-12-09 EP disclosed
US-5843339-A Phosphites and their production and use SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1998-12-01 US disclosed
EP-0859284-A1 Water-developable photosensitive composition and production process thereof Nippon Paint Co., Ltd. (JP) 1998-08-19 EP disclosed
EP-0767175-A1 Phosphites and their production and use SUMITOMO CHEMICAL COMPANY LIMITED (JP) 1997-04-09 EP disclosed
US-5478874-A Radiation transparent TEIJIN CHEMICALS LTD. (JP) 1995-12-26 US disclosed
EP-0637609-A2 Flame-retardant aromatic polycarbonate resin Teijin Chemicals, Ltd. (JP) 1995-02-08 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12583966-B2 Curable resin, cured product thereof, resin composition, and method for producing curable resin ARL1, ASH2L, SEM1 DGKA 1332/4885PAM 2234/4885MAPT 2509/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.