SCHEMBL3675161

SCHEMBL3675161

C=CC(=O)OC(C)CC1CO1

nearest known ligand 0.39

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.39
ALDH1A1 P00352 2/20 0.35
HPGD P15428 1/20 0.31
CTSL P07711 1/20 0.30
CTSB P07858 1/20 0.30
CTSK P43235 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28545822 0.87 TSHR (0.37) TSHRCTSLCTSBCTSK
SCHEMBL5993166 0.86 HCAR2 (0.38) ALDH1A1CTSLCTSBCTSK
SCHEMBL3667633 0.83 TSHR (0.37) TSHRALDH1A1
SCHEMBL27998176 0.82 ALDH1A1 (0.33) TSHRALDH1A1
SCHEMBL28555548 0.82 TSHR (0.36) TSHR
SCHEMBL28543502 0.81 TSHR (0.38) TSHRHPGDCTSLCTSBCTSK
SCHEMBL10419319 0.81 ALDH1A1 (0.42) TSHRALDH1A1
SCHEMBL27903257 0.81 TSHR (0.35) TSHRHPGD
SCHEMBL11648876 0.81 TSHR (0.35) TSHRALDH1A1HPGD
SCHEMBL28554478 0.81 TSHR (0.35) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8241753-B2 Composite thermoplastic elastomer structures with high adhesion performance and uses for the same EXXONMOBIL CHEMICAL PATENTS INC. (US) 2012-08-14 US claimed
US-7611826-B2 Photosensitive resin composition controlling solubility and pattern formation method of double-layer structure using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-11-03 US claimed
US-20090191484-A1 PHOTOSENSITIVE RESIN COMPOSITION CONTROLLING SOLUBILITY AND PATTERN FORMATION METHOD OF DOUBLE-LAYER STRUCTURE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-07-30 US claimed
US-20080299397-A1 Composite thermoplastic elastomer structures with high adhesion performance and uses for the same CELANESE INTERNATIONAL CORPORATION 2008-12-04 US claimed
US-20040115558-A1 Photosensitive resin composition controlling solubility and pattern formation method of double-layer structure using the same DONGJIM SEMICHEM CO., LTD. (KR) 2004-06-17 US claimed
WO-2023277190-A1 PROTECTIVE COVER MEMBER, SHEET FOR MEMBER SUPPLY, AND MICROELECTROMECHANICAL SYSTEM 日東電工株式会社 2023-01-05 WO disclosed
WO-2022030604-A1 PROTECTIVE COVER MEMBER AND MEMBER-SUPPLYING SHEET 日東電工株式会社 2022-02-10 WO disclosed
US-20180340059-A1 Compositions and Heavy Layers Comprising the Same EXXONMOBIL CHEMICAL PATENTS INC. 2018-11-29 US disclosed
CN-103365081-B Coloured composition, colored filter, display element and dispersible pigment dispersion JSR株式会社 2018-06-15 CN disclosed
CN-102967994-B Hardening resin composition 住友化学株式会社 2018-05-01 CN disclosed
US-9714341-B2 Biodegradable polyester-based blends WASHINGTON STATE UNIVERSITY (US) 2017-07-25 US disclosed
US-20160053112-A1 BIODEGRADABLE POLYESTER-BASED BLENDS EMPIRE TECHNOLOGY DEVELOPMENT LLC 2016-02-25 US disclosed
US-5208287-A Melt extrusion a blend of diene-ethylene-propylene terpolymer and aromatic thermoplastic with a crosslinking agent GENERAL ELECTRIC COMPANY (US) 1993-05-04 US disclosed
EP-0535849-A2 Thermoplastic elastomers based on polyester and EPDM rubber GENERAL ELECTRIC COMPANY (US) 1993-04-07 EP disclosed
EP-0487678-A1 THERMOPLASTIC ELASTOMERS AND METHOD FOR MAKING. GEN ELECTRIC (US) 1992-06-03 EP disclosed
WO-1991019765-A1 THERMOPLASTIC ELASTOMERS AND METHOD FOR MAKING GENERAL ELECTRIC COMPANY (US) 1991-12-26 WO disclosed
EP-0429672-A1 ACETAL COPOLYMER AND METHOD OF PRODUCING THE SAME Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1991-06-05 EP disclosed
US-5008342-A Modified rubber CITIBANK, N.A., AS COLLATERAL AGENT 1991-04-16 US disclosed
EP-0275141-A2 Epoxy containing impact modifiers for thermoplastic resins COPOLYMER RUBBER & CHEMICAL CORPORATION (US) 1988-07-20 EP disclosed
EP-0274744-A2 Epoxy containing impact modifiers for thermoplastic resins GENERAL ELECTRIC COMPANY (US) 1988-07-20 EP disclosed