SCHEMBL3679271

SCHEMBL3679271

COC(=O)c1ccc2cc3ccccc3cc2c1C(=O)OC

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.51
KDM4E B2RXH2 6/20 0.51
HPGD P15428 3/20 0.51
SLC6A3 Q01959 2/20 0.51
NPSR1 Q6W5P4 1/20 0.51
SLC6A2 P23975 1/20 0.51
SLC6A4 P31645 1/20 0.51
MEN1 O00255 1/20 0.49
MAPT P10636 1/20 0.49
KMT2A Q03164 1/20 0.49
NCEH1 Q6PIU2 1/20 0.44
GAA P10253 1/20 0.44
LMNA P02545 1/20 0.43
TSHR P16473 1/20 0.43
HSP90AA1 P07900 1/20 0.43
PAX8 Q06710 1/20 0.43
CFTR P13569 1/20 0.42
HSD17B10 Q99714 1/20 0.42
MPL P40238 1/20 0.42
CA12 O43570 2/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27404691 0.91 KDM4E (0.50) ALDH1A1KDM4EHPGDSLC6A3NPSR1
SCHEMBL27404692 0.91 ALDH1A1 (0.47) ALDH1A1KDM4EHPGDSLC6A3NPSR1
SCHEMBL9863303 0.89 ALDH1A1 (0.55) ALDH1A1KDM4EHPGDSLC6A3NPSR1
SCHEMBL71131 0.85 NCEH1 (0.59) ALDH1A1KDM4EHPGDSLC6A3NPSR1
SCHEMBL29404644 0.85 NCEH1 (0.59) ALDH1A1KDM4EHPGDSLC6A3NPSR1
SCHEMBL998157 0.84 MEN1 (0.47) ALDH1A1KDM4EHPGDSLC6A3NPSR1
SCHEMBL165293 0.84 ALDH1A1 (0.51) ALDH1A1KDM4EHPGDSLC6A3NPSR1
SCHEMBL22534193 0.83 ALDH1A1 (0.52) ALDH1A1KDM4EHPGDSLC6A3NPSR1
SCHEMBL15653347 0.83 KDM4E (0.56) ALDH1A1KDM4EHPGDSLC6A3NPSR1
SCHEMBL28875087 0.83 ALDH1A1 (0.50) ALDH1A1KDM4EHPGDSLC6A3NPSR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7781540-B2 Resin composition and molded articles thereof OSAKA GAS CO., LTD. (JP) 2010-08-24 US disclosed
EP-1808461-B1 RESIN COMPOSITION AND MOLDED OBJECT THEREOF TEIJIN CHEMICALS LTD (JP) 2009-03-11 EP disclosed
US-20080085955-A1 Resin Composition And Molded Articles Thereof OSAKA GAS CO., LTD. (JP) 2008-04-10 US disclosed
EP-1808461-A1 RESIN COMPOSITION AND MOLDED OBJECT THEREOF Teijin Chemicals, Ltd. (JP) 2007-07-18 EP disclosed