SCHEMBL3681733

SCHEMBL3681733

CC1(C)CC(OC2CCCCC2)CC(C)(C)N1.CC1(C)CC(Oc2ccccc2)CC(C)(C)N1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 1/20 0.43
HRH1 P35367 2/20 0.41
SLC6A4 P31645 2/20 0.40
SLC6A2 P23975 2/20 0.40
SLC6A3 Q01959 2/20 0.40
EZH2 Q15910 3/20 0.38
TSHR P16473 1/20 0.38
KDM1A O60341 1/20 0.38
MEN1 O00255 1/20 0.35
ALDH1A1 P00352 1/20 0.35
LMNA P02545 1/20 0.35
MAPT P10636 1/20 0.35
PKM P14618 1/20 0.35
ALOX15 P16050 1/20 0.35
ALOX12 P18054 1/20 0.35
RAD52 P43351 1/20 0.35
GFER P55789 1/20 0.35
KMT2A Q03164 1/20 0.35
L3MBTL1 Q9Y468 1/20 0.35
HPGD P15428 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL451934 0.86 GAA (0.54) GAAHRH1SLC6A4SLC6A2SLC6A3
SCHEMBL3681726 0.83 SLC6A2 (0.41) HRH1SLC6A4SLC6A2SLC6A3CHRNB4
SCHEMBL455897 0.81 LMNA (0.36) GAALMNA
SCHEMBL791816 0.74 HRH1 (0.63) HRH1SLC6A4SLC6A2SLC6A3TSHR
SCHEMBL11792902 0.74 HRH1 (0.63) HRH1SLC6A4SLC6A2SLC6A3TSHR
SCHEMBL1829827 0.72 HRH1 (0.65) HRH1SLC6A4SLC6A2SLC6A3TSHR
SCHEMBL1471330 0.72 GAA (0.41) GAAEZH2ALDH1A1MAPTKMT2A
SCHEMBL23123337 0.71 HRH1 (0.56) GAAHRH1SLC6A4SLC6A2SLC6A3
SCHEMBL17931233 0.70 GAA (0.41) GAAHRH1SLC6A4SLC6A2SLC6A3
SCHEMBL1471237 0.70 GAA (0.44) GAAEZH2TSHRMEN1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7648653-B2 a mixture of acetal resins, electroconductive fillers, a boron oxyacid or salt and polyamides, exhibiting reduced or eliminated deterioration when exposed to high temperature, pressure and high-fuel content environments BASF SE (DE) 2010-01-19 US disclosed
EP-2001951-A1 THERMALLY CONDUCTIVE POLYAMIDES BASF SE (DE) 2008-12-17 EP disclosed
US-20080121847-A1 a mixture of acetal resins, electroconductive fillers, a boron oxyacid or salt and polyamides, exhibiting reduced or eliminated deterioration when exposed to high temperature, pressure and high-fuel content environments BASF AKTIENGESELLSCHFT (DE) 2008-05-29 US disclosed
WO-2007113116-A1 THERMALLY CONDUCTIVE POLYAMIDES BASF SE (DE) 2007-10-11 WO disclosed