⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6256153 | 1.00 | — | — | |
| SCHEMBL2549145 | 1.00 | — | — | |
| Hydrochloric Acid SCHEMBL28135849 | 0.96 | — | — | |
| Trimethylammonium SCHEMBL5785848 | 0.89 | — | — | |
| Acetic Acid SCHEMBL30012061 | 0.83 | — | — | |
| SCHEMBL11308061 | 0.83 | TDP1 (0.53) | — | |
| Butyl Alcohol SCHEMBL20817057 | 0.76 | ALDH1A1 (0.58) | — | |
| Butyl Alcohol SCHEMBL20817056 | 0.76 | ALDH1A1 (0.58) | — | |
| Isopropyl Alcohol SCHEMBL28610569 | 0.73 | — | — | |
| SCHEMBL15355556 | 0.72 | ALDH1A1 (0.44) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1772 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12434905-B1 | Enhanced intermodal container modification kit | CROSBY LON OWEN (US) | 2025-10-07 | — | — | US | claimed |
| US-12172243-B2 | Flux, resin flux cored solder using the flux, and soldering method | SENJU METAL INDUSTRY CO., LTD. (JP) | 2024-12-24 | — | — | US | claimed |
| EP-4429802-A1 | MEMBRANE FOR REMOVING ANIONIC MATERIALS | Entegris, Inc. (US) | 2024-09-18 | — | — | EP | claimed |
| US-12017307-B2 | Flux for resin-cored solder, resin-cored solder, and soldering method | SENJU METAL INDUSTRY CO., LTD. (JP) | 2024-06-25 | — | — | US | claimed |
| CN-118234560-A | Membrane for removing anionic material | 恩特格里斯公司 | 2024-06-21 | — | — | CN | claimed |
| CN-116600930-B | Flux for clad solder, and soldering method | 千住金属工业株式会社 | 2024-04-12 | — | — | CN | claimed |
| CN-117733407-A | Soldering flux special for high-speed tin coating of laminated tile welding strip | 无锡市斯威克科技有限公司 | 2024-03-22 | — | — | CN | claimed |
| US-20240033863-A1 | Flux for Resin-Cored Solder, Resin-Cored Solder, and Soldering Method | SENJU METAL INDUSTRY CO., LTD. (JP) | 2024-02-01 | — | — | US | claimed |
| CN-115650933-B | 3, 4-dihydro-3-methyl-2H-1, 4-benzoxazine and preparation method thereof | 威尔（福建）生物有限公司 | 2024-01-30 | — | — | CN | claimed |
| EP-4260971-A1 | FLUX FOR RESIN-CORED SOLDER, RESIN-CORED SOLDER, AND SOLDERING METHOD | Senju Metal Industry Co., Ltd. (JP) | 2023-10-18 | — | — | EP | claimed |
| US-20080125342-A1 | FORMULATIONS FOR CLEANING MEMORY DEVICE STRUCTURES | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2008-05-29 | — | — | US | claimed |
| WO-2008058173-A2 | FORMULATIONS FOR CLEANING MEMORY DEVICE STRUCTURES | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2008-05-15 | — | — | WO | claimed |
| CN-101049513-A | Anti hemorrhagic healing traumatic material of chitosan based fiber in water-solubility, preparation method and application | LIU WANSHUN (CN) | 2007-10-10 | — | — | CN | claimed |
| CN-1307024-C | High adhesion leadless soldering tin grease | DENG HESHENG (CN) | 2007-03-28 | — | — | CN | claimed |
| CN-1835995-A | Polyelectrolyte composition for humidity sensor, polyelectrolyte ink, and method for preparing polyelectrolyte membrane for sensor by inkjet printing | HAEUN CHEMTEC CO LTD (KR) | 2006-09-20 | — | — | CN | claimed |
| CN-1771249-A | 1-N-phenyl-2-N-phenylpyrrolidine-1, 2-dicarboxamide derivatives as factor Xa inhibitors for the treatment of thrombosis | MERCK PATENT GMBH (DE) | 2006-05-10 | — | — | CN | claimed |
| US-6989052-B1 | Phase change ink printing process | XEROX CORPORATION (US) | 2006-01-24 | — | — | US | claimed |
| US-20060004123-A1 | PHASE CHANGE INK PRINTING PROCESS | XEROX CORPORATION | 2006-01-05 | — | — | US | claimed |
| CN-1569383-A | High adhesion leadless soldering tin grease | DENG HESHENG (CN) | 2005-01-26 | — | — | CN | claimed |
| US-4877711-A | DURABLE PRINTING PLATES | FUJI PHOTO FILM CO., LTD. (JP) | 1989-10-31 | — | — | US | claimed |