⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4861882 | 0.83 | GABRR1 (0.32) | — | |
| SCHEMBL10765425 | 0.82 | DNM1 (0.35) | — | |
| SCHEMBL27899256 | 0.82 | — | — | |
| SCHEMBL561080 | 0.80 | GSR (0.39) | — | |
| SCHEMBL10075630 | 0.79 | — | — | |
| SCHEMBL12191272 | 0.79 | — | — | |
| SCHEMBL3747159 | 0.79 | — | — | |
| SCHEMBL26607784 | 0.79 | — | — | |
| SCHEMBL1936664 | 0.79 | — | — | |
| SCHEMBL15679696 | 0.79 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110903766-A | Polishing slurry composition | 凯斯科技股份有限公司 | 2020-03-24 | — | — | CN | claimed |
| EP-1639053-B1 | CMP OF NOBLE METALS | CABOT MICROELECTRONICS CORP (US) | 2017-01-04 | — | — | EP | claimed |
| EP-1811005-B1 | POLISHING SYSTEM AND METHOD OF ITS USE | CABOT MICROELECTRONICS CORP (US) | 2016-08-03 | — | — | EP | claimed |
| US-7160807-B2 | CMP of noble metals | CABOT MICROELECTRONICS CORPORATION (US) | 2007-01-09 | — | — | US | claimed |
| EP-1639053-A1 | CMP OF NOBLE METALS | Cabot Microelectronics Corporation (US) | 2006-03-29 | — | — | EP | claimed |
| EP-1218465-B1 | POLISHING SYSTEM WITH STOPPING COMPOUND AND METHOD OF ITS USE | CABOT MICROELECTRONICS CORP (US) | 2005-03-30 | — | — | EP | claimed |
| WO-2005005561-A1 | CMP OF NOBLE METALS | CABOT MICROELECTRONICS CORPORATION (US) | 2005-01-20 | — | — | WO | claimed |
| US-20040266196-A1 | CMP of noble metals | CABOT MICROELECTRONICS CORPORATION | 2004-12-30 | — | — | US | claimed |
| US-6372871-B1 | CURABLE LIQUID MIXTURE OF A POLYMER, PREFERABLY ACRYLIC, HAVING A 1,3-OXATHIOLANE-2-THIOL AND A KETIMINE, ENAMINE OR AN ALDIMINE; COATINGS; ADHESIVES; INKS; SEALS; STORAGE STABILITY | KYOWA YUKA CO., LTD. (JP) | 2002-04-16 | — | — | US | claimed |
| CN-110903766-B | Polishing slurry composition | 凯斯科技股份有限公司 | 2022-04-19 | — | — | CN | disclosed |
| CN-110903766-A | Polishing slurry composition | 凯斯科技股份有限公司 | 2020-03-24 | — | — | CN | disclosed |
| EP-1639053-B1 | CMP OF NOBLE METALS | CABOT MICROELECTRONICS CORP (US) | 2017-01-04 | — | — | EP | disclosed |
| EP-1865013-B1 | Polyamide curing agent compositions | AIR PROD & CHEM (US) | 2015-12-30 | — | — | EP | disclosed |
| US-8293863-B2 | comprising the reaction product of multifunctional amines such as N,N-bis(3-aminopropyl) ethylenediamine, with dimer fatty acids or esters, useful for crosslinking epoxy resins to produce quick-drying coatings, adhesives, floors and composites | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2012-10-23 | — | — | US | disclosed |
| US-20030170991-A1 | Method of polishing a multi-layer substrate | CABOT MICROELECTRONICS CORPORATION | 2003-09-11 | — | — | US | disclosed |
| US-20030153184-A1 | Method of polishing a multi-layer substrate | CABOT MICROELECTRONICS CORPORATION | 2003-08-14 | — | — | US | disclosed |
| CN-1370207-A | Polishing system and method of its use | CABOT MICROELECRONICS CORP (US) | 2002-09-18 | — | — | CN | disclosed |
| CN-1370209-A | Polishing system containing stopping compound and using method thereof | CABOT MICROELECTRONICS CORP (US) | 2002-09-18 | — | — | CN | disclosed |
| CN-1321187-A | Laundry and cleaning compositions | PROCTER & GAMBLE (US) | 2001-11-07 | — | — | CN | disclosed |
| US-4973715-A | Furan polyols | Centre Scientifique et Technique du Battment (FR) | 1990-11-27 | — | — | US | disclosed |