Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.54 |
| ▸ | GLA | P06280 | 1/20 | 0.54 |
| ▸ | TP53 | P04637 | 3/20 | 0.44 |
| ▸ | TSHR | P16473 | 3/20 | 0.44 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.44 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.44 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.42 |
| ▸ | POLB | P06746 | 1/20 | 0.41 |
| ▸ | HPGD | P15428 | 3/20 | 0.40 |
| ▸ | MAPT | P10636 | 2/20 | 0.40 |
| ▸ | MEN1 | O00255 | 2/20 | 0.40 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.40 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.40 |
| ▸ | PPARG | P37231 | 1/20 | 0.40 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.38 |
| ▸ | VDR | P11473 | 1/20 | 0.37 |
| ▸ | LMNA | P02545 | 2/20 | 0.37 |
| ▸ | PKM | P14618 | 2/20 | 0.37 |
| ▸ | GAA | P10253 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL23254199 | 0.81 | ALDH1A1 (0.50) | ALDH1A1GLATP53TSHRHIF1A | |
| SCHEMBL4470150 | 0.79 | ALDH1A1 (0.50) | ALDH1A1GLATP53TSHRHIF1A | |
| SCHEMBL22134582 | 0.79 | ALDH1A1 (0.63) | ALDH1A1GLATP53TSHRHIF1A | |
| SCHEMBL10595272 | 0.79 | ALDH1A1 (0.44) | ALDH1A1GLATP53TSHRHIF1A | |
| SCHEMBL7953345 | 0.79 | ALDH1A1 (0.64) | ALDH1A1GLATP53TSHRHIF1A | |
| SCHEMBL4945160 | 0.79 | ALDH1A1 (0.64) | ALDH1A1GLATP53TSHRHIF1A | |
| SCHEMBL262508 | 0.79 | ALDH1A1 (0.64) | ALDH1A1GLATP53TSHRHIF1A | |
| SCHEMBL31213024 | 0.79 | ALDH1A1 (0.64) | ALDH1A1GLATP53TSHRHIF1A | |
| SCHEMBL7953349 | 0.79 | ALDH1A1 (0.64) | ALDH1A1GLATP53TSHRHIF1A | |
| SCHEMBL27131262 | 0.79 | ALDH1A1 (0.59) | ALDH1A1GLATP53TSHRHIF1A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-9124906-A | — | — | None | — | — | JP | disclosed |
| WO-2025018368-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTED STRUCTURE, AND METHOD FOR PRODUCING CONNECTED STRUCTURE | 株式会社レゾナック | 2025-01-23 | — | — | WO | disclosed |
| WO-2024150762-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE | 株式会社レゾナック | 2024-07-18 | — | — | WO | disclosed |
| WO-2024150767-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE | 株式会社レゾナック | 2024-07-18 | — | — | WO | disclosed |
| WO-2024150766-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE | 株式会社レゾナック | 2024-07-18 | — | — | WO | disclosed |
| WO-2024150765-A1 | ADHESIVE COMPOSITION, ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE | 株式会社レゾナック | 2024-07-18 | — | — | WO | disclosed |
| WO-2024042720-A1 | ADHESIVE FILM FOR CIRCUIT CONNECTION, CONNECTION STRUCTURE, AND METHODS FOR PRODUCING SAME | 株式会社レゾナック | 2024-02-29 | — | — | WO | disclosed |
| WO-2023214522-A1 | LAMINATE, METHOD FOR PRODUCING LAMINATE, AND METHOD FOR PRODUCING CONNECTION STRUCTURE | 株式会社レゾナック | 2023-11-09 | — | — | WO | disclosed |
| WO-2023171631-A1 | CONDUCTIVE PARTICLES, ADHESIVE FILM FOR CIRCUIT CONNECTION, PRODUCTION METHOD THEREFOR, CONNECTION STRUCTURE, AND PRODUCTION METHOD THEREFOR | 株式会社レゾナック | 2023-09-14 | — | — | WO | disclosed |
| WO-2023171630-A1 | CONDUCTIVE PARTICLES, ADHESIVE FILM FOR CIRCUIT CONNECTION AND METHOD FOR PRODUCING SAME, AND CONNECTION STRUCTURE AND METHOD FOR PRODUCING SAME | 株式会社レゾナック | 2023-09-14 | — | — | WO | disclosed |
| US-7816430-B2 | Composition of polycyanate ester and biphenyl epoxy resin | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2010-10-19 | — | — | US | disclosed |
| EP-1550678-B1 | RESIN COMPOSITION FOR PRINTED WIRING BOARD, AND VANISH, PREPREG AND METAL-CLAD LAMINATE USING SAME | HITACHI CHEMICAL CO LTD (JP) | 2008-03-26 | — | — | EP | disclosed |
| US-20060167189-A1 | Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using the same | RESONAC CORPORATION (JP) | 2006-07-27 | — | — | US | disclosed |
| EP-1550678-A1 | RESIN COMPOSITION FOR PRINTED WIRING BOARD, AND VANISH, PREPREG AND METAL-CLAD LAMINATE USING SAME | Hitachi Chemical Co., Ltd. (JP) | 2005-07-06 | — | — | EP | disclosed |
| US-6841628-B2 | Resin composition, adhesives prepared therewith for bonding circuit members, and circuit boards | HITACHI CHEMICAL CO., LTD. (JP) | 2005-01-11 | — | — | US | disclosed |
| US-6756453-B2 | SELECTIVELY HYDROGENATING THE AROMATIC RINGS IN THE PRESENCE OF A PLATINUM GROUP HYDROGENATION CATALYST | MITSUBISHI CHEMICAL CORPORATION (JP) | 2004-06-29 | — | — | US | disclosed |
| US-20030098649-A1 | Alicylic epoxy compounds and their preparation process, alicylic epoxy resin composition, and encapsulant for light-emitting diode | MITSUBISHI CHEMICAL CORPORATION (JP) | 2003-05-29 | — | — | US | disclosed |
| US-20030027942-A1 | Resin composition , adhesive prepared therewith for bonding circuit members,and circuit boards | HITACHI CHEMICAL CO., LTD. (JP) | 2003-02-06 | — | — | US | disclosed |
| EP-1270633-A1 | Alicylic epoxy compounds and their preparation process, alicylic epoxy resin composition, and encapsulant for light-emitting diode | Mitsubishi Chemical Corporation (JP) | 2003-01-02 | — | — | EP | disclosed |
| JP-H09124906-A | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING | SUMITOMO BAKELITE CO LTD | 1997-05-13 | — | — | JP | disclosed |