SCHEMBL3690169

SCHEMBL3690169

CC(O)OC(=O)C1CC2C=CC1C2

nearest known ligand 0.54

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 9/20 0.54
LMNA P02545 2/20 0.47
KDM4E B2RXH2 1/20 0.47
HPGD P15428 1/20 0.40
POLB P06746 3/20 0.39
KMT2A Q03164 2/20 0.39
RAB9A P51151 1/20 0.39
APEX1 P27695 1/20 0.37
RECQL P46063 1/20 0.37
BLM P54132 1/20 0.37
ESR2 Q92731 1/20 0.37
HSD17B10 Q99714 1/20 0.37
TDP1 Q9NUW8 1/20 0.37
L3MBTL1 Q9Y468 1/20 0.37
THRB P10828 1/20 0.35
MAPK1 P28482 2/20 0.34
CETP P11597 1/20 0.33
GAA P10253 1/20 0.32
MAPT P10636 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11800180 0.88 ALDH1A1 (0.56) ALDH1A1LMNAKDM4EHPGDPOLB
SCHEMBL952719 0.88 ALDH1A1 (0.56) ALDH1A1LMNAKDM4EHPGDPOLB
SCHEMBL12228734 0.85 ALDH1A1 (0.53) ALDH1A1LMNAKDM4EHPGDPOLB
SCHEMBL12228735 0.85 ALDH1A1 (0.53) ALDH1A1LMNAKDM4EHPGDPOLB
SCHEMBL11339109 0.85 ALDH1A1 (0.53) ALDH1A1LMNAKDM4EHPGDPOLB
SCHEMBL6861633 0.83 ALDH1A1 (0.52) ALDH1A1LMNAKDM4EHPGDPOLB
SCHEMBL22263927 0.83 ALDH1A1 (0.52) ALDH1A1LMNAKDM4EHPGDPOLB
SCHEMBL32688583 0.83 ALDH1A1 (0.59) ALDH1A1LMNAKDM4EHPGDPOLB
SCHEMBL5186051 0.82 ALDH1A1 (0.48) ALDH1A1LMNAKDM4EHPGDPOLB
SCHEMBL22263633 0.82 ALDH1A1 (0.51) ALDH1A1LMNAKDM4EHPGDPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1803761-B1 Ring-opened copolymer, hydrogenated ring-opened copolymer, process for producing thereof, and compositions ZEON CORP (JP) 2016-04-27 EP claimed
EP-1803761-A1 Ring-opened copolymer, hydrogenated ring-opened copolymer, process for producing thereof, and compositions ZEON CORPORATION (JP) 2007-07-04 EP claimed
US-6995226-B2 Open-ring copolymer, hydrogenated open-ring copolymer, process for production of both, and compositions ZEON CORPORATION (JP) 2006-02-07 US claimed
US-20040152843-A1 Open-ring copolymer, hydrogenated open-ring copolymer, process for production of both, and compositions ZEON CORPORATION (JP) 2004-08-05 US claimed
EP-1408064-A1 OPEN-RING COPOLYMER, HYDROGENATED OPEN-RING COPOLYMER, PROCESSES FOR PRODUCTION OF BOTH, AND COMPOSITIONS Zeon Corporation (JP) 2004-04-14 EP claimed
US-11169440-B2 Radiation-sensitive resin composition and electronic component ZEON CORPORATION (JP) 2021-11-09 US disclosed
EP-3345970-B1 RESIN COMPOSITION ZEON CORP (JP) 2021-07-28 EP disclosed
EP-3434731-B1 RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE ZEON CORP (JP) 2021-06-09 EP disclosed
US-10775697-B2 Radiation-sensitive resin composition, resin film, and electronic device ZEON CORPORATION (JP) 2020-09-15 US disclosed
US-10622527-B2 Infrared LED ZEON CORPORATION (JP) 2020-04-14 US disclosed
US-10446690-B2 Method of production of semiconductor device TOHOKU UNIVERSITY (JP) 2019-10-15 US disclosed
EP-3121652-B1 RADIATION-SENSITIVE RESIN COMPOSITION AND ELECTRONIC COMPONENT ZEON CORP (JP) 2019-09-04 EP disclosed
US-20100150506-A1 POLYMER OPTICAL WAVEGUIDE FORMING MATERIAL, POLYMER OPTICAL WAVEGUIDE AND MANUFACTURING METHOD OF POLYMER OPTICAL WAVEGUIDE NEC CORPORATION (JP) 2010-06-17 US disclosed
US-20080299329-A1 CYCLIC OLEFIN POLYMER, OPTICAL MATERIAL, POLARIZING PLATE AND LIQUID CRYSTAL DISPLAY FUJIFILM CORPORATION (JP) 2008-12-04 US disclosed
EP-1408064-B1 OPEN-RING COPOLYMER, HYDROGENATED OPEN-RING COPOLYMER, PROCESSES FOR PRODUCTION OF BOTH, AND COMPOSITIONS ZEON CORP (JP) 2008-07-30 EP disclosed
EP-1803761-A1 Ring-opened copolymer, hydrogenated ring-opened copolymer, process for producing thereof, and compositions ZEON CORPORATION (JP) 2007-07-04 EP disclosed
US-6995226-B2 Open-ring copolymer, hydrogenated open-ring copolymer, process for production of both, and compositions ZEON CORPORATION (JP) 2006-02-07 US disclosed
US-20040152843-A1 Open-ring copolymer, hydrogenated open-ring copolymer, process for production of both, and compositions ZEON CORPORATION (JP) 2004-08-05 US disclosed
EP-1408064-A1 OPEN-RING COPOLYMER, HYDROGENATED OPEN-RING COPOLYMER, PROCESSES FOR PRODUCTION OF BOTH, AND COMPOSITIONS Zeon Corporation (JP) 2004-04-14 EP disclosed
US-20040029043-A1 Process for producing circuit substrates ZEON CORPORATION (JP) 2004-02-12 US disclosed