Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALPI | P09923 | 1/20 | 0.49 |
| ▸ | PKM | P14618 | 1/20 | 0.49 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.49 |
| ▸ | XIAP | P98170 | 1/20 | 0.49 |
| ▸ | SLC7A5 | Q01650 | 1/20 | 0.49 |
| ▸ | FNTA | P49354 | 9/20 | 0.48 |
| ▸ | FNTB | P49356 | 9/20 | 0.48 |
| ▸ | PGGT1B | P53609 | 8/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Methionine SCHEMBL3694811 | 1.00 | ALPI (0.49) | ALPIPKMPTGS1XIAPSLC7A5 | |
| Phenylalanine SCHEMBL28231547 | 0.86 | SLC7A5 (0.69) | ALPIPKMPTGS1XIAPSLC7A5 | |
| Dl-Phenylalanine SCHEMBL464776 | 0.86 | SLC7A5 (0.69) | ALPIPKMPTGS1XIAPSLC7A5 | |
| Phenylalanine SCHEMBL464777 | 0.86 | SLC7A5 (0.69) | ALPIPKMPTGS1XIAPSLC7A5 | |
| Dl-Phenylalanine SCHEMBL29503517 | 0.86 | SLC7A5 (0.69) | ALPIPKMPTGS1XIAPSLC7A5 | |
| Dl-Phenylalanine SCHEMBL28076342 | 0.86 | SLC7A5 (0.69) | ALPIPKMPTGS1XIAPSLC7A5 | |
| Racemethionine SCHEMBL526136 | 0.86 | ALPI (0.50) | ALPIPKMPTGS1XIAPSLC7A5 | |
| Methionine SCHEMBL526137 | 0.86 | ALPI (0.50) | ALPIPKMPTGS1XIAPSLC7A5 | |
| Phenylalanine SCHEMBL8584099 | 0.86 | ALPI (0.59) | ALPIPKMPTGS1XIAPSLC7A5 | |
| Benzenemethanethiol SCHEMBL11583114 | 0.84 | CYP2C19 (0.53) | ALPIPKMPTGS1XIAPSLC7A5 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20160222523-A1 | SOLUTION AND PROCESS TO TREAT SURFACES OF COPPER ALLOYS IN ORDER TO IMPROVE THE ADHESION BETWEEN THE METAL SURFACE AND THE BONDED POLYMERIC MATERIAL | ATOTECH USA, LLC | 2016-08-04 | — | — | US | claimed |
| US-20160168722-A1 | SOLUTION AND PROCESS TO TREAT SURFACES OF COPPER ALLOYS IN ORDER TO IMPROVE THE ADHESION BETWEEN THE METAL SURFACE AND THE BONDED POLYMERIC MATERIAL | ATOTECH DEUTSCHLAND GMBH (DE) | 2016-06-16 | — | — | US | claimed |
| US-20100288731-A1 | Solution and Process to Treat Surfaces of Copper Alloys in Order to Improve the Adhesion Between the Metal Surface and the Bonded Polymeric Material | ATOTECH DEUTSCHLAND GMBH (DE) | 2010-11-18 | — | — | US | claimed |
| WO-2007093284-A1 | SOLUTION AND PROCESS TO TREAT SURFACES OF COPPER ALLOYS IN ORDER TO IMPROVE THE ADHESION BETWEEN THE METAL SURFACE AND THE BONDED POLYMERIC MATERIAL | ATOTECH DEUTSCHLAND GMBH (DE) | 2007-08-23 | — | — | WO | claimed |
| EP-1820884-A1 | Solution and process to treat surfaces of copper alloys in order to improve the adhesion between the metal surface and the bonded polymeric material | ATOTECH DEUTSCHLAND GMBH (DE) | 2007-08-22 | — | — | EP | claimed |
| EP-1310142-B1 | IMPROVED ADHESION OF POLYMERIC MATERIALS TO METAL SURFACES | ATOTECH DEUTSCHLAND GMBH (DE) | 2007-05-09 | — | — | EP | claimed |
| JP-2004536220-A | — | — | 2004-12-02 | — | — | JP | claimed |
| US-6723385-B1 | PRETREAT COPPER SURFACES SO THAT A TIGHT BOND CAN BE SUBSEQUENTLY FORMED BETWEEN THE PRETREATED COPPER SURFACES AND PLASTIC SUBSTRATES OF PRINTED CIRDUIT BOARDS | ATOTECH DEUTSCHLAND GMBH (DE) | 2004-04-20 | — | — | US | claimed |
| CN-1461584-A | Improved adhesion of polymeric materials to metal surfaces | ATOTECH DEUTSCHLAND GMBH (DE) | 2003-12-10 | — | — | CN | claimed |
| EP-1310142-A2 | IMPROVED ADHESION OF POLYMERIC MATERIALS TO METAL SURFACES | ATOTECH Deutschland GmbH (DE) | 2003-05-14 | — | — | EP | claimed |
| US-6562149-B1 | For firmly bonding laminated multilayered printed circuit boards and for bonding resists to copper | ATOTECH DEUTSCHLAND GMBH (DE) | 2003-05-13 | — | — | US | claimed |
| WO-2002079542-A9 | IMPROVED ADHESION OF POLYMERIC MATERIALS TO METAL SURFACES | ATOTECH DEUTSCHLAND GMBH (DE) | 2003-03-20 | — | — | WO | claimed |
| US-6506314-B1 | Intergranular etching; immersing in plating solution con-taining hydrogen peroxide, sulfuric acid or a sulfonic acid, five membered nitrogen heterocyclic compound and such as triphenyl sulfonium chloride | ATOTECH DEUTSCHLAND GMBH (DE) | 2003-01-14 | — | — | US | claimed |
| WO-2002079542-A2 | IMPROVED ADHESION OF POLYMERIC MATERIALS TO METAL SURFACES | ATOTECH DEUTSCHLAND GMBH (DE) | 2002-10-10 | — | — | WO | claimed |
| EP-1051888-B1 | PROCESS AND SOLUTION FOR THE PRELIMINARY TREATMENT OF COPPER SURFACES | ATOTECH DEUTSCHLAND GMBH (DE) | 2002-03-27 | — | — | EP | claimed |
| EP-1055355-B1 | PROCESS FOR THE PRELIMINARY TREATMENT OF COPPER SURFACES | ATOTECH DEUTSCHLAND GMBH (DE) | 2001-12-05 | — | — | EP | claimed |
| US-20170086305-A1 | SOLUTION AND PROCESS FOR THE PRE-TREATMENT OF COPPER SURFACES USING AN N-ALKOXYLATED ADHESION-PROMOTING COMPOUND | ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) | 2017-03-23 | — | — | US | disclosed |
| US-9504161-B2 | Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound | ATOTECH DEUTSCHLAND GMBH (DE) | 2016-11-22 | — | — | US | disclosed |
| US-6506314-B1 | Intergranular etching; immersing in plating solution con-taining hydrogen peroxide, sulfuric acid or a sulfonic acid, five membered nitrogen heterocyclic compound and such as triphenyl sulfonium chloride | ATOTECH DEUTSCHLAND GMBH (DE) | 2003-01-14 | — | — | US | disclosed |
| WO-2002079542-A2 | IMPROVED ADHESION OF POLYMERIC MATERIALS TO METAL SURFACES | ATOTECH DEUTSCHLAND GMBH (DE) | 2002-10-10 | — | — | WO | disclosed |