Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HCAR2 | Q8TDS4 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3697116 | 1.00 | HCAR2 (0.35) | HCAR2 | |
| Ethylene Glycol SCHEMBL3701779 | 0.93 | HCAR2 (0.32) | HCAR2 | |
| SCHEMBL891364 | 0.90 | HCAR2 (0.43) | HCAR2 | |
| SCHEMBL891365 | 0.90 | HCAR2 (0.43) | HCAR2 | |
| Di(Hydroxyethyl)Ether SCHEMBL3704367 | 0.87 | — | — | |
| Triethylene Glycol SCHEMBL3697107 | 0.86 | MEN1 (0.31) | — | |
| SCHEMBL27511152 | 0.83 | HCAR2 (0.57) | HCAR2 | |
| SCHEMBL9809844 | 0.83 | HCAR2 (0.57) | HCAR2 | |
| SCHEMBL28839889 | 0.82 | HCAR2 (0.32) | HCAR2 | |
| SCHEMBL10854431 | 0.79 | HCAR2 (0.47) | HCAR2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7795353-B2 | Method for producing a modified propylene polymer | SUMITOMO CHEMICAL COMPANY LIMITED (JP) | 2010-09-14 | — | — | US | disclosed |
| US-7282323-B2 | Highly heat-resistant, negative-type photosensitive resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2007-10-16 | — | — | US | disclosed |
| US-20060148995-A1 | Method for producing a modified propylene polymer | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2006-07-06 | — | — | US | disclosed |
| US-20050244739-A1 | Highly heat-resistant, negative-type photosensitive resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2005-11-03 | — | — | US | disclosed |
| EP-1536286-A1 | HIGHLY HEAT-RESISTANT, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | Asahi Kasei EMD Corporation (JP) | 2005-06-01 | — | — | EP | disclosed |
| US-5847071-A | Photosensitive resin composition | HITACHI, CHEMICAL CO., LTD. (JP) | 1998-12-08 | — | — | US | disclosed |
| US-5668248-A | POLYAMIC ACID ESTERS | HITACHI CHEMICAL CO., LTD. (JP) | 1997-09-16 | — | — | US | disclosed |
| US-5472823-A | Polyamic acids | HITACHI CHEMICAL CO., LTD. (JP) | 1995-12-05 | — | — | US | disclosed |
| EP-0373952-B1 | Photosensitive resin composition and photosensitive element using the same | HITACHI CHEMICAL CO LTD (JP) | 1995-02-08 | — | — | EP | disclosed |
| US-5262277-A | Light sensitive elements for electrical thick films with heat resistance | HITACHI CHEMICAL COMPANY, INC. (JP) | 1993-11-16 | — | — | US | disclosed |
| US-5210274-A | ETHYLENICALLY UNSATURATED, FLORINE-CONTAINING URETHANE DERIVATIVES AND PROCESS FOR THEIR PREPARATION | HOECHST AG (DE) | 1993-05-11 | — | — | US | disclosed |
| EP-0373952-A2 | Photosensitive resin composition and photosensitive element using the same | Hitachi Chemical Co., Ltd. (JP) | 1990-06-20 | — | — | EP | disclosed |
| US-4632957-A | ADHESION PROMOTER | PPG INDUSTRIES, INC. (US) | 1986-12-30 | — | — | US | disclosed |
| EP-0180736-A1 | Ethylenically unsaturated imidazolidones containing alkylene urea groups or alkylene urethane groups | PPG INDUSTRIES, INC. (US) | 1986-05-14 | — | — | EP | disclosed |