SCHEMBL3697331

SCHEMBL3697331

CO[Si](OC)(OC)C(S)CS

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL382077 0.80
SCHEMBL28235810 0.79
SCHEMBL22837 0.79
SCHEMBL284612 0.79
SCHEMBL10715314 0.75
SCHEMBL5483776 0.75
Methyl Alcohol SCHEMBL28295123 0.75
SCHEMBL9323150 0.75
SCHEMBL6917606 0.73
Alcohol SCHEMBL28287486 0.73 ALDH1A1 (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4713293-A1 METAL NANOPARTICLES STABILIZED WITH CATIONIC COMPOUNDS CAPABLE OF ABSORBING VISIBLE LIGHT Fundació Eurecat (ES) 2026-03-25 EP disclosed
WO-2024236162-A1 METAL NANOPARTICLES STABILIZED WITH CATIONIC COMPOUNDS CAPABLE OF ABSORBING VISIBLE LIGHT FUNDACIÓ EURECAT (ES) 2024-11-21 WO disclosed
WO-2024135780-A1 POLYIMIDE FILM, MULTILAYER BODY, FLEXIBLE ELECTRONIC DEVICE AND METHOD FOR PRODUCING FLEXIBLE ELECTRONIC DEVICE 東洋紡株式会社 2024-06-27 WO disclosed
CN-116964131-A Polyamic acid, polyimide, and use thereof 东洋纺株式会社 2023-10-27 CN disclosed
WO-2023013453-A1 ELECTRONIC DISPLAY APPARATUS 東洋紡株式会社 2023-02-09 WO disclosed
US-11548984-B2 Light- or heat-curing method and curable resin composition FUJIFILM WAKO PURE CHEMICAL CORPORATION (JP) 2023-01-10 US disclosed
WO-2023276864-A1 SILSESQUIOXANE COMPOUND AND METHOD FOR PRODUCING SAME 東洋紡株式会社 2023-01-05 WO disclosed
WO-2023276880-A1 POLYAMIC ACID, POLYIMIDE, AND USE THEREOF 東洋紡株式会社 2023-01-05 WO disclosed
WO-2023276887-A1 POLY(AMIC ACID), POLYIMIDE, AND USES THEREOF 東洋紡株式会社 2023-01-05 WO disclosed
CN-115202149-A Negative radiation-sensitive resin composition, insulating film for organic electroluminescent element, method for forming the same, and organic electroluminescent device JSR株式会社 2022-10-18 CN disclosed
US-20100215937-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND VARIOUS ARTICLES DERIVED FROM THOSE ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) 2010-08-26 US disclosed
US-20090286015-A1 Curable resin composition, cured product thereof, and various articles derived from those AKAKAWA CHEMICAL INDUSTRIES, LTD (JP) 2009-11-19 US disclosed
CN-101213258-A Curable resin composition, cured product thereof, and various articles derived therefrom ARAKAWA CHEM IND (JP) 2008-07-02 CN disclosed
US-20060159923-A1 Wear-resistant optical layers and moulded bodies LEIBNIZ-INSTITUT FUER NEUE MATERIALIEN GEMEINNUETZIGE GMBH (DE) 2006-07-20 US disclosed
US-6743303-B2 CONTACTING METAL SURFACE WITH ADHESION PROMOTION FORMULATION COMPRISING SULFURIC ACID AND PHOSPHORIC ACID TO FORM A MICRO-ROUGHENED CONVERSION COATED METAL SURFACE, CONTACTING WITH AQUEOUS ORGANOSILICON FORMULATION SHIPLEY COMPANY, L.L.C. 2004-06-01 US disclosed
US-20020132056-A1 Contacting metal surface with adhesion promotion formulation comprising sulfuric acid and phosphoric acid to form a micro-roughened conversion coated metal surface, contacting with aqueous organosilicon formulation SHIPLEY COMPANY, L.L.C. (US) 2002-09-19 US disclosed
US-6147242-A Method of producing silylalkylthiols DEGUSSA-HULS AG (DE) 2000-11-14 US disclosed
EP-1016668-A2 Process for preparing silylalkylthiols Degussa-Hüls Aktiengesellschaft (DE) 2000-07-05 EP disclosed
EP-0471164-B1 Process for the preparation of mercaptosilanes HUELS CHEMISCHE WERKE AG (DE) 1995-11-15 EP disclosed
EP-0471164-A1 Process for the preparation of mercaptosilanes HÜLS AKTIENGESELLSCHAFT (DE) 1992-02-19 EP disclosed