Ammonia Solution, Strong

Ammonia Solution, Strong

SCHEMBL3709480

CCOP(O)(=S)SCC.N

nearest known ligand 0.42

Full drug profile on Sugi Atlas →

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.42
HSD17B10 Q99714 2/20 0.42
CYP3A4 P08684 1/20 0.42
MEN1 O00255 2/20 0.38
KMT2A Q03164 2/20 0.38
TDP1 Q9NUW8 1/20 0.38
TSHR P16473 2/20 0.36
ACHE P22303 1/20 0.33
PPARD Q03181 1/20 0.32
LPAR2 Q9HBW0 3/20 0.31
LPAR3 Q9UBY5 3/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL600224 0.98
Hydrochloric Acid SCHEMBL10902483 0.95 ALDH1A1 (0.42) ALDH1A1HSD17B10CYP3A4MEN1KMT2A
SCHEMBL28392794 0.95 ALDH1A1 (0.42) ALDH1A1HSD17B10CYP3A4MEN1KMT2A
SCHEMBL28263558 0.87 LPAR2 (0.36) ALDH1A1HSD17B10CYP3A4MEN1KMT2A
Ammonia Solution, Strong SCHEMBL11610686 0.82 ALDH1A1 (0.39) ALDH1A1HSD17B10CYP3A4MEN1KMT2A
SCHEMBL28016709 0.81 ALDH1A1 (0.37) ALDH1A1HSD17B10CYP3A4MEN1KMT2A
SCHEMBL10579810 0.80 ALDH1A1 (0.47) ALDH1A1HSD17B10CYP3A4MEN1KMT2A
SCHEMBL4604619 0.79 ALDH1A1 (0.41) ALDH1A1HSD17B10CYP3A4MEN1KMT2A
SCHEMBL10699092 0.79 ALDH1A1 (0.66) ALDH1A1HSD17B10CYP3A4MEN1KMT2A
Potassium SCHEMBL11442510 0.77 ALDH1A1 (0.39) ALDH1A1HSD17B10CYP3A4MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 69 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2026102972-A1 PALLADIUM-PLATED/GOLD-PALLADIUM-PLATED COPPER BONDING WIRE WITH HIGH CORROSION RESISTANCE AND HIGH CONDUCTIVITY, AND PRODUCTION PROCESS THEREFOR 上海万生合金材料有限公司 2026-05-21 WO claimed
CN-119153426-B High corrosion resistance high conductivity palladium plating/gold plating palladium copper bonding wire and production process thereof 上海万生合金材料有限公司 2025-04-11 CN claimed
CN-119153426-A High corrosion resistance high conductivity palladium plating/gold plating palladium copper bonding wire and production process thereof 上海万生合金材料有限公司 2024-12-17 CN claimed
CN-118814174-A Post-pickling lotion applied to fine circuit and application method 南雄市溢诚化工有限公司 2024-10-22 CN claimed
CN-118326465-B Nickel-palladium-gold electroplating surface treatment liquid suitable for packaging substrate 深圳创智芯联科技股份有限公司 2024-08-06 CN claimed
CN-118326465-A Nickel-palladium-gold electroplating surface treatment process formula suitable for packaging substrate 深圳创智芯联科技股份有限公司 2024-07-12 CN claimed
CN-117587471-A Additive plating solution for preventing electroplated copper from falling off of anode film and preparation method thereof 珠海联鼎化工设备有限公司 2024-02-23 CN claimed
CN-117441711-A Aqueous emulsion and production process thereof 山东丰禾立健生物科技有限公司 2024-01-26 CN claimed
US-20150209801-A1 MONOTHIOPHOSPHATE CONTAINING COLLECTORS AND METHODS TEEBEE HOLDINGS PTY LTD (AU) 2015-07-30 US claimed
WO-2014012139-A1 MONOTHIOPHOSPHATE CONTAINING COLLECTORS AND METHODS TEEBEE HOLDINGS PTY LTD (AU) 2014-01-23 WO claimed
US-8425865-B2 Method of synthesizing pyrite nanocrystals THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (US) 2013-04-23 US claimed
WO-2010080487-A1 METHOD OF SYNTHESIZING PYRITE NANOCRYSTALS THE REGENTS OF UNIVERSITY OF CALIFORNIA (US) 2010-07-15 WO claimed
JP-60238375-A None JP disclosed
JP-60081195-A None JP disclosed
WO-2026102972-A1 PALLADIUM-PLATED/GOLD-PALLADIUM-PLATED COPPER BONDING WIRE WITH HIGH CORROSION RESISTANCE AND HIGH CONDUCTIVITY, AND PRODUCTION PROCESS THEREFOR 上海万生合金材料有限公司 2026-05-21 WO disclosed
CN-120089748-A Preparation method of three-dimensional current collector for lithium metal battery 哈尔滨工业大学 2025-06-03 CN disclosed
US-5480947-A N-METHYLOL DIGUANAMINES MITSUI TOATSU CHEMICALS, INC. (JP) 1996-01-02 US disclosed
EP-0612797-A2 Modification method of resins MITSUI TOATSU CHEMICALS, Inc. (JP) 1994-08-31 EP disclosed
JP-S60238375-A AQUEOUS INK COMPOSITION FOR BALL-POINT PEN PILOT INK CO LTD 1985-11-27 JP disclosed
JP-S6081195-A 1,2,3,4-TETRAHYDRO-2-QUINOXALINONE DERIVATIVE, PRODUCTION THEREOF AND HERBICIDE CONTAINING THE SAME AS ACTIVE CONSTITUENT SUMITOMO CHEM CO LTD 1985-05-09 JP disclosed